• Proceedings of the Korean Vacuum Society Conference
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• 1997.02a
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• pp.51-51
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• 1997

• Journal of IKEEE
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• v.23 no.3
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• pp.1033-1037
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• 2019

GaN-based sensors have been widely investigated thanks to its potential in detecting the presence of hydrogen. In this study, we fabricated hydrogen gas sensors with AlGaN/GaN heterojunction and investigated how the sensing performance to be affected by SiN surface passivation. The gas sensor employed a high electron mobility transistors (HEMTs) with 30 nm platinum catalyst as a gate to detect the hydrogen presence. SiN layer was deposited by inductively-coupled chemical vapor deposition as post-passivation. The sensors with SiN passivation exhibited hydrogen sensing characteristics with various gas flow rates and concentrations of hydrogen in inert background gas at $200^{\circ}C$ similar to the ones without passivation. Aside from quick response time for both sensors, there are differences in sensitivity and recovery time because of the existence of the passivation layer. The results also confirmed the dependence of sensing performance on gas flow rate and gas concentration.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.468-470
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• 1999

One of the most critical problem in etching of platinum was generally known that the etch slope was gradual. therefore, the addition of $N_2$ gas into the Ar/C1$_2$ gas mixture, which has been proposed the optimized etching gas combination for etching of platinum in our previous article, was performed. The selectivity of platinum film to oxide film as an etch mask increased with the addition of N2 gas, and the steeper etch slope over 75 $^{\circ}$ could be obtained. These phenomena were interpreted the results the results of a blocking layer such as Si-N or Si-O-N on the oxide mask. Compostional analysis was carried out by X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). Moreover, it could be obtained the higher etch rate of Pt film and steeper profile without residues such as p.-Cl and Pt-Pt ant the addition N\ulcorner of 20 % gas in Ar(90)/Cl$_2$(10) Plasma. The Plasma characteristic was extracted from optical emissionspectroscopy (OES).

• Journal of Sensor Science and Technology
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• v.14 no.2
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• pp.96-100
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• 2005

The planar Schottky diodes were fabricated and modeled to probe the device applicability of the cracked GaN epitaxial layer on a (111) silicon substrate. On the unintentionally n-doped GaN grown on silicon, we deposited Ti/Al/Ni/Au as the ohmic metal and Pt as the Schottky metal. The ohmic contact achieved a minimum contact resistivity of $5.51{\times}10.5{\Omega}{\cdot}cm^{2}$ after annealing in an $N_{2}$ ambient at $700^{\circ}C$ for 30 sec. The fabricated Schottky diode exhibited the barrier height of 0.7 eV and the ideality factor was 2.4, which are significantly lower than those parameters of crack free one. But in photoresponse measurement, the diode showed the peak responsivity of 0.097 A/W at 300 nm, the cutoff at 360 nm, and UV/visible rejection ratio of about $10^{2}$. The SPICE(Simulation Program with Integrated Circuit Emphasis) simulation with a proposed model, which was composed with one Pt/GaN diode and three parasitic diodes, showed good agreement with the experiment.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.21-21
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• 2003

To increase the light-emission efficiency of LED, we increased the internal and external quantum efficiency by suppressing the defect formation in the quantum well and by increasing the light extraction efficiency in LED, respectively. First, the internal quantum efficiency was improved by investigating the effect of a low temperature (LT) grown p-GaN layer on the In$\sub$0.25/GaN/GaN MQW in green LED. The properties of p-GaN was optimized at a low growth temperature of 900oC. A green LED using the optimized LT p-type GaN clearly showed the elimination of blue-shift which is originated by the MQW damage due to the high temperature growth process. This result was attributed to the suppression of indium inter-diffusion in MQW layer as evidenced by XRD and HR-TEM analysis. Secondly, we improved the light-extraction efficiency of LED. In spite of high internal quantum efficiency of GaN-based LED, the external quantum efficiency is still low due to the total internal reflection of the light at the semiconductor-air interface. To improve the probability of escaping the photons outside from the LED structure, we fabricated nano-sized cavities on a p-GaN surface utilizing Pt self-assembled metal clusters as an etch mask. Electroluminescence measurement showed that the relative optical output power was increased up to 80% compared to that of LED without nano-sized cavities. I-V measurement also showed that the electrical performance was improved. The enhanced LED performance was attributed to the enhancement of light escaping probability and the decrease of resistance due to the increase in contact area.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1092-1095
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• 2004

The $ZnGa_2O_4$ phosphor target is synthesized through solid-state reactions as calcine and sintering temperature in order to deposit $ZnGa_2O_4$ phosphor thin film by rf magnetron sputtering system. The $ZnGa_2O_4$ phosphor thin film is deposited on $Pt/Ti/SiO_2/Si$ substrate and prepared $ZnGa_2O_4$ Phosphor thin film is annealed by rapid thermal processor(RTP) at $750^{\circ}C$, 10 sec. The x-ray diffraction patterns of $ZnGa_2O_4$ phosphor target and thin film show the position of (311) main peak. The cathodolumincsccnce(CL) succtrums of $ZnGa_2O_4$ phosphor target show main peak of 360nm and broad bandwidth of about 180nm.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.225.1-225.1
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• 2013

