• Title/Summary/Keyword: R-package

Search Result 546, Processing Time 0.024 seconds

A Study on Family Conflict and Life Satisfaction for Immigrant Women (국제결혼 이주여성의 가족갈등과 생활만족도에 관한 연구)

  • Park, Jung-Sook;Kim, Jin-Hee;Park, Ok-Im
    • Journal of Families and Better Life
    • /
    • v.25 no.6
    • /
    • pp.59-70
    • /
    • 2007
  • The purpose of this study was to examine the differences among families in terms of conflict, life satisfaction according to socio-demographic variables, and self-esteem, and to analyze the effects of these variables influencing marital satisfaction for immigrant women. The subjects of this study were 127 immigrant women in Sunchon. Trained researchers interviewed the subjects with structured questionnaires. The data were analyzed using Cronbach's ${\alpha}$, frequency, percentage, mean, standard deviation, ANOVA, Duncan's test, Pearson's r, and stepwise multiple regression. The statistical package of SPSS is used to perform these analyses. The result of this study is summarized as follows: The family conflict scores of the immigrant women were lower than the median. The average score of life satisfaction was higher than the median. The family conflict of the immigrant women showed significant differences according of age.

CAD Data Exchange among Different Commercial Packages (이 기종 시스템간의 CAD 데이터 교환)

  • Kim, Tae-Wook;Hwang, Byeong-eok
    • Journal of the Korean Society of Industry Convergence
    • /
    • v.7 no.4
    • /
    • pp.377-382
    • /
    • 2004
  • This research was about implementing STEP for data exchange among different commercial package(CAD system). STEP was used to share CAD data as follows. ST-Developer implement Solid model was used with a physical file of STEP and represented in a CAD system. And then STEP conversion utility was used to make a neutrality format form in a component modeling. Analysis of Solid model was made possible for CAD system to read in and analyzed Solid model. This research are summarized as follows 1. A basis Model development used Visual C++ for a neutrality data of a programming interface general-use CAD system, and produced Box and Cylinder to a physical file, the result was implemented this in a programming interface to general-use CAD system, it is represented in CAD system as identical one modeling object. 2. STEP was used in different CAD system to utilize to its of each CAD system maximum, CATIA V5R9 user was able to analyze MDT 6 Modeling Arm. 3. STEP was used able to interpret and remodel the existing Solid model.

  • PDF

Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals

  • Gutmann, R.J.;Zeng, A.Y.;Devarajan, S.;Lu, J.Q.;Rose, K.
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.4 no.3
    • /
    • pp.196-203
    • /
    • 2004
  • A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

Mold-Flow Simulation in 3 Die Stack Chip Scale Packaging

  • Rhee Min-Woo
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2005.09a
    • /
    • pp.67-88
    • /
    • 2005
  • Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.

  • PDF

Optimal Water-cooling Tube Design for both Defect Free Process Operation and Energy Minimization in Czochralski Process (무결정결함영역을 유지하면서 에너지를 절감하는 초크랄스키 실리콘 단결정 성장로 수냉관 최적 설계)

  • Chae, Kang Ho;Cho, Na Yeong;Cho, Min Je;Jung, Hyeon Jun;Jung, Jae Hak;Sung, Su Whan;Yook, Young Jin
    • Current Photovoltaic Research
    • /
    • v.6 no.2
    • /
    • pp.49-55
    • /
    • 2018
  • Recently solar cell industry needs the optimal design of Czochralski process for low cost high quality silicon mono crystalline ingot. Because market needs both high efficient solar cell and similar cost with multi-crystalline Si ingot. For cost reduction in Czochralski process, first of all energy reduction should be completed because Czochralski process is high energy consumption process. For this purpose we studied optimal water-cooling tube design and simultaneously we also check the quality of ingot with Von mises stress and V(pull speed of ingot)/G(temperature gradient to the crystallization) values. At this research we used $CG-Sim^{(R)}$ S/W package and finally we got improved water-cooling tube design than normally used process in present industry. The optimal water-cooling tube length should be 200mm. The result will be adopted at real industry.

Squeezing Flow of Micropolar Nanofluid between Parallel Disks

  • Khan, Sheikh Irfanullah;Mohyud-Din, Syed Tauseef;Yang, Xiao-Jun
    • Journal of Magnetics
    • /
    • v.21 no.3
    • /
    • pp.476-489
    • /
    • 2016
  • In the present study, squeezing flow of micropolar nanofluid between parallel infinite disks in the presence of magnetic field perpendicular to plane of the disks is taken into account. The constitutive equations that govern the flow configuration are converted into nonlinear ordinary differential with the help of suitable similarity transforms. HAM package BVPh2.0 has been employed to solve the nonlinear system of ordinary differential equations. Effects of different emerging parameters like micropolar parameter K, squeezed Reynolds number R, Hartmann number M, Brownian motion parameter Nb, thermophoresis parameter Nt, Lewis number Le for dimensionless velocities, temperature distribution and concentration profile are also discussed graphically. In the presence of strong and weak interaction (i.e. n = 0 and n = 0.5), numerical values of skin friction coefficient, wall stress coefficient, local Nusselt number and local Sherwood number are presented in tabulated form. To check the validity and reliability of the developed algorithm BVPh2.0 a numerical investigation is also a part of this study.

