• Title/Summary/Keyword: Probe Test

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Dual Core Differential Pulsed Eddy Current Probe to Detect the Wall Thickness Variation in an Insulated Stainless Steel Pipe

  • Angani, C.S.;Park, D.G.;Kim, C.G.;Kollu, P.;Cheong, Y.M.
    • Journal of Magnetics
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    • v.15 no.4
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    • pp.204-208
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    • 2010
  • Local wall thinning in pipelines affects the structural integrity of industries like nuclear power plants (NPPs). In the present study, a pulsed eddy current (PEC) differential probe with two excitation coils and two Hall-sensors was fabricated to measure the wall thinning in insulated pipelines. A stainless steel test sample was prepared with a thickness that varied from 1 mm to 5 mm and was laminated by plastic insulation to simulate the pipelines in NPPs. The excitation coils in the probe were driven by a rectangular current pulse, the difference of signals from two Hall-sensors was measured as the resultant PEC signal. The peak value of the detected signal is used to describe the wall thinning. The peak value increased as the thickness of the test sample increased. The results were measured at different insulation thicknesses on the sample. Results show that the differential PEC probe has the potential to detect wall thinning in an insulated NPP pipelines.

Highly Productive Process Technologies of Cantilever-type Microprobe Arrays for Wafer Level Chip Testing

  • Lim, Jae-Hwan;Ryu, Jee-Youl;Choi, Woo-Chang
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.2
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    • pp.63-66
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    • 2013
  • This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

A Study on the Improvement of Smoke Probe Performance in Diesel Vehicles Using Korean 147 Test Method (한국형 147검사 방법을 이용한 디젤자동차의 매연프로브 성능 향상 연구)

  • Kim, Jae-Yeol;Chae, Il-Seok;Kim, Sang yu;Yang, Dong Hee
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.7
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    • pp.25-32
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    • 2021
  • In the previous study, a study was conducted to improve the exhaust gas intake efficiency by improving the existing soot measurement probe in the shape and angle of the exhaust port. As a result, it can be seen that the smoke measurement performance according to the shape and angle is improved. In previous studies, the performance of the soot probe was not confirmed for the Korean KD 147 mode, which has a low suction flow rate and a long inspection time. So, we would like to confirm the improvement of the smoke probe performance of the Korean KD 147 mode, which is close to the actual driving conditions. The probe used in this study is another type of probe, and has a circular ring shape instead of a rib and variable center position unit, so the probe center hole is located close to the center of the exhaust pipe.

BCI Probe Emulator Using a Microstrip Coupler (마이크로스트립 커플러 구조를 이용한 BCI 프로브 Emulator)

  • Jung, Wonjoo;Kim, SoYoung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.25 no.11
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    • pp.1164-1171
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    • 2014
  • Bulk Current Injection(BCI) test is a method of injecting current into Integrated Circuit(IC) using a current injection probe to qualify the standards of Electromagnetic Compatibility(EMC). This paper, we propose a microstrip coupler structure that can replace the BCI current injection probe that is used to inject a RF noise in standard IEC 62132-part 3 documented by International Electrotechnical Commission. Conventional high cost BCI probe has mostly been used in testing automotive ICs that use high supply voltage. We propose a compact microstrip coupler which is suitable for immunity testing of low power ICs. We tested its validity to replace the BCI injection probe from 100 MHz to 1,000 MHz. We compared the power[dBm] that is needed to generate the same level of noise between current injection probe and microstrip coupler by sweeping the frequency. Results show that microstrip coupler can inject the same level of noise into ICs for immunity test with less power.

A Pilot Study of Stiffness Mesurements for Tunnel-Face Materials Using In-hole Seismic Method (인홀 시험을 이용한 터널 막장의 암반강성 측정에 대한 적용성 연구)

  • Mok, Young-Jin;Kim, Young-Su
    • Proceedings of the Korean Geotechical Society Conference
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    • 2005.03a
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    • pp.445-456
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    • 2005
  • The research concentrates on improving the in-hole seismic probe, which has been developed in past five years, to be used in stiffness measurements of tunnel-face materials. The probe was down-sized to be fit in 45-mm diameter holes(or BX) drilled by a jumbo-drill, which is used to drill holes to install explosives for tunneling. Also trigger system was improved by using a down-speeding motor for operating convenience and air packing system was replaced with a set of plate-springs to eliminate supply of compressed air. These modifications are to adjust the probe for the unfavourable environment inside of tunnels and to test without any further drilling cost. The probe and testing procedure were successfully adopted with horizontal holes drilled by a jumbo-drill at a tunnel-face to evaluate the stiffness of rock mass. The measured shear wave velocities can be used to estimate deformation properties of rock mass for tunnel analyses.

