• 대한안전경영과학회지
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• 제24권3호
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• pp.93-103
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• 2022

This study investigated the method of continuous improvement of small-medium company production processes through POSCO's QSS(Quick Six Sigma) activities. QSS is a field operation technique that encompasses the advantages of Six Sigma, TPS(Toyota Production System), TQM (Total Quality Management), and IE(Industrial Engineering). Through this, POSCO not only encourages activities centered on related small and medium-sized partners, etc., but is also expected to contribute to the continuous improvement of the company's own production process through QSS activities. In this study, rather than unconditionally carrying out activities according to the needs of large companies, the research is to help the continuous improvement of the actual production process of small and medium-sized enterprises by effectively applying and spreading QSS activities in consideration of the characteristics and environment of the company. For this purpose, empirical research is conducted on the process improvement activities and QSS activities of company Y, which has less than 100 assembly and production quality and inspection processes among SMEs. The changes in the production process improvement of SMEs through the application of the final QSS were investigated through empirical studies.

• 무역학회지
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• 제46권5호
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• pp.195-211
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• 2021

The purpose of this study is to examine the relationship among innovation activities, innovation performance, and management performance of export firms. I first undertake a review of previous studies related to innovation activity, innovation performance, and export firms' innovation. Based on this, I set up a research model and hypotheses. First, The innovation activity is classified into product innovation activity, process innovation activity, and administrative innovation activity. Innovation performance is divided into product quality improvement and cost reduction. And the business performance is regarded as financial performance of export's firms. This study examined whether innovation activity affect innovation performance such as product quality improvement and cost reduction. In addition, I examined whether these innovation performance affects business performance (financial performance). To achieve this, a total of 368 questionnaires are used in this study and PLS (Partial Least Square) was used to analyze structural equation. As a result, this study shows that product innovation activity have a positive effect on product quality improvement, and process innovation activity also have a positive effect on product quality improvement. However, it was found that neither product innovation activity nor process innovation activity had an effect on cost reduction. And it was found that administrative innovation did not affect product quality improvement, but had a positive effect on cost reduction. Also, it was found that quality improvement, which is an innovation performance, did not affect the financial performance of export's firms, and cost reduction, which is an innovation performance, had a positive effect on the financial performance of the export's firms.

• 품질경영학회지
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• 제42권4호
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• pp.633-646
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• 2014

Purpose: The conventional predicted MFTBF by military standard has a wide discrepancy to that of real-world operation, which leads to overstock and increase operation cost. This paper introduces a analyzing frame using operational reliability and cost data to overcome the discrepancy, and provides reliability improvement process employing the analyzing frame. Methods: This paper suggests Reliability-Cost Matrix (R-C Matrix) and Operational Reliability & Cost Index (ORCI) as a tool for reliability evaluation. Results: KOREIP(KAI's Operational Reliability Evaluation and Improvement Process) is developed employing Reliability-Cost Matrix and Operational Reliability & Cost Index. Conclusion: KOREIP provides a process and its activities based on Reliability-Cost Matrix frame. The process and activities leads reliability improvement of aerospace electronic equipments by means of categorizing and follow-up action based on the concept of frame.

• 한국정보시스템학회:학술대회논문집
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• 한국정보시스템학회 2001년도 추계학술대회 발표논문집:차세대 전상거래 시대의 비즈니스전략
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• pp.438-450
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• 2001

This study is to classify the typology of e-business model based on the practical strategic model for successful e-business implementation. For that purpose, we review the conceptual framework of e-business and collected the data from 127 companies implementing e-business. The study is conducted in three phases as follows. First, six factors consisted of 22 items are derived through factor analysis. Second, Cluster analysis is employed to group the firms into different strategic patterns. A five-cluster solution is found to maximize the distances between cluster means across the six factor patterns. The models are named as 'ascendancy and convergence', 'expansion and moderate price', 'expansion and improvement of quality', 'ascendancy and process', and 'improvement of quality' respectively. Third, ANOVA is used to examine the impact on the performance differences attributable to the models. The results of the study are; (1) the 'ascendancy and process', 'expansion and improvement of quality' and 'expansion and moderate price' models were associated with significantly higher performance levels than the 'improvement of quality' model, and (2) the hybrid strategies are needed to implement e-business successfully based on the 'ascendancy and process' model.

