• Journal of the Korean institute of surface engineering
• /
• v.49 no.5
• /
• pp.401-407
• /
• 2016

In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2012.11a
• /
• pp.136-136
• /
• 2012

Cu 박막이 pyrophosphate baths로부터 전기도금공정에 의해 제조되었으며, 전류밀도 및 도금온도가 Cu 박막의 특성에 미치는 영향을 조사하였다. 전류 밀도 및 도금온도 모두 전류효율, 잔류응력, 표면형상, 미세조직에 상당한 영향을 미쳤음을 알 수 있었다.

• Korean Journal of Materials Research
• /
• v.11 no.10
• /
• pp.820-832
• /
• 2001

In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2016.11a
• /
• pp.194.1-194.1
• /
• 2016

The present study investigated the effect of zincate treatment time on the dissolution behavior and the deposition of copper by immersion process and electroplating process on AZ31 Mg alloy substrate in a copper pyrophosphate bath. Without zincate pretreatment, the AZ31 Mg substrate quickly dissolved in the copper pyrophosphate solution although an external cathodic current was applied. The copper layers deposited on non-zincate treated AZ31 Mg alloy substrate by both immersion and electroplating processes showed very porous structure and very poor adhesion. With increasing zincate treatment time up to 2 min, the dissolution of AZ31 substrate in pyrophosphate solution rapidly decreased and the deposited copper layer was less porous and exhibited stronger adhesion. The immersion of AZ31 Mg sample in zincate solution for 5 min was found as a critical time for producing a non-porous and adherent electrodeposited copper layer on AZ31 Mg alloy. The optimum zincating time can be determined by observing the open circuit potential (OCP) of AZ31 Mg alloy samples in a copper pyrophosphate electroplating bath. The OCP reached a stable value of about -0.10 V (vs. SCE) after 5 min of immersion in the copper pyrophosphate electroplating solution.

• Journal of the Korean institute of surface engineering
• /
• v.19 no.4
• /
• pp.140-148
• /
• 1986

Using sodium pyrophoshate as complexing agent, the characteristics and the magnetic properties of the films deposited from electroless cobalt plating bath have been studied. The result obtained are as following; 1. It was found that the optimum bath compositions consisted of 0.1M cobalt sulfate, 0.2M sodium hypophosphite as reducing agent, 0.4M sodium pyrophosphate as complexing agent and 0.5M ammonium sulfate as buffer agent, whereas good operating conditions were the bath of pH 10.5 adjusted with ammonia and 70$^{\circ}C$ of bath temperature, respectively. 2. The coercive force and the squareness of magnetic films were increased with deposition from the low temperature bath. 3. The phosphorous content in Co-P films deposited from these bath was relatively higher than that from Brenner bath. It was assumed to be due to codeposition of phosphorous from the pyrophosphate anion in the solution.

• Korean Journal of Metals and Materials
• /
• v.48 no.3
• /
• pp.218-224
• /
• 2010

Direct copper electroplating on Mg alloy AZ31B was carried out in a traditional pyrophosphate copper bath containing potassium fluoride. Electrochemical impedance spectroscopy and polarization methods were used to study the effects of added potassium fluoride on electrochemical behavior. The chemical state of magnesium alloy in the electroplating bath was analyzed by X-ray photoelectron spectroscopy. Adhesion of the copper electroplated layer was also tested. Due to the added potassium fluoride, a magnesium fluoride film was formed in the pyrophosphate copper bath. This fluoride film inhibits dissolution of Mg alloy and enables to electroplate copper directly on it. A dense copper layer was formed on the Mg alloy. Moreover, this copper layer has a good adhesion with Mg alloy substrate.

• Journal of the Korean institute of surface engineering
• /
• v.53 no.4
• /
• pp.190-199
• /
• 2020

Copper pyrophosphate baths were employed in order to study the dependencies of current efficiency, residual stress, surface morphology and microstructure of electrodeposited Cu thin layers on applied current density. The current efficiency was obtained to be more than about 90 %, independent of the applied current density. Residual stress of Cu electrodeposits was measured to be in the range of -30 MPa and 25 MPa with the increase of applied current density from 0.5 to 15 mA/㎠. Relatively smooth surface morphologies of the electodeposited Cu layers were obtained at an intermediate current range between 3 and 4 mA/㎠. The Cu electrodeposits showed FCC(111), FCC(200), and FCC(220) peaks and any preferred orientation was not observed in this study. The average crystalline size of Cu thin layers was measured to be in the range of 44~69 nm.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2000.05a
• /
• pp.57-58
• /
• 2000

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2000.11a
• /
• pp.75-76
• /
• 2000

• Journal of the Korean institute of surface engineering
• /
• v.26 no.3
• /
• pp.143-148
• /
• 1993

Composition and microstructures of Silver-Tin alloy deposits from a pyrophosphate bath were studied under the D.C. electrolysis conditions. Cathode current efficiency and throwing power of alloy deposits de-creased with increasing current density. Tin content of Ag-Sn alloy deposits decreased noticeably with the cur-rent density and with decreasing pH. The preferred orientation of the deposits tended to change in sequence of (110)longrightarrow(111)longrightarrow(100) texture with increasing the cathode overpotential. The surface structure of alloy deposits showed the smooth surface structure with fine crystallites.