• Title/Summary/Keyword: Printed electronics

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Microstructural Changes of AA1100 According to the Processing Number of Multi-Axial Diagonal Forging (MADF) (다축대각단조(MADF) 가공횟수에 따른 AA1100의 미세조직 변화)

  • Kwon, S.C.;Kim, S.T.;Kim, D.V.;Kim, M.S.;Lee, S.;Choi, S.H.;Jeong, H.T.
    • Transactions of Materials Processing
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    • v.28 no.2
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    • pp.63-70
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    • 2019
  • This study investigates the effects of multi-axial diagonal forging (MADF) processing number on the microstructures of AA1100 fabricated using MADF processes. The cast AA1100 was annealed at $400^{\circ}C$ for 3hrs in $N_2$ atmosphere and cut into $25mm^3$ cubes for the MADF processes. The MADF process consist of plane forging with a thickness reduction of 30% and a diagonal forging with a diagonal forging angle of 135 degrees. In order to analyze the microstructural variations based on the number of repetitions, 1, 2, 3 and 4 cycles of the MADF process were performed. AA1100 specimens were successfully deformed without cracking of the surface for up to 4 cycles of MADF. The grain size, average misorientation and average grain orientation spread (GOS) of MADF processed materials were analyzed using EBSD technique. The results showed that MADF process effectively refined the microstructure of AA1100 with an initial average grain size of $337.4{\mu}m$. The average grain sizes of specimens which were MADF processed for 2, 3, 4 cycles were refined to be $1.9{\mu}m$, $1.6{\mu}m$, $1.4{\mu}m$, respectively. The grain refinement appeared saturated when AA1100 got MADF processed over 2 cycles. When the specimen was subjected to two or more cycles of MADF, the degree of decrease in the average grain size drastically decreased with an increase in the number of cycle due to the softening phenomena such as dynamic recovery or dynamic recrystallization during processing.

Broadband power amplifier design utilizing RF transformer (RF 트랜스포머를 사용한 광대역 전력증폭기 설계)

  • Kim, Ukhyun;Woo, Jewook;Jeon, Jooyoung
    • Journal of IKEEE
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    • v.26 no.3
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    • pp.456-461
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    • 2022
  • In this paper, a two-stage single-ended power amplifier (PA) with broadband gain characteristics was presented by utilizing a radio frequency (RF) transformer (TF), which is essential for a differential amplifier. The bandwidth of a PA can be improved by designing TF to have broadband characteristics and then applying it to the inter-stage matching network (IMN) of a PA. For broadband gain characteristics while maintaining the performance and area of the existing PA, an IMN was implemented on an monolithic microwave integrated circuit (MMIC) and a multi-layer printed circuit board (PCB), and the simulation results were compared. As a result of simulating the PA module designed using InGaP/GaAs HBT model, it has been confirmed that the PA employing the proposed design method has an improved fractional bandwidth of 19.8% at a center frequency of 3.3GHz, while the conventional PA showed that of 11.2%.

Bactericidal Effect of a 275-nm UV-C LED Sterilizer for Escalator Handrails: Optimization of Optical Structure and Evaluation of Sterilization of Six Bacterial Strains

  • Kim, Jong-Oh;Jeong, Geum-Jae;Son, Eun-Ik;Jo, Du-Min;Kim, Myung-Sub;Chun, Dong-Hae;Kim, Young-Mog;Ryu, Uh-Chan
    • Current Optics and Photonics
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    • v.6 no.2
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    • pp.202-211
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    • 2022
  • In the pasteurization of escalator handrails using ultraviolet (UV) sterilizers, a combination of light distribution and escalator speed has priority over other important factors. Furthermore, since part of the escalator handrail has a curved structure, proper design is needed to improve the sterilization rate on the surfaces touched by users. In this paper, two types of sterilizers satisfying these conditions are manufactured with 275-nm UV-C LEDs, after modeling the three-dimensional (3D) structure of an escalator handrail and simulating optical distributions of UV-C irradiation on the handrail's surface according to light-emitting diode (LED) positions and reflector variations in the sterilizers. Pasteurization experiments with the UV-C LED sterilizers are conducted on six types of gram-positive and gram-negative bacteria, with exposure times of 0.2, 5, and 15 s at an actual installation distance of 20 mm. The sterilization rates for the gram-positive bacteria are 10.63% to 27.94% at 0.2 s, 89.44% to 96.30% at 5 s, and 99.64% to 99.88% at 15 s. Those for the gram-negative bacteria are 57.70% to 77.63% at 0.2 s, 98.90% to 99.49% at 5 s, and 99.88% to 99.99% at 15 s. The power consumption of the UV-C LED sterilizer is about 8 W, which can be supplied by a self-generation module instead of an external power supply.

