1 |
H. Honma, K. Kanemitsu, Plating and SurfaceFinishing, 74 (1987) 62
|
2 |
N. Ibl, J. -Cl. Puippe, H. F. Angerer, SurfaceTechnology, 6 (1978) 287
|
3 |
R. T. C. Choo, J. M. Toguri, M. El-Sherik, UErb, J. Appl Electrochem., 25 (1994) 384
|
4 |
N. A. Pangarov, Electrochimica Acta., 7(1962) 39-146
DOI
ScienceOn
|
5 |
W. F. Fluehmann, F. H. Reid, AESF's 1st in-ternational pulse symposium, (1979) 19
|
6 |
Y. Y. Wang, C. S. Tung, AESF's 3rd internati-onal pulse symposium., (1983) 28
|
7 |
G. I. Finch, J. Electrodepositors Tech. Soc.,27 (1951) 215-232
|
8 |
D. S. Lashmore, et al., Phys Rev. Lett., 48(1982) 1760
DOI
|
9 |
O. Chene, M. Datta, D. Landolt, Oberflache/Surface., 26 (1985) 45
|
10 |
W. Paatsch, Metallobrflache, 41 (1987) 39
|
11 |
A. M. El-Sherik, U. Erb, J. Page, Surf & coat Tech., 88 (1996) 70-78
|
12 |
P. T. Tang, T. Watanabe, J. E. T. Anderson,G. Bech-Nielsen, J. Appl. Electrochem., 25(1995) 347-352
|