• Title/Summary/Keyword: Printed Circuit Boards (PCBs)

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A PCB Character Recognition System Using Rotation-Invariant Features (회전 불변 특징을 사용한 PCB 문자 인식 시스템)

  • Jung Jin-He;Park Tae-Hyoung
    • Journal of Institute of Control, Robotics and Systems
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    • v.12 no.3
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    • pp.241-247
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    • 2006
  • We propose a character recognition system to extract the component reference names from printed circuit boards (PCBs) automatically. The names are written in horizontal, vertical, reverse-horizontal and reverse-vertical directions. Also various symbols and figures are included in PCBs. To recognize the character and orientation effectively, we divide the recognizer into two stages: character classification stage and orientation classification stage. The character classification stage consists of two sub-recognizers and a verifier. The rotaion-invarint features of input pattern are then used to identify the character independent of orientation. Each recognizer is implemented as a neural network, and the weight values of verifier are obtained by genetic algorithm. In the orientation classification stage, the input pattern is compared with reference patterns to identify the orientation. Experimental results are presented to verify the usefulness of the proposed system.

Wideband Suppression of Radiated Emissions from a Power Bus in High-Speed Printed Circuit Boards

  • Shim, Yujeong;Kim, Myunghoi
    • Journal of information and communication convergence engineering
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    • v.14 no.3
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    • pp.184-190
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    • 2016
  • We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS-EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.

Selective Leaching Process of Precious Metals (Au, Ag, etc.) from Waste Printed Circuit Boards (PCBs) (廢 PCBs부터 귀금속(Au, Ag 등)의 선택적 침출공정)

  • 오치정;이성오;국남표;김주환;김명준
    • Resources Recycling
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    • v.10 no.5
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    • pp.29-35
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    • 2001
  • This study was carried out to recover gold, silver and valuable metals from the printed circuit boards (PCBs) of waste computers. PCBs samples were crushed under 1 mm by a shredder and separated into 30% conducting and loft nonconducting materials by an electrostatic separator. The conducting materials contained valuable metals which were then used as feed materials for magnetic separation. 42% of magnetic materials from the conducting materials was removed by magnetic separation as nonvaluable materials and the others, 58% of non magnetic materials, was used as leaching samples containing 0.227 mg/g Au and 0.697 mg/g Ag. Using the materials of leaching from magnetic separation, more than 95% of copper, iron, zinc, nickel and aluminium was dissolved in 2.0M sulfuric acid solution, added with 0.2M hydrogen peroxide at $85^{\circ}C$. Au and Ag were not extracted in this solution. On the other hand, more than 95% of gold and 100% of silver were leached by the selective leaching with a mixed solvent (0.2M($NH_4$)$_2$$S_2$$O_3$,0.02M $CuSO_4$,0.4M $NH_4$OH). Finally, the residues were reacted with a NaCl solution to leach Pb whereas sulfuric acid was used to leach Sn. Recoveries reached 95% and 98% in solution, respectively.

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Dismantling of Components from Waste Printed Circuit Boards Using Stannic Chloride Solution (염화주석용액을 이용한 폐인쇄회로기판으로부터 부품의 분리)

  • Park, Yujin;Yoo, Kyoungkeun
    • Resources Recycling
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    • v.30 no.2
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    • pp.24-30
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    • 2021
  • Dismantling tests were performed to separate components from waste printed circuit boards (PCBs) using HCl solution with Sn4+. Then, the effects of agitation speed, reaction temperature, initial Sn4+ concentration, and HCl concentration on the dismantling of components were investigated. No significant effect on the dismantling speed was observed upon changing the agitation speed from 100 to 300 rpm. However, the dismantling rate increased with increasing reaction temperature, Sn4+ concentration, and HCl concentration. In the all-component dismantling tests, when the dismantling ratio increased to 100%, no solder was observed on the boards, and the Sn4+ concentration was ~1,500 mg/L. The dismantling ratio of the components from the PCB increased to 100% within 2 h when 1 mol/L HCl solution with 10,000 mg/L Sn4+ was used at an agitation speed and temperature of 200 rpm and 90 ℃, respectively.

The Leaching and Recovery of Au from Scrap of PCBs (PCBs의 스크랩으로부터 Au 용출과 회수)

  • You, Don-Sang;Park, Cheon-Young
    • Journal of the Korean earth science society
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    • v.35 no.4
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    • pp.259-266
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    • 2014
  • This study was carried out to find an environmental friendly and effective way to leach Au and Ag from scrap of Printed Circuit Boards (PCBs) using sodium-hypochlorite solution. In an EDS analysis, valuable metals such as Cu, Sn, Sb, Al, Ni, Pb and Au were all found in PCBs. The highest leaching rates obtained were 1% of pulp density with a chlorine:hypochlorite of 2:1 and a concentration of NaCl at 2M. The highest Au recovery was observed with the addition of sodium metabisulfite to make a 3M solution. It is confirmed that the leaching agent (chlorine-hypochlorite) could effectively leach Au and Ag from Printed Circuit Boards (scrap parts) and the additive reagent sodium metabisulfite could easily precipitate Au from the chlorine-hypochlorite solution.

