• Title/Summary/Keyword: Process Time

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Production Flow Analysis Simulation Integration for Collaborative Process Planning (협업 공정계획을 위한 생산흐름 분석 시뮬레이션 통합)

  • Lee Ju-Yeon;Noh Sang-Do
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.987-992
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    • 2005
  • Manufacturing companies should perform process planning and its evaluation concurrently with new product developments so that they can be highly competitive in the modern market. Process planners should make decisions in the manner of concurrent and collaborative engineering in order to reduce the manufacturing preparation time and cost when developing new products. Automated generation of analysis models from the integrated database, which contains process and material information, reduces time to prepare analyses and makes the models reliable. In this research, we developed a web-based system for concurrent and collaborative system for production flow analysis, using web, database, and simulation technology. An integrated database is designed to automatically generate analysis models from process and material plans without reworking the data. This system enables process planners to evaluate their decision fast and share their opinions with others easily. With this system, it is possible to save time and cost for assembly process and material planning, and reliability of process plans can be improved

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A Study on Detecting Changes in Injection Molding Process through Similarity Analysis of Mold Vibration Signal Patterns (금형 기반 진동 신호 패턴의 유사도 분석을 통한 사출성형공정 변화 감지에 대한 연구)

  • Jong-Sun Kim
    • Design & Manufacturing
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    • v.17 no.3
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    • pp.34-40
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    • 2023
  • In this study, real-time collection of mold vibration signals during injection molding processes was achieved through IoT devices installed on the mold surface. To analyze changes in the collected vibration signals, injection molding was performed under six different process conditions. Analysis of the mold vibration signals according to process conditions revealed distinct trends and patterns. Based on this result, cosine similarity was applied to compare pattern changes in the mold vibration signals. The similarity in time and acceleration vector space between the collected data was analyzed. The results showed that under identical conditions for all six process settings, the cosine similarity remained around 0.92±0.07. However, when different process conditions were applied, the cosine similarity decreased to the range of 0.47±0.07. Based on these results, a cosine similarity threshold of 0.60~0.70 was established. When applied to the analysis of mold vibration signals, it was possible to determine whether the molding process was stable or whether variations had occurred due to changes in process conditions. This establishes the potential use of cosine similarity based on mold vibration signals in future applications for real-time monitoring of molding process changes and anomaly detection.

Random Central Limit Theorem of a Stationary Linear Lattice Process

  • Lee, Sang-Yeol
    • Journal of the Korean Statistical Society
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    • v.23 no.2
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    • pp.504-512
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    • 1994
  • A simple proof for the random central limit theorem is given for a family of stationary linear lattice processes, which belogn to a class of 2 dimensional random fields, applying the Beveridge and Nelson decomposition in time series context. The result is an extension of Fakhre-Zakeri and Fershidi (1993) dealing with the linear process in time series to the case of the linear lattice process with 2 dimensional indices.

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A study on the development of standard-time receiving device for process computer (공정용 컴퓨터를 위한 표준시각 수신장치 개발에 관한 연구)

  • 홍용표;손창호
    • 제어로봇시스템학회:학술대회논문집
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    • 1988.10a
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    • pp.592-596
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    • 1988
  • PCS(Process Computer System) is installed to monitor various kinds of process parameters in Power Plant and networked for synthetic monitor and event analysis in all site. But when an event is occured sequentially or simultaneously among the plants, it is difficult to analyze it because of different Standard-Time in each Plant. Standard-Time Receiving Device is developed to solve this problem and development procedure is descried here.

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A study on the development of standard-time receiving device for process computer (공정용 컴퓨터를 위한 표준시각 수신장치 개발에 관한 연구)

  • 홍용표;손창호
    • 제어로봇시스템학회:학술대회논문집
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    • 1988.10a
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    • pp.385-389
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    • 1988
  • PCS(Process Computer System) is installed to monitor various kinds of process parameters in Power Plant and networked for synthetic monitor and event analysis in all site. But when an event is occured sequentially or simultaneously among the plants, it is difficult to analyze it because of different Stardard-Time in each plant. Standard-Time Receiving Device is developed to solve this problem and development procedure is described here.

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On the AR(1) Process with Stochastic Coefficient

  • Hwang, Sun-Y
    • Communications for Statistical Applications and Methods
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    • v.3 no.2
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    • pp.77-83
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    • 1996
  • This paper is concerned with an estimation problem for the AR(1) process $Y_t, t=0, {\pm}1, {\cdots}$with time carying autoregressive coefficient, where coefficient itself is also stochastic process. Attention is directed to the problem of finding a consistent estimator of ${\Phi}$, the mean level of autoregressive coefficient. The asymptotic distribution of the resulting consistent estimator of ${\Phi}$, is them discussed. We do not assume any time series model for the time varying autoregressive coefficient.

