• 한국지구물리탐사학회:학술대회논문집
• /
• 2003.11a
• /
• pp.518-521
• /
• 2003

LCA (Life Cycle Assessment), that unifies the scale of various environmental impacts, and simulated annealing are applied to optimizing electrolysis of wastewater from PCB (Printed Circuit Board) production. The changes of environmental impact can be quantified with LCA and the total changes of environmental impacts can be expressed as a function of power consumed, Cu recycled, $Cl_2$, NOx and SOx discharged through restriction of feasible reactions. In a single-variate condition, the environmental optimum can be easily obtained through plotting and comparing each environmental impact value. In 8V potentiostatic electrolysis, the lowest environmental impact can be achieved after 90min. To optimize a multi-variate conditional system, simulated annealing can be applied and this can give the quick and near optimum in complex systems, where many input and output materials are involved, through experimentally measured values without a theoretical modeling.

• Proceedings of the KIEE Conference
• /
• 2015.07a
• /
• pp.1269-1270
• /
• 2015

외부에서 발생되는 전자파가 특정 구조물 내에 침투하는 경우, 특히 구조체가 도체로 이루어 졌을 때, 구조체의 크기에 따른 특정 주파수가 공진을 일으켜 내부 PCB(Printed Circuit Board), 회로 등에 악영향을 미친다. 본 논문에서는 개구면이 존재하는 공진기에 전자기파가 입사되는 상황을 모드매칭(MM: Mode Matching)을 이용해서 해석한다. 이때 외부 전자파로 인해 개구면에 생기는 새로운 소스를 표면 등가 이론(Surface equivalence theorem)을 이용하여 등가 자기전류로 모델링하여, 공진기 내 외부의 전자기장을 구한 후 개구면에서 접선성분의 경계조건을 적용시켰다. 본 논문에서 사용된 계산식의 검증을 위해 3차원 유한 요소법(FEM: Finite Element Method)기반의 프로그램인 HFSS를 이용 하였다.

• Journal of the Korean Society for Precision Engineering
• /
• v.32 no.7
• /
• pp.627-631
• /
• 2015

Conventional etching technology is in the face of problems such as dishing, erosion resulting from non-uniform removal of film. Advanced printed circuit board (PCB) requires accurate wire formation with the aid of planarization by chemical mechanical polishing (CMP). Linear roll CMP is a line contact continuous process which removes the film by pressurization and rotation while slurry is supplied to polishing pad attached to the roll. This paper focuses on the design of floating nozzle on the linear roll CMP equipment which makes the slurry supply uniformly on the roll pad. Experimental results show that removal rate using the floating nozzle increases 3 times higher than that without it and non-uniformity is less than 15%.

• Journal of Welding and Joining
• /
• v.17 no.1
• /
• pp.77-81
• /
• 1999

Through-hole PCB(Printed Circuit Board) was soldered by flow soldering process using cleaning or noncleaning fluxes. Preheating temperature and conveyor speed were changed in the range of 323∼413K and 0.3∼2m/min respectively. The soldered joints were tensile tested in order to evaluated bonding strength. As experimental results, relatively high tensile fracture load, 120∼140N, were obtained in case of preheating temperature of 383K, and conveyor speed was 0.6∼1.0 m/min. Fractured surfaces of higher tensile strength show some dimple area, while those of lower tensile fracture load show brittle fracture.

• 정보저장시스템학회:학술대회논문집
• /
• 2005.10a
• /
• pp.195-196
• /
• 2005

We report the new design of a miniature electromagnetic actuator for probe-based data storage with anti-vibration mechanism. The actuator consists of a media substrate, silicon frame, 2 pairs of magnets, a spacer, and a printed circuit board (PCB). The total area of the device is $11.2{\times}11.2 mm^2$ while the data recording area is $7.4{\times}7.4 mm^2$. A net momentum fee structure was included for high vibration resistance. The simulation shows that the lateral vibration can be reduced to below 100 nm for 1 G acceleration if the counter mass is adjusted with $1\%$ difference. The peak power for ${\pm}50 {\mu}m$ displacement is below 50 mW for a actuator with a resonance at 200 Hz.

• Journal of electromagnetic engineering and science
• /
• v.11 no.3
• /
• pp.207-212
• /
• 2011

This paper presents a CPW-fed antenna with three slots. The proposed antenna can operate at 1.9~2.1 GHz and 2.9~3.3 GHz which are generated by the two rectangular slots, and 4.5~11.6 GHz which is generated by the main patch. The semicircle-slot is used as a band-notched filter to stop at a desired band (5.150~5.825 GHz) limited by IEEE 802.11a or HIPERLAN/2 applications. The currents concentrate around corresponding slots at the desired band. The proposed antenna is very small in size, with overall dimensions of $27{\times}32{\times}1\;mm^3$ etched onto an FR4-printed circuit board (PCB).

• Journal of the Semiconductor & Display Technology
• /
• v.14 no.3
• /
• pp.57-60
• /
• 2015

Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.10 no.1
• /
• pp.45-48
• /
• 2010

An inter-pin skew compensation scheme is proposed, which minimizes the inter-pin skew of parallel interface induced by unequal trace length and loading of printed circuit board (PCB). The proposed scheme measures the inter-pin skew and compensates during power-up with simple hardware. The proposed scheme is applied to 3.2-Gb/s/pin DDR4 SDRAM and implemented in a 0.18 m CMOS process. The inter-pin skew is compensated in 324-cycles of 400-MHz clock and the skew is compensated to be less than 24-ps.

• Journal of Applied Reliability
• /
• v.10 no.2
• /
• pp.123-135
• /
• 2010

Failure mode and effects analysis (FMEA) is a widely used technique to assess or to improve reliability of products or processes at early stage of development. Traditionally, the prioritization of failures for corrective actions is performed by evaluating risk priority numbers (RPN). In practice, due to insufficient evaluation criteria specific to related products and processes, RPN is not always evaluated properly. This paper reestablishes an effective methodology for prioritization of failure modes in FMEA procedure. Revised evaluation criteria of RPN are devised and a refined FMEA sheet is introduced. To verify the proposed methodology, it is applied to inspection processes of PCB products.

• Proceedings of the Korean Society of Computer Information Conference
• /
• 2012.07a
• /
• pp.63-64
• /
• 2012

본 논문에서는 소형 무인 비행체 (Unmanned Aerial Vehicle, UAV)를 스마트폰을 이용하여 제어하기 위한 방법을 제안하고. UAV에 Wi-Fi 통신 모듈 설계 및 개발 과정을 설명한다. 스마트폰과 UAV는 Wi-Fi를 통해 통신하며, 이것의 instruction set은 MCU에서 C언어로 다운로드 된 로직으로 수행하게 된다. 데이터의 송수신은 Serial 포트를 이용하여 흐름을 제어하며 확인할 수 있다. 또한 관련 모듈들을 통합하기 위해 PCB(Printed Circuit Board)과정을 진행, 소형화하여 개발하였다.