• 전자공학회지
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• 제37권8호
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• pp.50-59
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• 2010

$0.18-{\mu}m$ high voltage technology 13.5V high voltage well-based symmetric EDMOS isolated by MTI was designed and fabricated. Using calibrated process and device model parameters, the characteristics of the symmetric and asymmetric EDMOS have been simulated. The asymmetric EDMOS has higher performance, better $R_{sp}$ / BVDSS figure-of-merit, short-channel immunity and smaller pitch size than the symmetric EDMOS. The asymmetric EDMOST is a good candidate for low-power and smaller source driver chips. The low voltage logic well-based EDMOS process has advantages over high voltage well-based EDMOS in process cost by eliminating the process steps of high-voltage well/drift implant, high-temperature long-time thermal steps, etc. The specific on-resistance of our well-designed logic well-based EDMOSTs is compatible with the smallest one published. TCAD simulation and measurement results show that the improved logic well-based nEDMOS has better electrical characteristics than those of the conventional one. The improved EDMOS proposed in this paper is an excellent candidate to be integrated with low voltage logic devices for high-performance low-power low-cost chips.

• 한국CDE학회논문집
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• 제18권2호
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• pp.129-137
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• 2013

This paper proposed the scheduling method for tire mixing processes using the genetic algorithm. The characteristics of tire mixing process have the manufacturing routing, operation machine and operation time by compound types. Therefore, the production scheduling has to consider characteristics of the tire mixing process. For the reflection of the characteristics, we reviewed tire mixing processes. Also, this paper introduces the genetic algorithm using the crossover and elitist preserving selection strategy. Fitness is measured by the makespan. The proposed genetic algorithm has been implemented and tested with two examples. Experimental results showed that the proposed algorithm is superior to conventional heuristic algorithm.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.401-404
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• 2004

Transfer characteristics of poly-Si TFTs within process window of laser energy are investigated. In terms of surface morphology and transfer characteristics, process window of laser crystallization is evaluated. While maximum mobility exists in lower edge of process window in n-channel TFTs, maximum mobility exists in higher edge of process window in p-channel TFTs.

• 소성∙가공
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• 제21권2호
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• pp.119-125
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• 2012

The present study addresses a direct patterning process on a plastic film using ultrasonic vibration energy. In this process, a tool horn containing micro-patterns is attached to an ultrasonic power supply, and is used with ultrasonic vibration to replicate micro-patterns on the surface of a plastic film. To improve the replication characteristics of the micro-patterns, the effect of the die shape of the ultrasonic patterning process was investigated with respect to the flow direction control. Finite element analyses were performed to predict the flow characteristics of the polymer with variations in die design parameters. Experiments were conducted using the optimally-designed die, from which it was possible to attain much improved pattern replication.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.692-697
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• 2001

It is necessary to analyze the mechanical behaviors of the power steering hose, which must play a proper role under severe operating conditions, in order to prepare a preventive measure fur contrary effects expected in unfavorable circumstances. In this paper, the stress and deformation characteristics of the hose components such as rubber, sleeve, nipple and reinforced braids during the swaging process, are analyzed using the finite element method. Contact conditions identical to the manufacturing process are taken into account, and the material properties based on experimental data are used in the analysis. Investigations into the mutual relations between the manufacturing conditions and the hose performances are done with respect to the jaw stroke on the basis of the stress and strain values of the hose components after swaging process.

• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• 한국정밀공학회지
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• 제34권4호
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• pp.253-258
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• 2017

This paper presents a numerical study on the thermal characteristics of a milling process of titanium alloy with nanofluid minimum-quantity lubrication (MQL). The computational fluid dynamics (CFD) approach is introduced for establishing the numerical model for the nanofluid MQL milling process, and estimated temperatures for pure MQL and for nanofluid MQL using both hexagonal boron nitride (hBN) and nanodiamond particles are compared with the temperatures measured by thermocouples in the titanium alloy workpiece. The estimated workpiece temperatures are similar to experimental ones, and the model is validated.

• 한국정밀공학회지
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• 제15권8호
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• pp.88-101
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• 1998

In this paper, module of a product is determined by the characteristics of a product itself and art assembly process. To analyze the characteristics o( the product, assembly function, structure of subassembly and parts could be considered. Based on the analysis of characteristics of product structure, assembly process and product function, determination criteria of a module could be proposed. For the assembly process, assembly methods, assembly equipment and workers could be considered. For the product structure, constituent object and structural feature could also be considered. To obtain the interrelationship between the product and the assembly process, the matrix table could be used to find the influencing factors that affected the module.

• 한국공작기계학회논문집
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• 제13권2호
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• pp.17-24
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• 2004

In end milling process, undeformed chip thickness and cutting forces vary periodically with phase change of the tool. Recently, a model has been proposed to simulate the shear and friction characteristics of an up-end milling process in terms of the equivalent oblique cutting to this. In the current study, a down-end milling process has been replaced with the equivalent oblique cutting process. And shear and tool-chip friction characteristics variation of SM45C steel has been studied using the end-mills of different helix angles. The specific shear and friction energy consumed with helix angle of $50^{\circ}$ is somewhat larger than those of$30^{\circ}$ and $40^{\circ}$. The specific shear energy consumed is about 76-77% of the specific cutting energy regardless the helix angles.

• 한국정밀공학회지
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• 제16권5호통권98호
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• pp.132-144
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• 1999

In this study, the complexity of the product was evaluated quantitatively considering the product structure, assembly process and disassembly process. To evaluate the complexity of the product, subassemblies of automobile were analyzed and then characteristics of part and subassembly were determined according to product structure, assembly process and disassembly process. Evaluation criteria of complexity were determined considering each characteristics of part and subassembly. Experiential evaluation was accomplished by classified evaluation criteria and time-motion evaluation was accomplished by the relational motion factor with characteristics of part and subassembly in MTM(Methods Time Measurement) and WF(Work Factor). The total complexity of product was determined by experiential evaluation and time-motion evaluation.