• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2006년도 하계학술대회
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• pp.170-174
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• 2006

In this paper electromagnetic topology (EMT) is used to analyze the lumped components on printed circuit boards (PCBs). It is difficult to obtain desirable results about the electromagnetic coupling problems by using a numerical or an experimental method on complex systems. The EMT can be considered as a helpful method to the analysis of electromagnetic interference / electromagnetic compatibility (EMI/EMC) problems in the complex system. To verify the validity of this method, three types of the PCBs mounting a simple circuit are fabricated and experimented.

• 한국환경과학회지
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• 제24권2호
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• pp.245-251
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• 2015

The main objective of this study is to recovery valuable metals with metal particle size distributions in waste cell phone PCBs(Printed Circuit Boards) by means of pulverization and nitric acid process. The particle size classifier also was evaluated by specific metal contents. The PCBs were pulverized by a fine pulverizer. The particle sizes were classified by 5 different sizes which were PcS1(0.2 mm below), PcS2(0.20~0.51 mm), PcS3(0.51~1.09 mm), PcS4(1.09~2.00 mm) and PcS5(2.00 mm above). Non-magnetic metals in the grinding particles were separated by a hand magnetic. And then, Cu, Co and Ni were separated by 3M nitric acid. Particle diameter of PCBs were 0.388~0.402 mm after the fine pulverizer. The sorting coefficient were 0.403~0.481. The highest metal content in PcS1. And the bigger particle diameter, the lower the valuable metals exist. The recovery rate of the valuable metals increases in smaller particle diameter with same leaching conditions. For further work, it could improve to recovery of the valuable metals effectively by means of individual treatment, multistage leaching and different leaching solvents.

• 한국정밀공학회지
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• 제20권8호
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• pp.76-85
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• 2003

In this paper, a technical method for removing the solder from PCBs has been proposed to simplify the pulverizing process and to get higher quality of materials for recycling of the electronic parts in the Printed Circuit Boards (PCBs). There are several techniques to remove the solder from PCB, such as physical and chemical method, vibration, suction and blowing and so on. Among them, the suction technique turned out the best method by investigation. In the suction method, there are three variables for removing the solder. They are a temperature of the thermal wire, a velocity of moving PCB and a gap between PCB and thermal wire. To find the optimal variables for the system, an experiment has been conducted by a trial and error method. The optimal variables were found $220^{\circ}C$ of temperature, 11.58mm/s of velocity, 10mm of gap (A gap between suction hole and bottom of PCBs is 5mm). The result of the experiment shows that 50% of the solder were removed.

• 한국전자파학회지:전자파기술
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• 제14권1호
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• pp.35-42
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• 2003

Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards (PCBs), offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line (TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3 Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair

• 산업공학
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• 제13권2호
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• pp.195-203
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• 2000

This paper considers the problem of sequencing printed circuit boards(PCBs) on an automatic surface mount device(SMD) placement machine in order to minimize total setup time. Since the total set of component feeders needed by all boards cannot be loaded simultaneously on the magazine, the setup must be made between two successive boards in the sequence. It is assumed that the setup time depends on the number of component feeders to be replaced in the magazine. An important characteristic is that each feeder occupies a different number of slots in the magazine. This problem is equivalent to travelling salesman problem(TSP) except that the distances between two cities, that is, the setup times between two boards, are not known in advance. So, TSP-based heuristics with new distance functions are presented and their performances are compared through various test problems. Computational results indicate that our heuristics outperform existing methods.

• 자원리싸이클링
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• 제11권2호
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• pp.28-35
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• 2002

충격형 분채기에 의한 폐프린트배선기판(PCBs)의 분쇄과정에서 일어나는 금속성분의 분쇄특성에 대한 연구가 수행되었다. PCBs로부터 금속성분들을 단체분리하기 위하여 -3 mm로 파쇄한 다음 충격형 분쇄기를 사용하여 분쇄하였으며 햄머의 회전속도가 금속성분의 분쇄에 미치는 영향을 관찰하였다. 동과 땜납 등과 같은 금속성분들의 입도분포 및 단체분리도를 조사하였다. 경사진동판을 사용하는 PCBs 분쇄물로부터 금속입자들의 형상분리에서 햄머의 회전속도와 입자크기가 미치는 영향을 검토하였다 61.3 m/s 햄머속도에서 동 성분은 +297$\mu$m 입자가 80% 이었지만 땜납성분은 -297$\mu$m 입자가 90%에 달했다. 형상분리법에 의한 금속입자의분리 시 햄머의 회전속도가 클수록 회수위치가 짧았으며 +297 $\mu$m 입자의 회수위치가 -297~+149$\mu$m 입자보다 짧았다. 회수위치가 짧을수록 금속입자의 구형도가 좋았으며 KI 값은 KI=1 로 증가하고, $\phi_{c}$ 값은 $\phi_{c}$ =1로 감소하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.87-88
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• 2007

• 한국기계가공학회지
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• 제15권2호
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• 자원리싸이클링
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• 제24권1호
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• pp.66-72
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• 2015

재활용을 위한 LCD TV 분해 시 영상 신호 송신, 전원 공급, 화상 구현 등을 위한 다양한 종류의 PCB가 발생한다. PCB에는 금이나 구리와 같은 유가금속이 다량 함유 되어 있으나 사용용도, PCB 패키징 방법에 따라 함유 되어 있는 유가금속의 종류와 함유량에 차이가 있다. 본 연구에서는 PCB 종류에 따른 구조 분석을 통하여 PCB에 함유 된 금과 구리의 함유량에 따라 PCB를 등급별로 분류 하고자 하였으며 금 회수 효율이 높은 PCB, 금 회수 효율이 낮은 PCB, 금이 함유되어 있지 않은 PCB 세 종류로 분류를 하였다. 또한 실제 LCD TV를 분해하여 발생된 PCB에 대한 함유량 분석을 통하여 PCB 내 금과 구리 함유량을 분석하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.321-325
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• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.