• ETRI Journal
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• v.35 no.4
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.15-22
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• 2013

Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1587-1588
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• 2006

Tn this paper, PCB (Printed Circuit Board) embedded $BaTiO_3$ MIM capacitors were designed, fabricated, and characterized for low cost organic SOP applications by using 3-D EM simulator and low temperature processes. Size of electrodes and thickness of high dielectric films are optimized for improving the performance characteristics of the proposed embedded MIM capacitors at high frequency regime. The selected thicknesses of the $BaTiO_3$ film are $12{\mu}m$, $16{\mu}m$, and $20{\mu}m$. The fabricated MIM capacitor with dielectric constant of 30 and thickness of $12{\mu}m$ has capacitance density of $21.5p\;F/mm^2$ at 100MHz, maximum quality factor of 37.4 at 300 MHz, a quality factor of 30.9 at 1GHz, self resonant frequency of 5.4 GHz, respectively. The measured capacitances and quality factors are well matched with 3-D EM simulated ones. These embedded capacitors are promising for SOP based advanced electronic systems with various functionality, low cost, small size and volume.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.2
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• pp.1-7
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• 2015

The Light Emitting Diode(LED) lighting control system proposed in this thesis is made up of a sensor module, a microcontroller, Bluetooth wireless communication, LED Driver, and LED downlight. The sensor module, comprised of an infrared sensor, an illumination sensor, and a temperature sensor, was designed to one Printed Circuit board(PCB). The system is able to identify the environment information collected by the sensor, and make it possible to control lighting automatically and manually through sensors. In addition, depending on users' conditions, a color temperature can be controlled. CS-1000, a spectroradiometer, was employed to measure the changing values of a color temperature in 8 steps. According to a test, it was found that it was possible to change a color temperature from 3187K of Warm White LED to 5598K of Cool White LED. The Bluetooth based wireless communication technique makes it possible to control more lighting devices than other wireless communication techniques does.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.10
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• pp.1997-2007
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• 2002

Composite air spindles are appropriate for the high-speed and the high-precision machining as small hole drilling of printed circuit board (PCB) or wafer cutting for manufacturing semiconductors because of the low rotational inertia, the high damping ratio and the high fundamental natural frequency of composite shaft. The axial load and stiffness of composite air spindles fur drilling operation are determined by the thrust ben ring composed of the air supply part mounted on the housing and the rotating part mounted on the rotating shaft. At high-speed rotation, the rotating part of the thrust bearing should be designed considering the stresses induced by centrifugal force as well as the axial stiffness and the natural frequency of the rotating shaft to void the shaft from failure due to the centrifugal force and resonant vibration. In this work, the air supply part of the thrust bearing was designed considering the bending stiffness of the bearing and the applied load. The rotating part of the thrust bearing was designed through finite element analysis considering the cutting forces during manufacturing as well as the static and dynamic characteristics under both the axial and con trifugal forces during high-speed rotation.

• ETRI Journal
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• v.41 no.5
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• pp.670-683
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• 2019

In this paper, we analyzed the signal integrity of a system interconnection module for a proposed high-density server. The proposed server integrates several components into a chassis. Therefore, the proposed server can access multiple computing resources. To support the system interconnection, among the highly integrated computing resources, the interconnection module, which is based on Serial RapidIO, has been newly adopted and supports a bandwidth of 800 Gbps while routing 160 differential signal traces. The module was designed for two different stack-up types on a printed circuit board. Each module was designed into 12- (version 1) and 14-layer (version 2) versions with thicknesses of 1.5T and 1.8T, respectively. Version 1 has a structure with two consecutive high-speed signal-layers in the middle of two power planes, whereas Version 2 has a single high-speed signal placed only in the space between two power planes. To analyze the signal integrity of the module, we probed the S-parameters, eye-diagrams, and crosstalk voltages. The results show that the high-speed signal integrity of Version 2 has a better quality than Version 1, even if the signal trace length is increased.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.339-348
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• 2005

In evaluation of electronic reliability on the PCB(Printed Circuit Board),electrochemical migration is one of main test objects. The phenomenon of electrochemical migration occurs In the environment of the high humidity and the high temperature under bias through a continuous aqueous electrolyte. In this paper, the generating mechanism of electrochemical migration is investigated by using water drop acceleration test under various waters. The waters used in the water drop test are city water, distilled water and ionic water. It found that the generated velocity o of electrochemical migration depended on the temperature of water and the electrolyte quantity which included in the various waters.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Management & Information Systems Review
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• v.29 no.4
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• pp.109-121
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• 2010

In this study, we propose a solution procedure to solve travelling salesman problem(TSP) with special cost function, route dependent travelling salesman problem(RDTSP). First, we develop an integer programming model to describe the problem. In the model, a variable means a possible route. And, the number of variables in this model are extremely large. So, we develop a LP relaxation problem of the IP model and solve the relaxation problem by a column generation technique. The relaxation problem does not guarantee the optimal solution. If we get an integer solution in the ralaxation problem, then the solution is an optimal one. But, if not, we cannot get an optimal solution. So, we approach a branch and price technique. The overall solution procedure can be applied a printed circuit board(PCB) assembly process.