지난 수년간 태양전지의 광전변환 효율을 높이기 위해 자가 조립된 InAs 또는 GaSb 와 같은 양자점을 GaAs 단일 p-n 접합에 적용하는 연구를 개발해 왔다. 그러나 양자점의 흡수 단면적에 의한 광흡수도는 양자점층을 수십 층을 쌓으면 증가하지만 활성층에 결함을 생성시킨다. 생성된 결함은 운반자 트랩으로 작용하여 태양전지의 광전변환 효율을 감소시킨다. 본 실험에서는 양자점이 적용된 태양전지와 적용되지 않은 태양전지의 광전변환 효율을 비교하고, 깊은준위 과도용량 분광법을 이용하여 결함상태를 측정하고 및 비교함으로써, 활성층 내부에 생성된 결함이 광전변환 효율에 미치는 영향을 분석하였다. 소자구조는 분자선 증착 방법을 이용하여, 먼저 n-형 GaAs 기판위에 n-형 GaAs를 300 nm 증착한 후, 도핑이 되지 않은 GaAs 활성층을 3.5 ${\mu}m$ 두께로 증착하였다. 마지막으로 p-형 GaAs를 830 nm 증착함으로써 p-i-n구조를 형성하였다. 여기서, n-형 GaAs 과 p-형 GaAs의 도핑농도는 동일하게 $5{\times}1018\;cm^{-3}$ 로 하였다. 또한 양자점 및 델타도핑 층을 각각 태양전지에 적용하기 위해 활성층내에 양자점 20층 및 델타도핑 20층을 각각 형성하였다. 이때, 양자점 태양전지, 델타도핑 태양전지와 양자점이 없는 태양전지의 광전변환 효율은 각각 4.24, 4.97, 3.52%로 나타났다. 태양전지의 전기적 특성을 측정하기 위해 소자구조 위에 Au(300nm)/Pt(30nm)/Ti(30nm)의 전극을 전자빔 증착장치로 증착하였으며, 메사에칭으로 직경 300 ${\mu}m$의 p-i-n 접합 다이오드 구조를 제작하였다. 정전용량-전압 특성 및 깊은준위 과도용량 분광법을 이용하여 태양전지의 결함분석 및 이에 따른 광전변환 효율의 상관관계를 논의할 것이다.

• Journal of Ceramic Processing Research
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• v.21
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• pp.23-27
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• 2020

The enhanced optical output power of AlGaN/GaN deep ultraviolet light-emitting diodes (UV LEDs) were demonstrated by using the breakdown-induced conductive channels (BICCs). The BICCs could be made by electrical reverse biasing between two adjacent contact pads formed on top p-type layers with a certain distance, causing an electrical breakdown of pn junction and hence a generation of conductive channels. Accordingly, the reflective Ni/Ag/Pt electrodes could be formed simultaneously on the top p-type layer and the other p-type layer with the BICCs, acting as the p- and n-contacts, respectively. The deep UV LEDs fabricated with the BICCs produced the enhanced optical output power by 15 % as compared to the reference LEDs, which were fabricated with the conventional Ti/Al/Ti/Au layers formed on mesa-etched n-type layer. This could be due to the reduced light absorption at the n-contact pads, indicating that the use of BICCs will be very suitable for obtaining better output performance of deep UV emitters.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.1
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• pp.1-12
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• 2003

This paper describes a study on the abnormal behavior of the electrical characteristics of the (n)GaAs/Ti/Pt/Au Schottky contacts prepared by the two techniques of electron beam deposition and rf sputtering and after an annealing treatment. The samples were characterized by I-V and C-V measurements carried out over the temperature range of 150 - 350 K both in the as prepared state and after a 300 C, 30 min. anneal step. The variation of ideality factor with forward bias, the variation of ideality factor and barrier height with temperature and the difference between the capacitance barrier and current barrier show the presence of a thin interfacial oxide layer along with barrier height inhomogenieties at the metal/semiconductor interface. This barrier height inhomogeneity model also explains the lower barrier height for the sputtered samples to be due to the presence of low barrier height patches produced because of high plasma energy. After the annealing step the contacts prepared by electron beam have the highest typical current barrier height of 0.85 eV and capacitance barrier height of 0.86 eV whereas those prepared by sputtering (at the highest power studied) have the lowest typical current barrier height of 0.67 eV and capacitance barrier height of 0.78 eV.

• Clean Technology
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• v.22 no.2
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• pp.82-88
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• 2016

The loss of activity by coke is an important cause of catalyst deactivation during industrial operation. In this study, hydrogen ratio of reaction condition, which has influenced on coke formation over Pt-Sn catalyst, and regeneration of catalysts activity by coke burning, Pt sintering of coke burning as coke contents, effects of coke formation and deactivation with different Sn contents were confirmed. Pt-Sn-K catalyst supported on θ-alumina and γ-alumina was prepared progressively. Activity of regenerated catalyst for propane dehydrogenation was compared with fresh catalyst by coke burning, after propane dehydrogenation was carried out with different hydrogen ratio at 620 ℃ on fresh catalyst. Regenerated catalyst’s physical characterization such as BET, coke analysis and XRD was investigated. Through catalytic activity test and characterization, Sn contents of catalyst and hydrogen ratio in feed stream could affect coke formation on catalyst surface. Excessive coke makes loss of activity and Pt sintering during air regeneration process.