• 제목/요약/키워드: Printed materials

검색결과 840건 처리시간 0.029초

나노컴포지트 카본 잉크가 전착된 일회용 도파민 바이오센서 (A new nano-composite carbon ink for disposable dopamine biosensors)

  • 띠루 디나카란;장승철
    • 분석과학
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    • 제29권1호
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    • pp.35-42
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    • 2016
  • A new nano-composite carbon ink for the development of disposable dopamine (DA) biosensors based on screen-printed carbon electrodes (SPCEs) is introduced. The method developed uses SPCEs coupled with a tyrosinase modified nano-composite carbon ink. The ink was prepared by an “in-house” procedure with reduced graphene oxide (rGO), Pt nanoparticles (PtNP), and carbon materials such as carbon black and graphite. The rGO-PtNP carbon composite ink was used to print the working electrodes of the SPCEs and the reference counter electrodes were printed by using a commercial Ag/AgCl ink. After the construction of nano-composite SPCEs, tyrosinase was immobilized onto the working electrodes by using a biocompatible matrix, chitosan. The composite of nano-materials was characterized by X-ray photoelectron spectroscopy (XPS) and the performance characteristics of the sensors were evaluated by using voltammetric and amperometric techniques. The cyclic voltammetry results indicated that the sensors prepared with the rGO-PtNP-carbon composite ink revealed a significant improvement in electro-catalytic activity to DA compared with the results obtained from bare or only PtNP embedded carbon inks. Optimum experimental parameters such as pH and operating potential were evaluated and calibration curves for dopamine were constructed with the results obtained from a series of amperometric detections at −0.1 V vs. Ag/AgCl. The limit of detection was found to be 14 nM in a linear range of 10 nM to 100 µM of DA, and the sensor’s sensitivity was calculated to be 0.4 µAµM−1cm−2.

핸드폰 기판(基板)으로부터 구리와 은의 질산(窒酸) 침출(浸出) 연구(硏究) (Leaching of copper and silver from ground mobile phone printed circuit boards using nitric acid)

  • ;유경근;정진기;이재천
    • 자원리싸이클링
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    • 제17권3호
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    • pp.48-55
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    • 2008
  • 핸드폰 기판 내 구리와 은의 침출거동에 미치는 질산농도, 반응온도, 교반속도, 광액농도의 영향을 조사하기 위하여 질산을 이용한 핸드폰 기판침출실험을 수행하였다. 질산농도와 반응온도의 증가에 따라 침출율은 빠르게 증가하였다. 최적 침출 조건인 $80^{\circ}C$, 2mol/L $HNO_3$, 120g/L의 조건에서 구리와 은의 침출율은 반응시간 20분 동안 $98{\sim}99%$에 달하였다. 수축핵 모델(Shrinking core model)에 기초하여 각 침출실험결과를 분석하고 속도상수를 결정하였다. 활성화에너지는 2mol/L 질산용액을 이용하여 온도범위 $35{\sim}80^{\circ}C$에서 분석한 결과, 구리와 은에 대하여 각각 45.5kJ/mol과 60.5kJ/mol을 나타내었다.

에폭시수지가 도포된 폴리이미드와 스크린 프린팅 Ag 사이의 계면접착력 평가 (Interfacial Adhesion between Screen-Printed Ag and Epoxy Resin-Coated Polyimide)

