Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Electroplating on Magnesium Alloy in KF-Added Pyrophosphate Copper Bath

불화칼륨이 첨가된 피로인산구리 도금욕에서 마그네슘합금의 전기도금

  • Lee, Jung Hoon (Department of Materials Science and Engineering, Pusan National University) ;
  • Kim, Yong Hwan (BK21 Innovative Graduate Education Program for Advanced Materials of Transportation System, Pusan National University) ;
  • Jung, Uoo Chang (Korea Institute of Industrial Technology) ;
  • Chung, Won Sub (Department of Materials Science and Engineering, Pusan National University)
  • 이정훈 (부산대학교 재료공학과) ;
  • 김용환 (부산대학교 BK21 수송기계 첨단 부품소재 연구인력양성 사업단) ;
  • 정우창 (한국생산기술연구원) ;
  • 정원섭 (부산대학교 재료공학과)
  • Received : 2009.09.07
  • Published : 2010.03.20
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Abstract

Direct copper electroplating on Mg alloy AZ31B was carried out in a traditional pyrophosphate copper bath containing potassium fluoride. Electrochemical impedance spectroscopy and polarization methods were used to study the effects of added potassium fluoride on electrochemical behavior. The chemical state of magnesium alloy in the electroplating bath was analyzed by X-ray photoelectron spectroscopy. Adhesion of the copper electroplated layer was also tested. Due to the added potassium fluoride, a magnesium fluoride film was formed in the pyrophosphate copper bath. This fluoride film inhibits dissolution of Mg alloy and enables to electroplate copper directly on it. A dense copper layer was formed on the Mg alloy. Moreover, this copper layer has a good adhesion with Mg alloy substrate.

Keywords

Acknowledgement

Supported by : 한국과학재단

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