• 디지털산업정보학회논문지
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• 제9권3호
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• pp.195-209
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• 2013

Purpose of this study is to empirically consider relation between QM activity factor and management result. For this, following 6 major variables of QM activity were established as independent variable; CEO's leadership, communication, process control, standardization, full participation and education/training while satisfaction of members and improvement of quality were established as dependent variable. And, a model was set up and hypothesis verification was conducted on the basis of data collected through questionnaires. The results are summarized as follows; First, QM factors which influenced satisfaction of members in management result were CEO's leadership, communication, process control, full participation and education/training but 'standardization' factor was not statistically significant. Second, QM factors which influenced improvement of quality in management result were CEO's leadership, communication, standardization, full participation and education/training but 'process control' factor was not statistically significant. Third, among main factors of QM activity, the factor which preferentially influenced satisfaction of members was 'full participation' factor while the factor which preferentially influenced improvement of quality was 'standardization' factor. According to such results, it is required to seek a statistical method regarding QM activity with focus on the factor of 'full participation' and 'standardization' among other things for the purpose of satisfaction of members as well as improvement of quality. It is believed that implication of this study can be useful information to realize management result considering main factors of QM activity and that it also can be basic reference data to seek a statistical method for satisfaction of members and improvement of quality by grasping core factors having influence over QM activity.

• 마이크로전자및패키징학회지
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• 제12권4호통권37호
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• 품질경영학회지
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• 제15권2호
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• pp.20-26
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• 1987

An algorithm for the minimum total process percent defective under marginal costs is presented. Initial process is single series system, which is constructed by k process units, and each process is considered priority. Minimum of total process percent defective for parallel-series system exists when additional process setup costs are larger than marginal costs.

• 대한산업공학회지
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• 제32권4호
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• pp.298-313
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• 2006

Six sigma is focused on quality improvement through variation reduction, while lean is on process flow improvement and lead time reduction by waste elimination. However, lean cannot bring a process under statistical control and six sigma alone cannot dramatically improve process speed. Lean six sigma was developed to achieve faster rate of improvement in customer satisfaction, cost, quality, process speed, and invested capital. In this paper we present the importance of using value stream mapping and suggest a guideline on how to integrate lean and six sigma by is proposed.

• Asia pacific journal of information systems
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• 제14권4호
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• pp.23-47
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• 2004

This study was tried for the improvement of software process ability of the software firms, and analyzed empirically the impact that a software process infrastructure level influences on the software process level and process performance. The questionnaire were developed and data were collected from the process improvement correspondences or project quality managers of the 78 software firms. The result was shown that management-organization infrastructure was composed of software process improvement organization's role and activity, process standard and education, management system and supporting, management guides and procedures. And organization's standard development procedure or criteria, process asset, process support tools were included in technical infrastructure. This study provides that some components of software process infrastructure had an significant influence on the process level, process infrastructure management level, and software process performance.

• 정보처리학회논문지D
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• 제13D권4호
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• pp.625-632
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• 2006

운영 서버의 데이터에서 다양한 분석 정보를 추출하여 저장하는 의사결정지원시스템인 데이터웨어하우스는 데이터의 품질과 대용량의 데이터를 처리하기 위한 처리 시간이 매우 중요하다. 따라서 데이터의 품질 안정화와 생산성 향상을 위해 개발 프로세스를 표준화하고 개선할 필요가 있다. 본 연구에서는 소프트웨어 프로세스 향상모델인 CMMI의 형상관리를 적용하여 개선된 데이터웨어하우스 개발 프로세스를 제안한다. 또한 개선된 개발 프로세스를 평가하기 위해 프로세스 평가 척도를 제시하고, 기존의 개발 프로세스와 비교하여 본 연구의 제안이 처리시간 감소에 따른 비용의 절감과 생산성의 향상을 지원하고, 품질의 향상과 재작업비율을 개선시켰음을 보인다.