Plasma Application Technology of FOWLP (Fan-out Wafer Level Packaging) Process (FOWLP(Fan-out Wafer Level Packaging) 공정의 플라즈마 응용 기술)

  • Se Yong Park;Seong Eui Lee;Hee Chul Lee;Sung Yong Kim;Nam Sun Park;Kyoung Min Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.1
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    • pp.42-48
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    • 2023
  • Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

Design and Fabrication of Miniaturized Chipless RFID Tag Using Modified Bent H-shaped Slot (변형된 구부러진 H-모양 슬롯을 이용한 소형 Chipless RFID 태그 설계 및 제작)

  • Junho Yeo;Jong-Ig Lee
    • Journal of Advanced Navigation Technology
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    • v.27 no.6
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    • pp.815-820
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    • 2023
  • In this paper, the design method of a miniaturized chipless RFID tag using a modified bent H-shaped slot was proposed. The proposed modified bent H-shaped slot was appended on the rectangular conductor plate printed on one side of a 20 mm × 50 mm FR4 substrate with a thickness of 0.8 mm. The resonant dip frequency of the bistatic RCS for the proposed modified bent H-shaped slot was compared with the cases when the H-shaped, U-shaped slot, and bent H-shaped slots were added, respectively, on the conductor plate. The simulated resonant dip frequencies for H-shaped, U-shaped, and bent H-shaped slots were 5.907 GHz, 4.918 GHz, and 4.364 GHz, respectively. When the proposed modified bent H-shaped slot was added, the resonant dip frequency was decreased to 3.741 GHz, and, therefore, the slot length was reduced by 36.7% compared to the H-shaped slot case. Experiment results show that the resonant dip frequency of the fabricated modified bent H-shaped slot was 3.9 GHz.

The Study of Hole Injection Characteristics in Solution-Processed Copper (I) Thiocyanate (CuSCN) Film (용액 공정 처리된 구리(I) 티오시아네이트(CuSCN) 필름의 정공 주입 특성 연구)

  • Eun-Jeong Jang;Baeksang Sung;Sungmin Kwon;Yoonseuk Choi;Jonghee Lee;Jae-Hyun Lee
    • Applied Chemistry for Engineering
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    • v.35 no.1
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    • pp.61-65
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    • 2024
  • The effectiveness of CuSCN as a hole injection layer in large-area organic light-emitting diodes, organic solar cells, and thin-film transistors has been well demonstrated. Therefore, in this study, the surface, optical, and electrical analyses of CuSCN were carried out according to the solution process conditions in order to propose optimized film conditions. Various CuSCN solution concentrations were prepared to determine the film surface characteristics and to determine whether the film surface affects the electrical performance of the device. When the CuSCN solution concentration was low, the CuSCN film was not formed and coated in the form of islands, and when the solution concentration was increased, the CuSCN film was formed uniformly, which contributed to improving the conductivity of the device. In addition, a hole-only device was fabricated to demonstrate the role of CuSCN as a hole transport layer.

Miniaturization of Chipless RFID Tag Using Interdigital-Capacitor-Shaped Slot Resonator (인터디지털-커패시터-모양 슬롯 공진기를 이용한 Chipless RFID 태그의 소형화)

  • Junho Yeo;Jong-Ig Lee
    • Journal of Advanced Navigation Technology
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    • v.28 no.4
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    • pp.538-543
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    • 2024
  • In this paper, the miniaturization of a chipless RFID tag using an interdigital-capacitor-shaped slot was studied. The proposed interdigital-capacitor-shaped slot was appended on the rectangular conductor plate printed on one side of a 20 mm × 50 mm FR4 substrate with a thickness of 0.8 mm. The resonant dip frequency of the bistatic RCS for the proposed interdigital-capacitor-shaped slot was compared with the cases when the H-shaped and modified bent H-shaped slots were added, respectively, on the conductor plate. The simulated resonant dip frequencies for H-shaped and modified bent H-shaped slots were 5.907 GHz and 3.741 GHz, respectively. When the proposed interdigital-capacitor-shaped slot was added, the resonant dip frequency was decreased to 2.889 GHz, and, therefore, the slot length was reduced by 51.1% compared to the H-shaped slot case. Experiment results show that the resonant dip frequency of the fabricated nterdigital-capacitor-shaped slot was 3.07 GHz.

