• Title/Summary/Keyword: R&D characteristics

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Problems with Agricultural Research and Development in Korea and Improvement Strategies Based on Foreign Examples with a Focus on the Ministry of Agriculture and the Rural Development Administration

  • Kang, Chung Han;Moon, Jung Hun;Kim, Nam Jung;Yun, Young Duk;Lee, Sung Chul
    • Agribusiness and Information Management
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    • v.3 no.1
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    • pp.38-66
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    • 2011
  • The dissemination process of agricultural research and development (R&D) results has somewhat different characteristics from that of typical R&D results. However, these characteristics are not adequately considered on the basis of an examination of the current performance system, the resulting management plans, and strategies for the application and dissemination of the results of agricultural R&D in Korea. The performance evaluation indicator exposed the problem of the inadequate consideration of the characteristics of each of these areas, particularly the lack of unified R&D-related institutions and the inadequacy of the system to monitor outcomes. To address these shortcomings in the agricultural R&D programs in Korea, the policies pertaining to agricultural R&D performance, results management, and dissemination in the U.S. and Japan were examined. Based on these investigations, we proposed strategies to improve the agricultural R&D policies in Korea.

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A new approach to the current regulator design of LED strings based on current mirror

  • Kim, Pu-Jin;Yoo, Min-Ki;Lee, Rok-Hee;Lee, Koo-Hwa;Jang, Kyeong-Kun;Kang, Sin-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.837-840
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    • 2008
  • This paper studies the current regulator of LED Backlighting system for LCD. The proposed regulator and a typical regulator are introduced. To find out the characteristics of two regulators, Prototype samples of LED Backlighting system are made. Both the proposed regulator and a typical regulator are compared with electrical, thermal and optical characteristics each viewpoint.

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Analysis of R&D Efficiency according to the Characteristics of National Research Projects in Culture Technology Sector (문화기술(CT) 분야 국가연구과제 특성에 따른 R&D 효율성 분석)

  • Yoon, Sangpil;Son, Hosung
    • The Journal of the Korea Contents Association
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    • v.22 no.5
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    • pp.383-392
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    • 2022
  • Culture technology is contributing to the creation of new values through convergence with other industries. The government is also actively investing in R&D in this field to secure competitiveness. In this study, the R&D efficiency of culture technology is analyzed by characteristics. Data envelopment analysis and non-parametric tests are performed on 968 national research projects in 2016-2019. As a result, it is confirmed that there are a difference in R&D efficiency according to the characteristics of national research projects in culture technology sector. This suggests that when planning national research projects for culture technology, these characteristics should be taken into consideration and strategically promoted.

New Cu Process and Short Channel TFT

  • Yang, J.Y.;Hong, G.S.;Kim, K.;Bang, J.H.;Ryu, W.S.;Kim, J.O.;Kang, Y.K.;Yang, M.S.;Kang, I.B.;Chung, I.J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1189-1192
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    • 2009
  • Short channel a-Si:H TFT devices with Cu electrodes have been investigated. Short channel TFTs are defined by new plasma etch process. When the channel length becomes shorter, the TFT characteristics (threshold voltage, off current, sub threshold voltage, etc.,) are degraded. These degraded characteristics can be improved through the hydrogen plasma treatment and new gate insulator structure. Using these processes, 15.0 inch XGA LCD panel was fabricated successfully where the channel length of the TFT devices was about 2.5 micrometers.

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Characteristics of a-Si:H TFTs with Silicon Oxide as Passivation Layer

  • Chae, Jung-Hun;Jung, Young-Sup;Kim, Jong-Il;Kim, Chang-Dong;Chung, In-Jae
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.940-943
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    • 2005
  • The characteristics of a-Si:H TFTs with silicon oxide as passivation layer were reported. It was studied that the insulating characteristics and step coverage characteristics of low temperature silicon oxide before applying to a-Si:H TFT fabrications. With the optimum deposition conditions considering electrical and deposition characteristics, low temperature silicon oxide was applied to a-Si:H TFTs. The changes in characteristics of a-Si:H TFTs were analyzed after replacing silicon nitride passivation layer with low temperature silicon oxide layer. This low temperature silicon oxide can be adapted to high resolution a-Si:H TFT LCD panels.

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Relation between Ramp-reset and Barrier Rib Height in AC PDP cells

  • Lee, Y.J.;Lee, S.K.;Kim, W.J.;Kim, Y.D.;Kim, M.S.;Moon, S.J.;Kwon, Y.H.;Yoo, S.J.;Kim, J.D.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.75-78
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    • 2002
  • Difference in the structure of AC PDP cells makes the cells have various discharge characteristics. Therefore, a ramp-reset must be adjusted for the stable driving of AC PDP. If any ramp-reset can reduce the difference in discharge characteristics between cells, the conditions of the address discharge could become almost the same. It is very important to understand these to design a good driving waveform. In this paper, we proved the mentioned facts with the change of barrier rib heights.

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Transfer Characteristics of Poly-Si TFTs with Laser Energy Change

  • You, Jae-Sung;Kim, Young-Joo;Jung, Yun-Ho;Seo, Hyun-Sik;Kang, Ho-Chul;Lim, Kyong-Moon;Kim, Chang-Dong
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.401-404
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    • 2004
  • Transfer characteristics of poly-Si TFTs within process window of laser energy are investigated. In terms of surface morphology and transfer characteristics, process window of laser crystallization is evaluated. While maximum mobility exists in lower edge of process window in n-channel TFTs, maximum mobility exists in higher edge of process window in p-channel TFTs.

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Data Retention Time and Electrical Characteristics of Cell Transistor According to STI Materials in 90 nm DRAM

  • Shin, S.H.;Lee, S.H.;Kim, Y.S.;Heo, J.H.;Bae, D.I.;Hong, S.H.;Park, S.H.;Lee, J.W.;Lee, J.G.;Oh, J.H.;Kim, M.S.;Cho, C.H.;Chung, T.Y.;Kim, Ki-Nam
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.2
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    • pp.69-75
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    • 2003
  • Cell transistor and data retention time characteristics were studied in 90 nm design rule 512M-bit DRAM, for the first time. And, the characteristics of cell transistor are investigated for different STI gap-fill materials. HDP oxide with high compressive stress increases the threshold voltage of cell transistor, whereas the P-SOG oxide with small stress decreases the threshold voltage of cell transistor. Stress between silicon and gap-fill oxide material is found to be the major cause of the shift of the cell transistor threshold voltage. If high stress material is used for STI gap fill, channel-doping concentration can be reduced, so that cell junction leakage current is decreased and data retention time is increased.