• 한국재료학회지
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• 제21권12호
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• pp.673-678
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• 2011

With an increased production of Printed Circuit Boards (PCBs) in electronic equipment, the consumption of solder alloys is growing globally. Recently, increasing importance of recycling solder scrap has been recognized. Generally, solder scrap contains many impurities such as plastics and other metals. Hazardous components must be eliminated for recycling solder scrap. The present work studied pretreatment for reuse of solder scrap alloys. An experiment was conducted to enhance the cleanliness of solder scrap melt and eliminate impurities, especially lead. Physical separation with sieving and magnetic force was made along with pyrometallurgical methods. A small decrease in lead concentration was found by high temperature treatment of solder scrap melt. The impurities were removed by filtration of the solder scrap melt, which resulted in improvement of the melt cleanliness. A very low concentration of lead was achieved by a zone melting treatment with repeated passage. This study reports on a pretreatment process for the reuse of solder scrap that is lead free.

• 센서학회지
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• 제30권5호
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• pp.342-348
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• 2021

For the characterization or failure analysis of electronic devices such as PCB (printed circuit boards), the most common method is the measurement of voltage waveforms with an oscilloscope. However, because there are many types of problems that cannot be detected by voltage waveform analysis, several other methods such as X-ray transmission, infrared imaging, or eddy current measurement have been applied for these analyses. However, these methods have also been limited to general analyses because they are partially useful in detecting physical defects, such as disconnections or short circuits. Fundamentally current waveform measurements during the operation of electronic devices need to be performed, however, commercially available current sensors have not yet been developed, particularly for applications in highly integrated PCB products with sub-millimeter fine pitch. In this study, we developed a highly sensitive PHR (planar hall resistance) magnetic sensor for application in highly integrated PCBs. The developed magnetic sensor exhibited sufficient features of an ultra-small size of less than 340 ㎛, magnetic field resolution of 10 nT, and current resolution of 1 mA, which can be applicable for PCB analyses. In this work, we introduce the development process of the magnetic sensing probe and its characteristic results in detail, and aim to extend this pin-type current probe to applications such as current distribution imaging of PCBs.

• 한국재료학회지
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• 제22권7호
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Transactions on Electrical and Electronic Materials
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• 제17권5호
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.

• 마이크로전자및패키징학회지
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• 제29권3호
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• pp.55-61
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• 2022

본 연구에서는 용융온도가 중온계 무연 솔더인 Sn-3.0Ag-0.5Cu(SAC305)와 저온계 무연 솔더인 Sn-57Bi-1Ag를 사용하여 형성된 복합 무연 솔더 접합부의 특성에 대하여 보고 하였다. SAC305 솔더볼이 형성된 ball grid array(BGA) 패키지와 Sn-57Bi-1Ag 솔더 페이스트가 도포된 flame retardant-4(FR-4) 인쇄회로기판(printed circuit board, PCB)을 리플로우 솔더링 공정을 이용하여 복합 무연 솔더 접합부를 형성 하였다. 공정 온도 프로파일을 두 가지 형태로 달리하여 리플로우 솔더링 공정을 진행하였으며 리플로우 솔더링 공정 조건에 따른 계면 반응, 금속간화합물(intermetallic compound, IMC)의 형성, Bi의 확산 거동 등 복합 무연 솔더 접합부 계면 특성을 비교 분석 하였다. 또한, 열 충격 시험을 통하여 리플로우 솔더링 공정에 따른 복합 무연 솔더 접합부의 신뢰성 특성을 비교하고 열 충격 시험 전후 전단 시험을 진행하여 접합부의 기계적 특성 변화를 분석하였다.

• 자원리싸이클링
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• 제16권3호
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• pp.3-11
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• 2007

현재 금의 대부분은 금광과 납, 구리 등의 비철금속을 제련하는 공정에서 발생되는 부산물인 양극 슬라임으로부터 제련되고 있다. 뿐만 아니라 금은 사용 후 수거되는 치과 의료용 재료와 폐도금액 그리고 폐인쇄회로기판(폐PCBs) 등의 폐기물로부터 상당량이 제련되고 있다. 금광과 수거되는 고 함량 금함유 폐기물로부터 금을 제련하는 방법에는 크게 염화법, 청화법, 아말감법 등이 있으며, 비철금속 제련공정상의 부산물인 양극 슬라임으로부터 금을 제련하는 방법에는 전기분해법이 있다. 전기분해법은 크게 배소-고온용융-전기분해 공정으로 구성되어 진다. 또한 폐PCBs 같은 저 함량 금함유 폐기물로부터 금을 제련하는 방법에는 주로 건식법이 사용되고 있다. 본 고에서는 금을 제련하는 기술 현황에 대하여 소개하고, 이어서 최근에 국내에서 개발 중인 금제련 기술개발을 간략히 소개하고자 한다.