  • 박성철;김재원;김기현;박세호;이영민;박영배
    • 마이크로전자및패키징학회지
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    • 제17권1호
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    • pp.41-46
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    • 2010
  • 스크린 프린팅된 Ag 박막과 에폭시 수지로 코팅된 폴리이미드 사이의 계면접착력을 $180^{\circ}$ 필 테스트를 통해 정량적으로 구하였다. 스크린 프린팅된 Ag 박막과 에폭시 수지 코팅된 폴리이미드 사이 필 강도는 $164.0{\pm}24.4J/m^2$이었다. 오븐에서 $120^{\circ}C$ 조건에서 24시간 동안 열처리 한 Ag/폴리이미드의 필 강도는 $220.8{\pm}19.2J/m^2$로 증가하였고, $85^{\circ}C/85%$ 상대습도 조건에서 120시간 동안 유지한 Ag/폴리이미드의 필 강도는 $84.1{\pm}50.8J/m^2$로 감소하였다. 전계방출형 주사전자현미경과 XPS를 통해 박리된 시편 표면을 분석한 결과, 열처리 및 고온/다습조건처리 시 스크린 프린팅 Ag 박막과 에폭시 수지 코팅층 사이의 계면접착력은 에폭시 수지와 수분 사이의 가수분해 결합 반응으로 인해 계면접착력 증가 및 감소하는 경향과 밀접한 연관성이 있는 것으로 판단된다.

전해생성된 염소를 이용한 폐전자 기판의 침출 연구 (Electrogenerated Chlorine Leaching of Electronic Scrap)

  • 김민석;이재천;정진기
    • 한국자원리싸이클링학회:학술대회논문집
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    • 한국자원리싸이클링학회 2005년도 춘계임시총회 및 제25회 학술발표대회
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    • pp.23-27
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    • 2005
  • 본 연구에서는 유가금속 성분이 약 45%인 폐인쇄회로기판을 사용하여 염산 용액에서 전해생성된 염소에 의한 침출 거동을 조사하였다. 폐인쇄회로기판내 유가금속 중 구리는 약 84%에 해당하였다. 전해생성된 염소에 의한 침출거동에 미치는 변수들의 영향을 조사한 결과 염소의 전핸생성 및 교반에 의한 용액으로의 용해 및 혼입 단계가 침출율에 가장 큰 영향을 주었다. 염산농도 1M, 전류밀도 $20\;mA/cm^2$, 교반속도 600 rpm, 용액온도 $50^{\circ}C$의 조건에서 99%의 침출율을 얻었다. 전해생성된 염소의 침출반응 이용율은 교반속도가 높고 전류밀도가 낮을수록 높아졌다. 반응 초기에는 알루미늄, 납, 주석 등 시료내 기타 금속성분들의 침출이 주로 일어났으며, 이러한 반응이 둔화됨에 따라 구리의 침출이 증가하였다.

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Crossover from weak anti-localization to weak localization in inkjet-printed Ti3C2Tx MXene thin-film

  • Jin, Mi-Jin;Um, Doo-Seung;Ogbeide, Osarenkhoe;Kim, Chang-Il;Yoo, Jung-Woo;Robinson, J. W. A.
    • Advances in nano research
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    • 제13권3호
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    • pp.259-267
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    • 2022
  • Two-dimensional (2D) transition metal carbides/nitrides or "MXenes" belong to a diverse-class of layered compounds, which offer composition- and electric-field-tunable electrical and physical properties. Although the majority of the MXenes, including Ti3C2Tx, are metallic, they typically show semiconductor-like behaviour in their percolated thin-film structure; this is also the most common structure used for fundamental studies and prototype device development of MXene. Magnetoconductance studies of thin-film MXenes are central to understanding their electronic transport properties and charge carrier dynamics, and also to evaluate their potential for spin-tronics and magnetoelectronics. Since MXenes are produced through solution processing, it is desirable to develop deposition strategies such as inkjet-printing to enable scale-up production with intricate structures/networks. Here, we systematically investigate the extrinsic negative magnetoconductance of inkjetprinted Ti3C2Tx MXene thin-films and report a crossover from weak anti-localization (WAL) to weak localization (WL) near 2.5K. The crossover from WAL to WL is consistent with strong, extrinsic, spin-orbit coupling, a key property for active control of spin currents in spin-orbitronic devices. From WAL/WL magnetoconductance analysis, we estimate that the printed MXene thin-film has a spin orbit coupling field of up to 0.84 T at 1.9 K. Our results and analyses offer a deeper understanding into microscopic charge carrier transport in Ti3C2Tx, revealing promising properties for printed, flexible, electronic and spinorbitronic device applications.