Technical Trends in the Patents and Papers for the Recycling of Organic Residues from Waste Printed Circuit Boards (특허(特許)와 논문(論文)으로 본 폐(廢)PCB 유기계(有機界) 잔유물(殘留物) 재활용(再活用) 기술(技術) 동향(動向))

  • Lee, Dai-Soo;Shin, Sera;Cho, Young-Ju;Cho, Bong-Gyoo
    • Resources Recycling
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    • v.22 no.2
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    • pp.71-77
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    • 2013
  • Electronic products such as appliances, computers, and cellular phones have printed circuit boards (PCBs) in common and the PCBs in the waste electronic products contain valuable metals and organic resins. In Korea, recovery and recycling of the organic resins as well as the valuable metallics from the wastes are required indeed as the most of resources are being imported from abroad. In this article, the patents and papers for the recycling of organic residues from the waste PCBs were collected and analyzed. The open patents of USA (US), European Union (EP), Japan (JP), and Korea (KR) and SCI journals from 1979 to 2012 were investigated. The patents and journals were collected using key-words and filtered by the definition of the technology. The patents and journals were analyzed by the years, countries, companies, and technologies and the technical trends were discussed in this paper. It is showed sluggish relatively activity of published papers and patent applications for polymer manufacturing technology in local and abroad.

Analysis of Commercial Recycling Technology and Research Trend of Printed Circuit Boards in Korea (국내 인쇄회로기판의 재활용 상용화 기술 및 연구동향 분석)

  • An, HyeLan;Kang, Leeseung;Lee, Chan-Gi
    • Resources Recycling
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    • v.26 no.4
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    • pp.9-18
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    • 2017
  • Recently, the amount of electronic scrap is rapidly increasing due to the rapid growth of the electronics industry. Among the components of electronic scrap, the printed circuit board(PCB) is an important recycling target which includes common metals, precious metals, and rare metals such as gold, silver, copper, tin, nickel and so on. In Korea, however, PCB recycling technologies are mainly commercialized by some major companies, and other process quantities are not accurately counted. According to present situation, several urban mining companies, research institutes, and universities are conducting research on recovery of valuable metals from PCBs and/or reusing them as raw materials that is different from existing commercialization process developed by major companies. In this study, we analyzed not only current status of collection/disposal process and recycling of waste PCBs in Korea but also the trend of recycling technologies in order to help resource circulation from waste PCBs become more active.

High-Frequency Modeling and the Influence of Decoupling Capacitors in High-Speed Digital Circuits (고속 고밀도 디지털 회로에서 사용되는 디커플링 캐패시터의 고주파 모델링과 영향)

  • 손경주;김진양;이해영;최철승;변정건
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.11a
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    • pp.23-27
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    • 2000
  • Simultaneous Switching Noise (SSN) propagated through parallel power and ground planes in high-speed multilayer printed circuit boards (PCBs) causes malfunction of both digital and analog circuits. To reduce SSN, decoupling capacitors are generally used in the PCBs. In this paper, we improve the equivalent circuit model of decoupling capacitor in high-frequency range to analyze the effect of SSN reduction accurately. The analysis is performed by the microwave and RF design system (MDS) method and the finite difference time domain (FDTD) method. We compared the results by the ideal capacitor model with those by the proposed model.

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Characterization of Metal Composition in Spent Printed Circuit Boards of Mobile Phones (폐휴대폰 내의 인쇄회로기판에 함유된 금속 성분의 변화)

  • Jeong, jinki;Lee, Jae-chun;Choi, Jun-chul
    • Resources Recycling
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    • v.24 no.3
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    • pp.76-80
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    • 2015
  • Mobile phone has become one of the essential items in our daily life. In Korea, it is estimated that more than 20 million cell phones are discarded each year due to advancement in technology, thus creating disposal and environmental pollution. In order to conserve the resources, their proper recycling is essential as it contains both valuable and toxic metals. The economics of the recycling will depend on the amount and value of the metals. Therefore, it is necessary to determine the composition of the metals present in the different cell phones. In the present study, a report is presented on the variation of metal content per year of waste mobile phones. A review has been made for the mobile phones manufactured during the period 2000-2009 and metal content of the printed circuit boards (PCBs) by analyzing their metals. An example of the precious metal palladium and of the heavy metal lead shows the decreasing trend.

Leaching of copper and silver from ground mobile phone printed circuit boards using nitric acid (핸드폰 기판(基板)으로부터 구리와 은의 질산(窒酸) 침출(浸出) 연구(硏究))

  • Le, Long Hoang;Yoo, Kyong-Keun;Jeong, Jin-Ki;Lee, Jae-Chun
    • Resources Recycling
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    • v.17 no.3
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    • pp.48-55
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    • 2008
  • Leaching of copper and silver from mobile phone PCBs(printed circuit boards) with nitric acid was performed to investigate the effects of nitric acid concentrations, leaching temperatures, agitation speeds, and pulp densities on the leaching behaviors of Cu and Ag. The leaching rate considerably increased with increasing acid concentration and temperature. The leaching ratios of Cu and Ag were found to be 96.4% and 96.5%, respectively, under the optimum condition; at $80^{\circ}C$ with 2mol/L $HNO_3$ and 120g/L in pulp density within 39minutes. The kinetic parameters were determined based on the shrinking core model with reaction control corresponding to small particles. The activation energies for the leaching of copper and silver were found to be 45.5kJ/mol and 60.5kJ/mol at $35{\sim}80^{\circ}C$ with 2mol/L $HNO_3$, respectively.