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Manufacturing of SPL system having a large scanning area (대면적 SPL(Scanning Probe Lithography) 시스템 제작)

  • Yoon, Sang-Joon;Kim, Won-Hyo;Seong, Woo-Kyeong;Park, Young-Geun;Hwang, Kyu-Ho;Chung, Kwan-Soo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.699-702
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    • 2004
  • Next generation lithography technologies, such as EBL(Electron Beam Lithography), X-ray lithography, SPL(Scanning Probe Lithography), have been studied widely for getting over line width limitation of photolithography. Among the next generation lithography technologies, SPL has been highlighted because of its high resolution advantage. But is also has problem which are slow processing time and sample size limitation. The purpose of this study is complement of present SPL system. Brand new SPL system was made. SPL test was performed with the system in ultra thin PMMA(polymethlymethacrylate) film.

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Characterization of Probe Pin for LED Inspection System (LED 검사장비용 탐침의 특성 규명)

  • Shim, Hee-Soo;Kim, Sun Kyoung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.6
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    • pp.647-652
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    • 2015
  • A probe pin is a key component of LED inspection equipment. The probe pin makes contact with the LED electrodes and supplies an electric current. Because the mechanical and electrical homogeneity of the probe surface affects the service life and reliability, its characterization is essential. For this study, the hardness was measured using a micro-Vickers hardness test. Moreover, the thicknesses of the plating at different locations and the elemental compositions were examined using an FE-SEM. The uniformity of the plating was found to be acceptable because palladium was detected consistently throughout the tested domain. In addition, the hardness of the surface was determined to be higher than that of the typical palladium range, which is attributed to the use of undercoated nickel.

Simulation for characterization of high speed probe for measurement of single flux quantum circuits (단자속양자 회로 측정프로브의 특성 분석을 위한 시뮬레이션)

  • 김상문;김영환;최종현;조운조;윤기현
    • Progress in Superconductivity and Cryogenics
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    • v.4 no.2
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    • pp.11-15
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    • 2002
  • High speed probe for measurement of sin91e flux quantum circuits is comprised of coaxial cables and microstrip lines in order to carry high speed signals without loss. For the impedance matching between coaxial cable and microstrip line, we have determined the dimension of the microstrip line with 50${\Omega}$ impedance by simulation and then have investigated the effect of line width and cross-sectional shape of signal line, dielectric material, thickness of soldering lead at the coaxial-to-microstrip transition Point, and the an91c between dielectric material and end part of the signal line on the characteristics of signal transmission of the microstrip line. From the simulation, we have found that these all parameter's had influenced on the characteristic of signal transmission on the microstrip line and should be reflected in fabricating high speed probe, We have also determined the dimension of coplanar waveguide to fabricate testing sample for performance test of high speed probe.

A Study on Smart Soil Resistance Measuring Device for Safety Characterized Ground Design in Converged Information Technology (ICT 융합 환경에서의 안전 특성화 접지 설계를 위한 스마트 대지 저항 측정 기술에 관한 연구)

  • Kim, Hong-Yong;Shin, Seung-Jung
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.19 no.1
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    • pp.203-209
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    • 2019
  • In this work, a new land-specific resistance measuring device (GM) and a measuring probe (Grounding Rod) are connected to the WENNER quadrant as power-line communication (PLC). In groups of two (P1,P2) probes, five to ten probes are installed in series on the ground at intervals of 1m, 2m, 4m, 8m, and 16m, respectively. If the PLC signal from the GMD is detected by the receiver of the Probe 1 (P1) for measurement, the minute voltage and current for measurement flow from the PSD (power supply) attached to the probe to the ground, and then, through the soil between P1 and P2, enters the Probe 1 (P2). The resistance value is then measured by the principle of voltage drop due to ground resistance. Measure the earth resistance every T seconds up to 1 trillion and store the measured data on the Arduino Server mounted on the main equipment. Stored measurement data can be derived from formulas by Ohm's Law and from inherent resistance (here,). Data obtained in real time will be linked to CDGES programs installed on Main PC, enabling data analysis and real-time monitoring of the ground environment on land. In addition, a three-dimensional display is possible with 3D graph support by identifying seasonal characteristics such as temperature and humidity of land (soils). The limitations of the study will require specific application measures of Test Bed for commercial access to a model that has been developed and operated experimentally.

Water Content Calibration of Time-Domain Reflectometry Probe Using Laboratory Model Test (실내모형실험을 통한 TDR 함수량계의 현장 함수비 보정)

  • Shin, Eun Chul;Ryu, Byung Hyun;Park, Jeong Jun
    • Journal of the Korean Geosynthetics Society
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    • v.12 no.2
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    • pp.1-11
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    • 2013
  • Water content of subgrade soil in water supply systems has a large effect on performance. Many researchers lately make use of time-domain reflectometry (TDR) probes to measure the soil water content of subgrade soil from monitoring. The laboratory calibration test of TDR probe should be performed with soil field, because TDR probe can cause an error by type, gradation, density, and temperature of soil. This study shows the laboratory calibration test using TDR CS616, TDR-P3, TDR-T3. The calibration equations of TDR were then proposed. It was confirmed from the study that the data of TDR probe monitored in field could be used to estimate the freezing, unfrozen water content, and matric suction of soil.