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http://dx.doi.org/10.3365/KJMM.2010.48.03.218

Electroplating on Magnesium Alloy in KF-Added Pyrophosphate Copper Bath  

Lee, Jung Hoon (Department of Materials Science and Engineering, Pusan National University)
Kim, Yong Hwan (BK21 Innovative Graduate Education Program for Advanced Materials of Transportation System, Pusan National University)
Jung, Uoo Chang (Korea Institute of Industrial Technology)
Chung, Won Sub (Department of Materials Science and Engineering, Pusan National University)
Publication Information
Korean Journal of Metals and Materials / v.48, no.3, 2010 , pp. 218-224 More about this Journal
Abstract
Direct copper electroplating on Mg alloy AZ31B was carried out in a traditional pyrophosphate copper bath containing potassium fluoride. Electrochemical impedance spectroscopy and polarization methods were used to study the effects of added potassium fluoride on electrochemical behavior. The chemical state of magnesium alloy in the electroplating bath was analyzed by X-ray photoelectron spectroscopy. Adhesion of the copper electroplated layer was also tested. Due to the added potassium fluoride, a magnesium fluoride film was formed in the pyrophosphate copper bath. This fluoride film inhibits dissolution of Mg alloy and enables to electroplate copper directly on it. A dense copper layer was formed on the Mg alloy. Moreover, this copper layer has a good adhesion with Mg alloy substrate.
Keywords
thin film; deposition; electrochemistry; scanning electron microscopy (SEM); magnesium;
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Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 3
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