• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.12
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• pp.15-19
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• 2016

The gate bias dependence of kink phenomenon with a large deviation from the resistance circle in Smith chart is observed in the frequency response of $S_{11}$-parameter for large multi-finger RF MOSFETs. For the first time, this bias dependence is analyzed by measuring magnitude and phase of $S_{11}$-parameter, input resistance and input capacitance. As a result, $V_{gs}$ dependent $S_{11}$-parameter is largely changed by the magnitude of input capacitance as well as dominant pole and zero frequencies of input resistance. At $V_{gs}=0V$, the kink phenomenon occurs in the high frequency region because of very small phase difference of $S_{11}$-parameter and high pole frequency of input resistance. However, the kink phenomenon at higher $V_{gs}$ is generated in the low frequency region owing to large phase difference and low pole frequency.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.5
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• pp.1038-1043
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• 2003

A capacitive-coupled configuration MEMS switch is designed and fabricated, and its characteristics are measured. Low actuation voltage has been achieved by means of small distance between signal line and membrane. Minimum actuation voltage is about 11V. Isolation is around 40dB and insertion loss is about 0.2dB at 2GHz.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.7
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• pp.527-534
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• 1998

Thin film deposition of InN, which is a less-studied III-nitride compound semiconductor because of the difficulty if crystal growth, was performed by rf reactive sputtering method using In target and $N_2$reactive gas. The structrual, electrical, and optical properties of the produced films were measured and disussed according to the sputtering parameters such as deposition pressure, rf power, and substrate temperature. From the result of deposition pressure, rf power, and substrate temperature, we could obtain optimal conditions of 5m Torr, 60W, $60^{\circ}C$ for preparing InN thin film with high crystallinity, low carrier concentration, and high Hall mobility. The carrier concentration, Hall mobility, and optical bandgap of the fabricated InN thin films at optimal condition were $6.242\times10^{18}cm^{-3}, 212.526cm^2/V\cdot$ｓ, and 1.912eV, respectively.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.6
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• pp.43-48
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• 2006

In this paper, the rectenna converting 2.45[GHz] microwave into DC power is designed and fabricated for wireless power transmission using microwave and the methode for impedance matching and tuning are proposed in order to maximize RF-DC conversion efficiency. The fabricated rectenna can be easily tuned by using a broad open stub and has the RF-DC conversion efficiency up to 59[%] when the 5[dBm] input power is applied. The 2.2[V], 1.5[mW] DC level, in the 1[m] distance between the transmitter and the receiver can be obtained and this value is avaliable in the small power digital system.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.12
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• pp.242-246
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• 2012

This paper presents an integrated low noise and highly linear wideband RF front-end for a digital terrestrial and cable TV tuner, which are used as a part of double-conversion TV tuner. The low noise amplifier (LNA) has a low noise figure and high linearity by adopting a noise canceling technique based on current amplification. The up-conversion mixer and SAW buffer have high linearity by employing a third order intermodulation cancellation technique. The proposed RF front-end is designed in a $0.18{\mu}m$ CMOS and draws 60 mA from a 1.8 V supply voltage. The RF front-end shows a voltage gain of 30 dB, an average single side-band noise figure of 4.2 dB, an IIP2 of 40 dBm, and an IIP3 of -4.5 dBm for the entire band from 48 MHz to 862Hz.

