• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.70-78
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• 2009

This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.761-764
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• 2007

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and πace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects.

• The Transactions of the Korea Information Processing Society
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• v.7 no.1
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• pp.135-145
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• 2000

Manufacturing Message Specification (MMS) is designed as a communication standard protocol, ISO/IEC 9506, on factory automation for messaging between heterogeneous programmable unit controller, PLC, NC, Robot, of different vendors on the networks. MMS is also a standard protocol of OSI reference model application layer, In this paper, we show an implementation of MMS over TCP/IP using ANSI-C programming language on the unix environment, and make java classification using java native interface (NJI) with MMS library. The use of java classification provides a basic environment ot overcome a difficult programming with different MMS application programming interface (MMS-I) which requires a siklled programming technique of graphic user interface (GUI). In this paper, we implement a MMS application program of the automated assembly model for printed circuit board based on WWW which shows the operation, control and monitoring of real manufacturing device (RMD) with web browser providing users for consistent user interface.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.81-88
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• 2010

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $4{\times}10^3\;A/cm^2$ conditions in order to investigate the effect of PCB surface finishs on the growth kinetics of intermetallic compound (IMC) in Sn-3.0Ag-0.5Cu solder bump. The surface finishes of the electrodes of printed circuit board (PCB) were organic solderability preservation (OSP), immersion Sn, and electroless Ni/immersion gold (ENIG). During thermal annealing, the OSP and immersion Sn show similar IMC growth velocity, while ENIG surface finish had much slower IMC growth velocity. Applying electric current accelerated IMC growth velocity and showed polarity effect due to directional electron flow.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.5
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• pp.87-92
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• 2019

This study is the analysis of causes of printed circuit board (PCB) in collective protection equipment failure and quality improvement. The equipment is a component of the weapon system currently in operation and serves to defend against enemy chemical and biological attack as well as heating and cooling functions. However, during operation in the military, fans of condensate assembly failed to operate. The cause of the failure is the burning of PCB. It was found that the parts were heated according to the continuous cooling operation under the high temperature environmental conditions. Accordingly, the electronic components exposed to high temperature were deteriorated and destroyed. To solve this problem, PCB apply to heatsink. The performance test of improved PCB has been completed. Futhermore system compatibility, positive pressure maintenance and noise test were performed. This improvement confirmed that no faults have occurred in PCB so far. Therefore, the quality of the equipment has improved.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.15-19
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• 2015

We demonstrated an inspection system for detecting discoloration of PCB Cu ball pad with an OSP surface finish. Though the OSP surface finish has many advantages such as eco-friendly and low cost, however, it often shows a discoloration phenomenon due to a heating process. In this study, the discoloration was analyzed with device-independent CIELAB color space. First of all, the PCB samples were inspected with standard lamps and CCD camera. The measured data was processed with Labview program for detecting discoloration of Cu ball pad. From the original PCB sample image, the localized Cu ball pad image was selected to reduce the image size by the binarization and edge detection processes and it was also converted to device-independent CIELAB color space using $3{\times}3$ conversion matrix. Both acquisition time and false acceptance rate were significantly reduced with this proposed inspection system. In addition, $L^*$ and $b^*$ values of CIELAB color space were suitable for inspection of discoloration of Cu ball pad.

• Journal of Sensor Science and Technology
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• v.32 no.2
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• pp.105-109
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• 2023

In this study, we present a power-efficient driving method for gas sensor systems based on the analysis of input signal characteristics. The analysis of the gas sensor output signal characteristics in the frequency domain shows that most of the signal portions are distributed in a relatively low frequency region when extracting the gas sensor signal, which can lead to further performance improvement of the gas sensor system. Therefore, the proposed gas signal extracting technique changes the operating frequency of the read-out circuit based on the frequency characteristics of the output signal of the gas sensor, resulting in a reduction of power consumption at the whole system level. The proposed sensing technique, which can be applied to a general-purpose commercial gas sensor system, was implemented in a printed circuit board (PCB) to verify its effectiveness at the commercial level.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.6
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• pp.25-29
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• 2017

This paper presents a hetero-integration of electrostatically actuated RF MEMS Switch and step up DC-DC converter on a redistribution layer using commercial PCB process. RF characteristics of Duroid with $56{\Omega}$ impedance GCPW transmission line and that of FR4 with $59{\Omega}$ impedance CPW transmission line were analyzed. From DC to 6GHz, RF characteristics of Duroid were better than that of FR4, insertion loss was 2.08dB lower, return loss was 3.91dB higher, and isolation was 3.33dB higher.

• Journal of the Korean Institute of Intelligent Systems
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• v.25 no.3
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• pp.260-265
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• 2015

This paper proposes a alignment system using edge feature. An alignment system obtains the position and orientation of printed circuit board(PCB) or liquid crystal display(LCD) panel through the fiducial marks. Thus, it is the indicator of the system performance how accurate we detect the positions of the fiducial marks in the target image. Edges have the geometrical characteristics such as positions, lengths, and shapes. These features are suitable for finding the marks and have the advantages of lighting variations, model occlusion, as well as variations in scale and angle. The performance of the proposed system is validated through the alignment experiment using an display panel alignment system included X, Y axis, and rotatable stage.

• The Journal of Information Systems
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• v.22 no.4
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• pp.71-84
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• 2013

The main purpose of this study is to identify the factors influencing the implementation performance of ERP system from the investment such as hardware, software and consulting fee. The main goal of this study to analyze of ERP system implementation in various sections depending on the amount of investment and research about the contribution of ERP utilization on overall PCB business activities. Survey questionnaires were distributed via post and fax to PCB (Printed Circuit Board)Company in Korea. The results of this study can be summarized as follow. First, only 43.1% of respondents implemented ERP system at the enterprise level, which shows that ERP system does not completely play its role as a truly integrated system. Second, companies shows higher satisfaction rate with selectively invested on particular sub-modules. Third, the efficiency of ERP system can be maximized by improving efficiency on core areas through selective investments. Also, this can be maximized by performing overall investments on the general environment in addition to the direct investment on ERP. Lastly, 59.26% of respondents reported that the utilization of ERP has highly significant effects on the contribution of business whereas 29.63% respondents reported as significant effects on the business. These shows positive effects of ERP on the contribution of business.