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A Study on The Reduction of Cycle Time in Injection Molding Process of The Monitor Backcover (Monitor Backcover의 사이클 타임 단축에 관한 연구)

  • Yoon K. H.;Kim J. K.
    • Transactions of Materials Processing
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    • v.14 no.4 s.76
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    • pp.368-374
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    • 2005
  • In the present study we used a diagrammatic analysis of 6 sigma quality control and Taguchi method for injection molding of monitor back-cover, evaluated the influence on the cycle time with part design, mold design, molding process and standardization activity involving design and molding, adopted analysis of sensitivity and effective factors of the part design and molding process conditions for productivity, identified main design molding factors. The contributing factors for the final cycle time could be enumerated as follows; the thickness of hot spot, main nominal part thickness, coolant inlet temperature, melt temperature and cooling line layout, etc.. As a first step, all the critical factors of design process applied to the current monitor housing were investigated through 6 sigma process. Thereafter, the optimal and better critical factors found in the first step were applied to new product design to prove that our process was correct. The Moldflow was used for injection molding simulation, and Minitab software for the statistical analysis, respectively. Finally, the productivity of new design was increased about 33 percents for our specific case.

A Study on The Reduction of Cycle Time in Injection Molding Process of The Monitor Backcover (Monitor backcover의 사출시간 단축에 관한 연구)

  • Kim J. K.;Kim J. S.;Yoon K. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.05a
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    • pp.269-272
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    • 2004
  • The present study used a diagrammatic analysis of 6 sigma quality control and Taguchi method for injection molding process of monitor back-cover, evaluated the influence on the cycle time with part design, mold design, molding process and standardization activity involving design & molding, adopted analysis of sensitivity and effective factors of the part design and molding process conditions for productivity, identified main design molding factors, as critical ones influencing on the quality and productivity, of which is summarized as design guidance. The main contribution factors for cycle time can be sequentially enumerated as follows; hot spot, part thickness, coolant inlet temperature, melt temperature cooling line layout, etc.. As a first step critical factors of the design process of current monitor housing were investigated. And the optimal and better critical factors found in the first step were applied to a new product proving our process was correct. Moldflow software was used for injection molding simulation, and Minitab software for the statistical analysis. Finally, the productivity was increased by about 33 percents for our specific case.

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Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching (DRIE 공정 변수에 따른 TSV 형성에 미치는 영향)

  • Kim, Kwang-Seok;Lee, Young-Chul;Ahn, Jee-Hyuk;Song, Jun Yeob;Yoo, Choong D.;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.48 no.11
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    • pp.1028-1034
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    • 2010
  • In the development of 3D package, through silicon via (TSV) formation technology by using deep reactive ion etching (DRIE) is one of the key processes. We performed the Bosch process, which consists of sequentially alternating the etch and passivation steps using $SF_6$ with $O_2$ and $C_4F_8$ plasma, respectively. We investigated the effect of changing variables on vias: the gas flow time, the ratio of $O_2$ gas, source and bias power, and process time. Each parameter plays a critical role in obtaining a specified via profile. Analysis of via profiles shows that the gas flow time is the most critical process parameter. A high source power accelerated more etchant species fluorine ions toward the silicon wafer and improved their directionality. With $O_2$ gas addition, there is an optimized condition to form the desired vertical interconnection. Overall, the etching rate decreased when the process time was longer.

Corrosion Damage Characteristics with Materials and Process Time in Ultrasonic-Chemical Decontamination of Immersion Type (침적식 초음파-화학 제염 시 재료 및 공정 시간에 따른 부식 손상 특성)

  • Lee, Seung-Jun;Hyun, Koangyong;Han, Min-Su;Kim, Seong-Jong
    • Journal of the Korean institute of surface engineering
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    • v.51 no.5
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    • pp.291-296
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    • 2018
  • In this study, we carried out an ultrasonic-chemical decontamination process with immersion type, reproduced in the laboratory. The corrosion damage characteristics, depending on kind of materials and ultrasonic process time, were investigated. Inconel 600, which showed lower corrosion potential and higher corrosion current density than that of STS 316, revealed severer corrosion damage and higher weight-loss rate than STS 316. Weight-loss rate of Inconel 600 increased with increasing ultrasonic process time. On the other hands, STS 316 presented a negligibly small corrosion damage, which was almost indistinguishable from visual observation. There was no effect of ultrasonic process time on the weight-loss rate of STS 316.