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Leaching of copper and silver from ground mobile phone printed circuit boards using nitric acid  

Le, Long Hoang (Department of Resources Recycling, Korea University of Science and Technology)
Yoo, Kyong-Keun (Minerals and Materials Processing Division, KIGAM)
Jeong, Jin-Ki (Minerals and Materials Processing Division, KIGAM)
Lee, Jae-Chun (Minerals and Materials Processing Division, KIGAM)
Publication Information
Resources Recycling / v.17, no.3, 2008 , pp. 48-55 More about this Journal
Abstract
Leaching of copper and silver from mobile phone PCBs(printed circuit boards) with nitric acid was performed to investigate the effects of nitric acid concentrations, leaching temperatures, agitation speeds, and pulp densities on the leaching behaviors of Cu and Ag. The leaching rate considerably increased with increasing acid concentration and temperature. The leaching ratios of Cu and Ag were found to be 96.4% and 96.5%, respectively, under the optimum condition; at $80^{\circ}C$ with 2mol/L $HNO_3$ and 120g/L in pulp density within 39minutes. The kinetic parameters were determined based on the shrinking core model with reaction control corresponding to small particles. The activation energies for the leaching of copper and silver were found to be 45.5kJ/mol and 60.5kJ/mol at $35{\sim}80^{\circ}C$ with 2mol/L $HNO_3$, respectively.
Keywords
mobile phone; printed circuit boards; silver; copper; recycling; nitric acid;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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