3D 프린팅으로 제조한 알루미늄 합금의 크로메이트 코팅 (Chromate Conversion Coating on 3D Printed Aluminum Alloys)

  • 신홍식;김효태;김기승;최혜윤
    • 한국기계가공학회지
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    • 제21권2호
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    • pp.109-115
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    • 2022
  • The demand for metal 3D printing technology is increasing in various industries. The materials commonly used for metal 3D printing include aluminum alloys, titanium alloys, and stainless steel. In particular, for applications in the aviation and defense industry, aluminum alloy 3D printing parts are being produced. To improve the corrosion resistance in the 3D printed aluminum alloy outputs, a post-treatment process, such as chromate coating, should be applied. However, powdered materials, such as AlSi7Mg and AlSi10Mg, used for 3D printing, have a high silicon content; therefore, a suitable pretreatment is required for chromate coating. In the desmut step of the pretreatment process, the chromate coating can be formed only when a smut composed of silicon compounds or oxides is effectively removed. In this study, suitable desmut solutions for 3D printed AlSi7Mg and AlSi10Mg materials with high silicon contents were presented, and the chromate coating properties were studied accordingly. The smut removal effect was confirmed using an aqueous desmut solution composed of sulfuric, nitric, and hydrofluoric acids. Thus, a chromate coating was successfully formed. The surfaces of the aluminum alloys after desmut and chromate coating were analyzed using SEM and EDS.

산화처리된 PCB 스크랩을 첨가한 Al2O3-SiO2-CaO 3성분계 슬래그의 점도 (Viscosity Change of Al2O3-SiO2-CaO Slag System with Used Electronic Scrap)

  • 권의혁;한신석;지재홍;한정환;유병돈;김병수;이재천
    • 한국재료학회지
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    • 제13권4호
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    • pp.239-245
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    • 2003
  • In order to explore the possibility to extract precious metals from PCB(Printed Circuit Board) scrap by gravity separation, a high temperature melting process was adopted, from the recycling view point, to investigate the influence of viscosity on A1$_2$$O_3$-CaO$-SiO_2$ slag system composed of PCB scrap. For optimizing the pre-treatment process of PCB scrap, an experimental condition for the complete calcination and oxidation of organic materials in PCB scrap was established and a quantitative analysis of oxidized PCB scrap was also carrie out. It was found that 6 hours were enough for the complete oxidation of PCB scrap at 1273 K in an atmosphere condition. A slag, l5wt%$A1_2$$O_3$-45wt%CaO-40wt%SiO$_2$, was chosen as a basic slag composition which is determined based on the quantitative analysis of PCB scrap. Viscosities were measured in slag systems both made from pure fluxes and from PCB scrap with additional fluxes. Slag viscosities composed of pure fluxes were measured to be 5.29 poise and 30.52 poise at temperatures of 1773 and 1573 K, whereas that of PCB scrap with additional fluxes were 3.37 poise and 69.89 poise, respectively.

영양.식생활 교육자료의 인증 심사기준 개발 연구 (Establishment of accreditation criteria for nutrition and dietary education materials)