A Study on the Factors Affecting the Intention to Use of Smart Tolling Service (스마트톨링 서비스 이용의도에 영향을 미치는 요인에 관한 연구)

  • Hur, Seong-Il;Choi, Jeongil;Han, Kyeong-Seok
    • Journal of Information Technology Services
    • /
    • v.17 no.3
    • /
    • pp.139-156
    • /
    • 2018
  • Smart tolling, which improved the drawbacks of the existing high-pass system, was developed and built through the Smart Highway R & D project in 2007. In order to successfully introduce and spread Smart Tolling, it is need to analyze factors that affected by intent to use. This study conducted research based on literature studies and empirical studies, and developed a research model to analyze factors affecting the users' intention of smart tolling system based on technology acceptance model (TAM) and value based acceptance model. The main variables of the research model are service characteristics (convenience, reliability), technical characteristics (flexibility, stability), environmental characteristics (switching cost, effectiveness of policy) and intention to use. To test the hypotheses set in this study, frequency analysis, exploratory factor analysis, and confirmatory factor analysis were performed using the SPSS 22.0 program statistical package and AMOSS 18.0. The convenience and reliability presented by service characteristics did not affect the intention to use of smart tolling service.

Exploring the Factors Influencing Attitudes Toward Withdrawal of Life-sustaining Treatment in Adolescents (청소년의 연명치료중단에 대한 태도에 영향을 미치는 요인)

  • Lee, Insook;Kim, Kyeong Ja
    • Journal of Home Health Care Nursing
    • /
    • v.27 no.1
    • /
    • pp.82-91
    • /
    • 2020
  • Purpose: This study aimed to explore the factors influencing attitudes toward withdrawal of life-sustaining treatment (WLST) in adolescents. Methods: This study used a descriptive research design. A structured questionnaire was administered to 185 adolescents. Data were analyzed based on t-tests, analysis of variance, Pearson's correlation coefficient, and multiple regression using the IBM SPSS 20.0. Statistical package. Results: There was a negative correlation between attitudes toward WLST and respect for life (r=-.188, p=.010). Knowing about life-sustaining treatment (β=-0.30, p<.001), experience of WLST education (β=0.21, p=.003), experience of respect for life education (β=-0.16, p=.021), and experience of death (family or acquaintance) (β=-0.13, p=.039) explained 16.7% (F=8.39, p<.001) of the variance in attitudes toward WLST. The respect for life did not affect attitudes toward WLST (β=-0.07, p=.347). Conclusion: The study findings suggest that WLST in adolescents is different from that of adults. Further research is needed to develop strategies for sound and positive attitudes toward WLST in adolescents.

MAGFET Hybrid IC with Frequency Output (주파수 출력을 갖는 MAGFET Hybrid IC)

  • Kim, Si-Hon;Lee, Cheol-Woo;Nam, Tae-Chul
    • Journal of Sensor Science and Technology
    • /
    • v.6 no.3
    • /
    • pp.194-199
    • /
    • 1997
  • When voltage or current gets out of the magnetic sensor as it is, we have often faced the problems such as introduction of noise and loss of voltage. In order to reduce these problems, a 2 drain MAGFET operating in the saturation region and fabricated by CMOS process, the system of I/V converter, VCO with operational amplifier, and V/F conversion circuits with Schmitt Trigger are designed and fabricated in one package. The absolute sensitivity of magnetic sensor shows 1.9 V/T and the product sensitivity is $3.2{\times}10^{4}\;V/A{\cdot}T$. The characteristic of V/F conversion is very stabilized and has the value of 190 kHz/T.

  • PDF

Effects of Vibration Fatigue on Compression Strength of Corrugated Fiberboard Containers for Packaging of Fruits during Transport

  • Jung, Hyun-Mo;Park, Jeong-Gil
    • Journal of Biosystems Engineering
    • /
    • v.37 no.1
    • /
    • pp.51-57
    • /
    • 2012
  • Purpose: The compression strength of corrugated fiberboard containers used to package agricultural products rapidly decreases owing to various environmental factors encountered during the distribution of unitized products. The main factors affecting compression strength are moisture absorption, long-term top load, and fatigue caused by shock and vibration during transport. This study characterized the durability of corrugated fiberboard containers for packaging fruits and vegetables under simulated transportation conditions. Methods: Compression tests were done after corrugated fiberboard containers containing fruit were vibrated by an electro-dynamic vibration test system using the power spectral density of routes typically traveled to transport fruits and vegetables in South Korea. Results: To predict loss of compression strength owing to vibration fatigue, a multiple nonlinear regression equation ($r^2=0.9217$, $RMSE=0.6347$) was developed using three independent variables of initial container compression strength, namely top stacked weight, loading weight, and vibration time. To test the applicability of our model, we compared our experimental results with those obtained during a road test in which peaches were transported in corrugated containers. Conclusions: The comparison revealed a highly significant ($p{\leq}0.05$) relationship between the experimental and road-test results.