1 |
J. Y. Zhang, W. Xu, W. Zhang, X. Meng, and Y. Zhang "A novel compression algorithm for infrared thermal image sequence based on K-means method", Infrared phys. technol., Vol. 64, pp. 18-25, 2014.
DOI
|
2 |
T. Ueda, T. Oki, and S. Koyanaka, "An automated assessment method for integrated circuit chip detachment from printed circuit board by multistep binarization and template matching of X-ray transmission images", J. Mater. Cycles. Waste. Manag., Vol. 23, pp. 315-322, 2021.
DOI
|
3 |
Y. J. Roh, W. S. Park, and H. Cho, "Correcting image distortion in the X-ray digital tomosynthesis system for PCB solder joint inspection", Image and Vision Computing, Vol. 21, No. 12, pp. 1063-1075, 2003.
DOI
|
4 |
K. Chomsuwan, S. Yamada and M. Iwahara "Bare PCB inspection system with SV-GMR sensor Eddy-current testing probe", IEEE Sens. J., Vol.7, No.5, pp. 890-896, 2007.
DOI
|
5 |
Y. Huang, and J. W. Wu "Infrared thermal image segmentations employing the multilayer level set method for non-destructive evaluation of layered, structure", NDT and E international, Vol. 43, No. 1, pp. 34-44, 2010.
DOI
|
6 |
B. Sinha, T. Q. Hung, T. S. Ramulu, S. Oh, K. W. Kim, D. Y. Kim. F. Terky, and C. G. Kim, "Planar Hall resistance ring sensor based on NiFe/Cu/IrMn trilayer structure", J. of Appl. Phy., Vol. 113, No. 6, pp. 063903(1)-063903(10),, 2013.
DOI
|
7 |
R. Koggalage, K. Chomsuwan, S. Yamada, M. Iwahara, and U.R. Abeyratne, "Giant magnetoresistance based Eddy-current sensor for High-speed PCB defect detection", Proc. of Int. Conf. on Info. and Auto., pp. 170-175, Colombo, Sri Lanka, 2005.
|
8 |
A. Elzwawy, S. J. Kim, A. Talantsev, and C. G. Kim, "Equisensitive adjustment of planar Hall effect sensor's operating field range by material and thickness variation of active layers", J. of Physics D: Applied Physics, Vol. 52, No. 28, pp. 285001(1)-285001(11), 2019.
DOI
|