  • 이경애;김지명;박유경;이경혜;오상우;이희승
    • Journal of Nutrition and Health
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    • 제46권5호
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    • pp.470-481
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    • 2013
  • This study provides standardized scientific criteria for education materials on nutrition and diet that could be used in schools, workplaces, and health and medical facilities. The study was conducted from April 2011 to October 2011. Literature reviews, institutional visits, and telephone interviews were conducted for the first draft of the accreditation criteria. Expert meeting and advisory councils were conducted in order to obtain feedback after development of the first draft of accreditation criteria. In order to verify the validity and reliability of the first draft on certification criteria, a survey was sent out to 143 professionals, including professors, researchers, health and medical experts, teachers, nutrition teachers, dietitians, and clinical nutritionists. After several modifications, the final accreditation criteria were established for 1) printed materials (authority, credibility, objectivity, organization, editing, real-life usability, activities and participation, and public interest), 2) web-sites (authority, credibility, objectivity, design, real-life usability, accessibility, currency, and public interest) and 3) materials with activities (credibility, organization, design, convenience of utilizing, safety, and public interest). Out of several criteria, contents (authority, credibility. and objectivity) and publicity (public interest) areas are mandatory requirements. For the accreditation, books for learning and materials with activities are required to meet more than six evaluation components, and the other materials are required to meet more than five evaluation components, including the required area. Accreditation criteria developed in this study could be used as a standard for development or selection of good education materials for nutrition and dietary life.

PCB스크랩으로부터 유가금속성분 회수를 위한 용융처리 (Melting of PCB scrap for the Extraction of Metallic Components)

  • 권의혁;장성환;한정환;김병수;정진기;이재천
    • 한국재료학회지
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    • 제15권1호
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    • pp.31-36
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    • 2005
  • It is well known that PCB (Printed Circuit Board) is a complex mixture of various metals mixed with various types of plastics and ceramics. In this study, high temperature pyre-metallurgical process was investigated to extract valuable metallic components from the PCB scrap. For this purpose, PCB scrap was shredded and oxidized to remove plastic materials, and then, quantitative analyses were made. After the oxidation of the PCB scrap, $30.6wt\%SiO_2,\;19.3wt\%Al_2O_3\;and\;14wt{\%}CaO$ were analyzed as major oxides, and thereafter, a typical composition of $32wt\%SiO_2-20wt\%Al_2O_3-38wt{\%}CaO-10wt\%MgO$ was chosen as a basic slag system for the separation of metallic components. Moreover a size effect of crushed PCB scrap was also investigated. During experiments a high frequency induction furnace was used to melt and separate metallic components. As a result, it was found that the size of oxidized PCB scrap was needed to be less 0.9 m to make a homogeneous liquid slag and to recycle metallic components over $95\%$.

전해생성(電解生成)된 염소(鹽素)에 의한 폐인쇄회로기판(廢印刷會路基板)으로부터 동(銅)의 침출(浸出) (Leaching of Copper from Waste Printed Circuit Boards Using Electro-generated Chlorine in Hydrochloric Acid)

  • 김민석;이재천;정진기;김병수;김은영
    • 자원리싸이클링
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    • 제14권5호
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    • pp.45-53
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    • 2005
  • 염산용액에서 전해생성 된 염소를 이용하여 폐프린터의 인쇄회로기판으로부터 동을 침출하는 연구를 수행하였다. 폐인쇄회로기판을 분쇄한 다음 입자크기가 $0.6{\sim}1.2mm$인 비자성 성분을 선별하여 침출실험을 행하였다. 비자성 분쇄물 중 금속성분의 평균함량은 45wt%이었으며, 동이 금속성분의 83.6wt% 이었다. 1 M 염산용액에서 전해생성된 염소에 의한 동의 침출반응은 전류밀도와 교반속도에 크게 영향을 받았다. 염산농도: 1 M, 전류밀도: $20mA/cm^2$, 침출온도: $50^{\circ}C$, 침출시간: 180분, 교반속도: 600rpm의 침출조건에서 동의 침출율은 98%로서 침출액에서 농도는 3.69g/l 해당하였다. 동의 침출반응에 대한 전해생성 된 염소의 이용율은 교반속도가 높고 인가전류밀도가 낮을 수록 높았다. 또한 침출반응 초기에는 알루미늄, 납, 주석 등의 기타금속 성분의 침출이 활발하고 동의 침출반응은 억제되었다.