• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 춘계 학술발표회
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• pp.240-247
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• 2010

The soil nailing system is becoming common as reinforcement method of slope face in soil. It has application to obtain slope stability method and scaffolding system. It has some troubles when the soil nailing system is applied to the downtown because it could be invaded someone's private area. Thus, in this paper, wedge type removable soil nailing system which can easily remove deformed bar in final excavation step is developed. Field pull-out test is performed to evaluate deformed bars removal and pullout resistance characteristics. According to this result, application of Wedge Type Removable Soil Nailing System is performed.

• Korea-Australia Rheology Journal
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• 제16권4호
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• pp.219-226
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• 2004

In this study the deformation of liquid-air interface of Newtonian or Boger fluids filled between two par­allel-plates geometry was investigated when two surfaces were separated at a constant speed. The interface between the fluid and air showed either stable or unstable deformation depending on experimental con­ditions. Repeated experiments for a wide range of experimental conditions revealed that the deformation mode could be classified into three types: 'stable region', 'fingering' and 'cavitation'. The experimental condition for the mode of deformation was plotted in a capillary number vs. Deborah number phase plane. It has been found that the elasticity of Boger fluids destabilize the interface deformation. On the other hand, the elasticity suppresses the formation and growth of cavities.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2008년도 추계 학술발표회
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• pp.1014-1021
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• 2008

Ground anchor should not be used in soft clay, because anchor resistance can not be guaranteed. However, there is a way to increase the capacity of anchors. The pulse powered anchor is an underreamed anchor by using high voltage electrokinetic pulse energy. In this paper, conceptual introduction of the pulse powered anchor was presented. Anchor pull-out tests were performed at the Geotechnical Experimentation Site at Sungkyunkwan University in Suwon, Korea. Data were analyzed in order to verify the performance of pulse powered anchors.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2003년도 춘계학술대회 논문집
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• pp.116-120
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• 2003

To study the trafficability on soft and cohesive benthic terrain, a tracked vehicle model($670mm(L){\times}750mm(B_c)$) is designed and tested. The pitch and chevron angle of grouser, weight and center of gravity of vehicle, and drawbar pull force are chosen as experimental variables. Slip, sinkage and inclined angle of vehicle are picked as performance values. Strength of soil is considered as noise factor. A preliminary straight-line motion test is performed. Then, DOE(Design of Experiment) is discussed for further research.

• 대한기계학회논문집
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• 제16권2호
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• pp.200-206
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• 1992

The effect of fiber diameter and gauge length on pull-out test for the interfacial properties in fiber reinforced resin composites have been investigated and these results have been arranged as statistical analysis. The fiber and matrix resins used for this study were stainless steel fiber (SUS316) and carbon fiber (high strength type), epoxy and high density polyethylene resin. From this study, it has been found that shear strength are constant regardless of gauge length of pull-out test and coefficient of variation depend on fiber diameter. In addition, it has been found that the interfacial shear strength decreased with the increasing fiber diameter, and in all case, Weibull parameter (m) has approximately 1.2/C.O.V.

• 한국안전학회지
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• 제22권1호
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• pp.54-60
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• 2007

This paper describes typical design and construction practice for in-situ ground reinforcement technique using improved steel pipe pressure grouting. A case history is presented to illustrate the benefit gained by application of the technique. This technique was applied to cut slopes developed in the construction of auxiliary spillway of 00 dam. Applicable conditions, method of survey, slope stability analysis and construction are given in this parer. As for the construction method, a procedure is given and the main points are the control of construction work. As a result of the pull-out test, it is shown that seel pipe nailing is particularly useful for stabilizing rock slope.

• Journal of the Korean Wood Science and Technology
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• 제43권1호
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• pp.60-67
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• 2015

국내산 낙엽송 집성재와 봉형 GFRP의 접착성능을 평가하기 위해 집성재에 선공을 한 후 봉형 GFRP를 삽입하고 접착제로 목재와의 간극을 충진시켜 인발시험편을 제작하였다. 인발시험편은 접착 깊이, 접착층 두께, 접착제 종류를 다르게 적용하여 실험하였다. 봉형 GFRP를 삽입접착한 캔틸레버형 라멘구조 시험체는 인발시험 결과를 토대로 제작, 강판삽입형 시험체와 모멘트 저항 성능을 비교검토 하였다. 인발시험결과 봉형 GFRP의 삽입깊이가 봉형 GFRP 직경의 5배일 때 가장 우수한 접착력이 측정되었으며, 접착층 두께는 1 mm일 경우 2 mm일 때보다 17%~29% 향상된 접착력이 측정되었다. 또한 폴리우레탄(poly-urethane) 접착제를 사용한 시험편이 레조시놀(resorcinol) 접착제를 사용한 시험편보다 2.9~4.0배 높은 성능을 발휘하였다. 봉형 GRFP로 접합한 캔틸레버형 라멘구조 시험체는 드리프트 핀을 사용한 강판삽입형 시험체와 비교하여 평균 0.82배 낮은 모멘트 저항 성능이 측정되었지만 초기강성은 0.93배로 대등한 성능을 보였다.

• 한국도로학회:학술대회논문집
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• 한국도로학회 2005년도 춘계학술대회 논문집
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• pp.129-134
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• 2005

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.