Effect of reference objects on the accuracy of digital implant impressions in partially edentulous arches

  • Vygandas Rutkunas;Darius Jegelevicius;Justinas Pletkus;Liudas Auskalnis;Mykolas Akulauskas;Tan Firat Eyuboglu;Mutlu Ozcan;Agne Gedrimiene
    • The Journal of Advanced Prosthodontics
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    • v.16 no.5
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    • pp.302-310
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    • 2024
  • PURPOSE. This study assesses the impact of additional reference objects (RO) on the trueness and precision of distance and angle measurements between scan bodies in digital scans with four different intraoral scanners (IOS) in partially edentulous models. MATERIALS AND METHODS. Maxilla models (Frasaco, Frasaco GmbH, Tettnang, Germany) with one (3-U) and two (4-U) missing posterior teeth were 3D printed and fitted with dental implants and scan bodies. Four intraoral scanners (Primescan (Dentsply Sirona, Charlotte, NC, USA) (PS), Trios 3 (3Shape) (T3), Trios 4 (3Shape) (T4), and CS3600 (Carestream Dentistry) (CS)) captured digital implant impressions with and without additional RO. Scans were aligned and assessed for distance and angulation measurements between scan bodies. Statistical analyses compared trueness and precision across model groups using the Student t-test and Welch's ANOVA. RESULTS. CS consistently showed the highest distance values across IOS devices in both the 4-U and 3-U models (P < .05), both with and without RO. The distance values were not considerably affected by the presence of RO (P > .05), except for a few isolated cases in the PS and CS groups of 3-U models. When measuring angles, CS usually showed greater values than the other IOS devices, especially when RO was present both in the 4-U and 3-U variants (P < .05). CONCLUSION. The influence of additional reference objects on accuracy varies with different scanner types, irrespective of edentulous area length.

Characterization Method for Testing Circuit Patterns on MCM/PCB Modules with Electron Beams of a Scanning Electron Microscope (MCM/PCB 회로패턴 검사에서 SEM의 전자빔을 이용한 측정방법)

  • Kim, Joon-Il;Shin, Joon-Kyun;Jee, Yong
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.9
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    • pp.26-34
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    • 1998
  • This paper presents a characterization method for faults of circuit patterns on MCM(Multichip Module) or PCB(Printed Circuit Board) substrates with electron beams of a SEM(Scanning Electron Microscope) by inducing voltage contrast on the signal line. The experimentation employes dual potential electron beams for the fault characterization of circuit patterns with a commercial SEM without modifying its structure. The testing procedure utilizes only one electron gun for the generation of dual potential electron beams by two different accelerating voltages, one for charging electron beam which introduces the yield of secondary electron $\delta$ < 1 and the other for reading beam which introduces $\delta$ > 1. Reading beam can read open's/short's of a specific net among many test nets, simultaneously discharging during the reading process for the next step, by removing its voltage contrast. The experimental results of testing the copper signal lines on glass-epoxy substrates showed that the state of open's/short's had generated the brightness contrast due to the voltage contrast on the surface of copper conductor line, when the net had charged with charging electron beams of 7KV accelerating voltages and then read with scanning reading electron beams of 2KV accelerating voltages in 10 seconds. The experimental results with Au pads of a IC die and Au plated Cu pads of BGA substrates provided the simple test method of circuit lines with 7KV charging electron beam and 2KV reading beam. Thus the characterization method showed that we can test open and short circuits of the net nondestructively by using dual potential electron beams with one SEM gun.

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a contrastive analysis study of the design strategy of corporate image in the advertise halls of SAMSUNG and LG Electronics Co., Ltd. (삼성, 엘지 가전사의 전시${\cdot}$홍보관에 나타난 기업이미지 디자인전략 비교분석연구)

  • 박성주;최인규
    • Archives of design research
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    • v.15 no.4
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    • pp.1-14
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    • 2002
  • In the past, companies concentrated their efforts on developing new technologies and producing new products. But new technologies in this information age do not make difference any more comparing to other companies. In this marketing environment, a company must appeal strongly their own image to the customers' brains to make better difference than other companies do. One of the best way to make their own image in the customer's brains might be outgrowing themselves of the one-way communication such as the printed-media or broadcast-media and preparing some space such as advertisement halls or pavilions where customers and companies meet each other and make mutual communications between both of them. Therefore, we need to study systematically on the design elements in the advertisement halls or pavilions. To begin with, we should lully understand the basic idea by looking up the reference literature. We case-studied on the basic of constructive elements of advertise halls of both SAMSUNG and LG Electronics Co. The purpose of this study is to realize that we can transfer effectively the company's image to the customers only if we fully understand company's business philosophy and vision in advance to start design the advertisement hails. We should also realize that it is also important to manage systematically the company's design strategic elements' to achieve its changing goals in more logical and scientifically way.

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