• 비파괴검사학회지
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• 제27권1호
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• pp.8-14
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• 2007

비파괴검사기법에 활용되고 있는 X-선 디지털 영상합성법(digital tomosynthesis)에서 단층영상의 선명도를 향상시킬 수 있는 방법을 개발하였다. 기존의 SAA (shift-and-add) 알고리즘은 blur artefact로 인하여 재구성된 단층영상이 매우 흐린 단점이 있다. 본 연구에서는 SAA에서 blur artefact가 발생되는 물리적 메커니즘에 착안하여, 최초 재구성된 단층영상에서 관심있는 단층의 데이터를 모두 0의 값으로 대체한 후 이를 다시 FP (forward projection) 및 BP (backprojection)를 수행하여 관심있는 단층에서의 blur artefact를 추출 보정하여 단층영상을 복원하고자 하였다. 개발한 알고리즘을 검증하기 위해 실제 실험 및 몬테칼로(Monte Carlo) 시뮬레이션을 통해 기존 SAA 방법과 비교하였으며, 단층영상의 선명도가 크게 향상됨을 확인하였다.

• 한국산학기술학회논문지
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• 제19권12호
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• pp.1-6
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• 2018

본 논문은 레이더 장비에 적용되는 통신 IC 소비 전력 개선을 통한 회로카드조립체 품질 향상에 관한 연구이다. 본 논문에서 언급하는 레이더는 현재 양산이 진행중이며, 군에서 사용중인 장비이다. 군에서 레이더 운용중 DC 28V를 입력으로 받아 DC 5V로 변환시키는 회로카드조립체에서 유독 반복적 고장이 지속적으로 발생했다. 따라서 해당 회로카드조립체 고장에 대한 원인분석을 수행하였다. 그 결과 특정 통신 IC에서 소비되는 전력이 매우 높음을 발견하였으며, 그에 따라 발생된 열에 의해 주위 부품이 소손됨을 알 수 있었다. 따라서 레이더 체계 규격을 모두 만족하는 개선된 부품으로 변경하였다. 변경된 부품에 대하여 체계 영향성 확인을 위한 체계 부착시험을 수행하여 검증하였으며, 환경시험(고온저장 및 운용시험, 저온저장 및 운용시험, 습도시험, 진동시험, EMI 시험)을 통해 레이더 체계에서 요구하는 성능요구조건을 모두 만족함을 확인하였다. 이번 개선을 통해 현재까지 절연 회로카드조립체에서 발생한 고장은 없으므로 해당 회로카드조립체의 품질이 향상됨을 확인하였다.

• 실천공학교육논문지
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• 제16권2호
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• pp.179-184
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• 2024

인쇄회로기판(PCB)은 전자 제품 생산에 널리 적용되는 요소부품으로 지속적으로 양적인 성장은 물론 집적도와 같은 질적인 발전도 묵과할 수 없다. 제조현장에서 보편적으로 웨이브 솔더링 장비가 사용되고 있으나 선행 연구 및 시제품 개발 단계에서는 각 PCB 제원에 맞는 전용 장비 환경을 구성할 수 없고, 범용의 고정 장비 환경에서 정해진 시간 내에 장비의 설정 조건만 변경하여 다양한 제품 군을 생산할 수밖에 없는 것이 일반적이다. 본 연구에서는 위와 같이 제한된 환경 내에서 최적의 공정 조건을 선택할 수 있도록 PCB 팔레트 도입 사례를 소개한다. 또한 현재 범용 장비에서 생산 가능 여부를 미리 판단할 수 있는 판별식을 제시하여 범용 웨이브 솔더링 장비 환경의 한계로 인해 발생할 수 있는 문제점을 사전에 파악하고 대응하도록 하고 궁극적으로 개발기간 단축 및 생산성 향상을 기대할 수 있도록 한다.

• 한국안전학회지
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• 제37권4호
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• pp.120-128
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• 2022

Printed circuit boards (PCBs) are a basic component in the electronics industry and are widely used in nearly all electronic products, such as mobile phones, tablet computers, and digital cameras, as well as in electric equipment. PCB manufacturing involves the use of many chemicals and chemical processes and therefore has more risks than other manufacturing sectors. This study aims to identify the causes of possible accidents during PCB manufacturing through risk assessment, develop and implement safety measures, and evaluate the effectiveness of these measures. Note that the safety measures developed to mitigate the risks of a certain process were also implemented for other similar processes. The risk assessments conducted over seven years, from 2015 to 2021, at a PCB manufacturing company identified 361 hazardous processes. Between 2016 and 2019, 41-56 hazardous processes were identified per year; such processes decreased to fewer than 20 per year after 2020. Application of the risk assessment results to the improvement of the hazardous processes with the similar characteristics seems to be effective in decreasing the risks. Equipment-related factors such as lack of appropriate maintenance, low work standards, and defective protection devices were responsible for 59.8% of all possible accidents. Because PCB manufacturing involves many chemicals, skin contact with hazardous substances, electric shock, fire, and explosion were the most common types of possible accidents (81.7%). In total, 505 safety measures were implemented, including 157 related to purchase and improvement of equipment and devices for safety (31.1%), 147 related to the installation/modification of fire prevention facilities (29.1%), and 69 related to the use of standard electrical appliances (13.7%). Risk assessment conducted after implementing the safety measures showed that these measures significantly decreased risk; 247 processes (68.4%) had a risk level of 3, corresponding to "very low," and 114 processes (31.6%) showed a risk level of 4, corresponding to "low." In particular, risk assessment of 104 processes with risk scores of 12 and 10 other processes with risk score of 16 showed that the risk decreased to 4 after implementing the safety measures. Thus, implementing these measures in similar manufacturing sectors that involve chemical processes can mitigate risk.