• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.51-55
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• 2007

Ni-Fe 전해도금 시 전류밀도, 펄스주기와 전류인가 방식, 도금욕의 Fe 이온의 농도, 첨가제 등의 인자들이 도금 층의 조성, 표면형상, 표면 경도에 미치는 영향에 관하여 연구하였다. 시편에 가해지는 전류밀도, 전류인가방식과 Fe이온의 농도를 변화시킴으로써 Ni-Fe의 도금 층 내에 Ni-Fe의 조성을 조절하는 것이 가능하였고 또한 첨가제의 양을 변화시킴으로써 표면형상이 변화됨을 확인하였다. PC를 사용한 경우 직류를 사용한 경우보다 높은 $550{\sim}600Hv$의 경도값을 얻을 수 있었다. 사카린을 첨가한 경우 도금층의 잔류응력을 낮추어 균열이 없는 도금층을 얻었다. Ni-Fe의 단면의 조성을 분석함으로써 도금 층의 두께에 따른 조성의 변화를 확인하였다.

• 한국세라믹학회지
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• 제45권12호
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• pp.807-814
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• 2008

The Cu-Ni-YSZ cermet anodes for direct use of methane in solid oxide fuel cells have been fabricated by electroplating Cu into the porous Ni-YSZ cermet anode. The uniform distribution of Cu in the Ni-YSZ anode could be obtained via pulse electroplating in the aqueous solution mixture of $CuSO_4{\cdot}5H_{2}O$ and ${H_2}{SO_4}$ for 30 min with 0.05 A of average applied current. The power density ($0.17\;Wcm^{-2}$) of a single cell with a Cu-Ni-YSZ anode was shown to be slightly lower in methane at $700^{\circ}C$, compared with the power density ($0.28\;Wcm^{-2}$) of a single cell with a Ni-YSZ anode. However, the performance of the Ni-YSZ anode-supported single cell was abruptly degraded over 21 h because of carbon deposition, whereas the Cu-Ni-YSZ anode-supported single cell showed the enhanced durability upto 52 h.

• 한국레이저가공학회지
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• 제3권2호
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• pp.25-33
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• 2000

One of perspective direction of microfabrication is direct laser writing technology that allows to create metal, semiconductive and dielectric micropatterns on substrate surface. In this work, a two step method, the combination of seed forming process, in which metallic Al seed was selectively generated on AlN ceramic substrate by direct writing technique using a pulsed Nd : YAG laser and subsequent electroless Ni plating on the activated Al seed, was presented. The effects of laser parameters such as pulse energy, scanning speed and pulse frequency on shape of Alseed and conductor line after electroless Ni plating were investigated. The nature of the laser activated surface is analyzed from XPS data. The line width of this metallic Al and Ni is analyzed using SEM. As a results, Al seed line with 24㎛ width and 100㎛ isolated line space is obtained. Finally, laser direct writing can be applied in the field between thin and thick film technique in electronic industry.

• 신재생에너지
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• 제1권1호
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• pp.64-71
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• 2005

The stability of alumina-coated NiO cathodes was studied in $Li_{0.62}/K_{0.38}$ molten carbonate electrolyte. Alumina was effectively coated on the porous Ni plate using galvanostatic pulse plating method. The deposition mechanism of alumina was governed by the concentration of hydroixde ions near the working electrode, which was controlled by the temperature of bath solution. Alumina-coated NiO cathodes were formed to $A1_2O_3-NiO$ solid solution by the oxidation process and their Ni solubilities were were than that of NiO up to the immersion time of 100h. However, their Ni solubilities increased and were similar to that of the bare NiO cathode after 100h. It was because aluminum into the solid solution was segregated to $\alpha-LiAlO_2$ on the NiO and its Product did not Play a role of the Physical barrier against NiO dissolution.

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2002년도 연료전지심포지움 2002논문집
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• pp.93-98
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• 2002

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.149-149
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• 2003

• 한국표면공학회지
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• 제36권3호
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• pp.242-250
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• 2003

Electrodeposition of Ni was carried out on copper substrate from Ni Sulfamate bath by DC and high frequency pulse current. During the electroplating, bath temperature was steady $60^{\circ}C$ , agitation was applied. Morphology and surface roughness of electrodeposits was investigated with the AFM. Crystalline structure of electrodeposits was investigated with XRD. Also, surface electric resistivity was investigated with 4-point probe. The result of crystalline structure by X-ray diffractometer, in the case of DC, <200> direction was dominant growing direction. But in the case of PC, the ratio of <200> direction vs. other direction decreased. As the pulse frequency increased, the enhanced properties of deposits were shown. With increasing frequency, the degree of surface properties increased DC more than that of PC, eg surface morphology, roughness and the degree of compactness of grains. With increasing duty cycle, the surface properties such as the degree of the morphology, roughness and electroconductivity was deteriorated.

• 반도체디스플레이기술학회지
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• 제14권1호
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• pp.67-71
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• 2015

Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

• 한국표면공학회지
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• 제35권1호
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• pp.53-63
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• 2002

Ni coating was carried out by pulse plating at room temperature. So, experimental conditions for Ni-coating were based on Watt's bath, and new additives(propionic acid) were introduced in the Watt's bath electrolyte as $H_3$$BO_3$ alternatives. By adding propionic acid, coating layer demonstrated a good adhesion and uniformity without special pre-treatment of the 316L stainless steel at room temperature. With a decrease of amount of propionic acid and applied average current density, cathode current efficiency increased. Also, edge effect was decreased with decreasing a peak current and increasing a pulse frequency in the same bath condition. It was found that the optimum condition for Ni coating was a current density of 10~20mA/$\textrm{cm}^2$ at below 500 mA peak current in the $5m\ell/\ell$ propionic acid solution.

• 한국표면공학회지
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• 제35권1호
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• pp.17-32
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• 2002

Electroplating methods by molten salts and non-aqueous melts were employed for aluminium coating on STS 316L stainless steel. After coated with Ni or non-coated surface on stainless steel, Al pulse plating was carried out in two different types of electrolytes at room temperature. The Al layer from $AlCl_3$-TMPAC melts could not obtain appreciable thickness for engineering application due to chemical reactions between deposits and moisture of air. However, The Al coating by pulse plating in the Ethylbenzene-Toluene-$AlBr_3$ systems was found to be solid coating layer with a few $\mu\textrm{m}$ scale. The conductivity of Ethylbenzene-Toluene-$AlBr_3$ electrolyte was as functions of time and agitation. By seven days exposure after mixing of the electrolyte, Al-deposited layer shows uniform and near by pore-free with high current density (higher than 30mA/$\textrm{cm}^2$). The roughness and imperfection of coating layer were decreased with a increasing agitation speed. It was found that the optimum condition for the Al pulse plating on the 316L stainless steel was a 400mA peak current, duty cycle, $t_{on}$ $t_{ off}$=3ms/1ms, and a current density of 30mA/$\textrm{cm}^2$.