• Journal of Sensor Science and Technology
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• v.4 no.2
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• pp.58-63
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• 1995

The effects of substrate temperature, RF power, and $NH_{3}/SiH_{4}$ gas flow ratio on the dielectric constant and optical bandgap of amorphous silicon nitride (a-SiNx:H) thin films prepared by PECVD method using RF glow discharge decomposition of $SiH_{4}$ and $NH_{3}$ gas mixtures have been studied. The dielectric constant and optical bandgap of a-SiNx:H thin films were greatly exchanged as by increasing substrate temperature, RF power, and $NH_{3}/SiH_{4}$ gas flow ratio. The dielectric constant of a-SiNx:H films was increased and optical bandgap of a-SiNx:H films was decreased as the substrate temperature was increased. When the substrate temperature, RF power, gas pressure, $NH_{3}/SiH_{4}$ gas flow ratio, and thickness were $250^{\circ}C$, 20 W, 500 mTorr, 10 and $1500\;{\AA}$, respectively, the dielectric constant, breakdown field and optical bandgap of a-SiNx:H film were 4.3, 1 MV/cm, and 2.9 eV, respectively.

• Transactions on Electrical and Electronic Materials
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• v.4 no.3
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• pp.5-9
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• 2003

In this paper, a layout-based CMOS RF model for RFIC's including the capacitance effect, the skin effect, and the proximity effect between metal lines on the Si surface is proposed for the first time for accurately predicting the RF behavior of CMOS devices. With these RF effects, the RF equivalent circuit model based on the layout of the multi-finger gate transistor is presented. The capacitances between metal lines on the Si surface are modeled with the layout. And the skin effect is modeled to the equivalent ladder circuit of metal line. The proximity effect is modeled by adding the mutual inductance between cross-coupled inductances in the ladder circuit representation. Compared to the BSIM 3v3 and other models, the proposed RF model shows better agreements with the measured data and shows well the frequency dependent behavior of devices in GHz ranges.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.421-422
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• 2008

In this paper, CMOS RF front-end circuits for an L1/L5 dual-band global positioning system (GPS)/Galileo receiver are designed in $0.13\;{\mu}m$ CMOS technology. The RF front-end circuits are composed of an RF single-to-differential low noise amplifier, an RF polyphase filter, two down-conversion mixers, two transimpedance amplifiers, a IF polyphase filter, four de-coupling capacitors. The CMOS RF front-end circuits provide gains of 43 dB and 44 dB, noise figures of 4 dB and 3 dB and consume 3.6 mW and 4.8 mW from 1.2 V supply voltage for L1 and L5, respectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.5A
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• pp.482-489
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• 2010

In this paper we have proposed a new architecture of DQ-IRM(Double-Quadrature Image Rejection Mixer) for image rejection in the low-IF receiver. It consist of a frequency-tunable RF PPF(Poly Phase Filter) and the quadrature mixers. The conventional DQ-IRM generates the quadrature RF signals for the RF wide band at once. But the proposed DQ-IRM with the frequency-tuable RF PPF generates the quadrature RF signals for the narrow band of 2~3 channels bandwidth, which is partitioned from the RF wide band. We designed the CMOS RF tuner for T-DMB(Terrestrial Digital Multimedia Broadcasting) with the proposed 3rd DQ-IRM using a 0.18um CMOS technology and verified the performances of the designed receiver such as the image rejection ratio, the noise figure and the power consumption. The overall NF of the RF tuner is about 1.26 dB and the image reject ratio is about 51 dB. The power consumption is 55.8 mW at 1.8 V supply voltage. The chip area is $3.0{\times}2.5mm^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.2
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• pp.93-100
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• 2009

This paper presents a step up four channel DC-DC converter using charge pump voltage doubler structure. Our goal is to design and implement DC-DC converter for capacitive SP4T RF MEMS switch in front end module in wireless transceiver system. Charge pump structure is small and consume low power 3.3V input voltage is boosted by DC-DC Converter to $11.3{\pm}0.1V$, $12.4{\pm}0.1V$, $14.1{\pm}0.2V$ output voltage With 10MHz switching frequency. By using voltage level shifter structure, output of DC-DC converter is selected by 3.3V four channel selection signals and transferred to capacitive MEMS devices. External passive devices are not used for driving DC-DC converter. The total chip area is $2.8{\times}2.1mm^2$ including pads and the power consumption is 7.52mW, 7.82mW, 8.61mW.