• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.5
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• pp.444-449
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• 2003

In this paper, a PCB(Printed Circuit Board) antenna for IMT-2000 is designed and analyzed. The antenna has a helical structure with via-holes and lines on FR-4($\varepsilon$$\sub$${\gamma}$/=4.6 ) PCB, and the type of feeding is GCPW(Grounded Co-Planar Waveguide). Using HFSS of Ansoft, the antenna was designed and the measured results of frequency and radiation characteristic,3 with VSWR<2.0 are satisfied within operating frequency band of 1.920∼2.170 GHz. And it has resonating frequency of 2.045 GHz and a bandwidth of 321 MHz. The radiation gain of the antenna was measured to be -1 dBi.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.7 no.5
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• pp.430-439
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• 1996

In printed circuit board (PCB) design, it is necessary to predict the crosstalk effect among traces on the circuitary behavior. In this paper, crosstalk between parallel or crossing traces was treated by the finite difference time domain (FDTD) method. They are the typical models of PCB traces and the crosstalk is a major contributor in the creation of electromagnetic interference (EMI). The crosstalk effect was computed for the variation of distance spacing and length of parallel traces and crossing traces. The results in time and frequency domain are discussed and compared with those using MDS(microwave design system) and HFSS(high frequency structure simulator). The comparison shows that the FDTD method can be of wide application in analysis model and save the time required for calculation.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.6 no.4
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• pp.28-36
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• 1995

The use of image planes can reduce effectively the radiated emissions from a printed circuit board. This work deals with the influence of image planes on radiation from current trace. The configu- rations of one and two layers of image planes on both sides of current trace are proposed. The radiated emissions of those configurations have been calculated by solving a set of electric field integral equations by the method of moments. The induced current distributions on image planes and the radiation patterns are analyzed for different configurations of image planes, the distance between current trace and image planes, and the frequency of signal current.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.72-77
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• 2008

This paper investgated on fabrication process and tolerance of resistance body with a uniform thickness formed by the process of cavity type on organic substrate for application of embedded resistor. To improve the tolerance of resistance value according to a position of PCB cause by conventional screen printing, we introduced the process of cavity type from organic substrate. A resistor with a desired shape and volume was precisely formed by the process of cavity using a resistor paste and screen printing. This method can increase PCB's productivity by shortening its production time because process conditions of a screen prining device can be set quickly without any affection on its position accuracy.

• International Journal of Quality Innovation
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• v.4 no.1
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• pp.160-174
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• 2003

This study researched an enterprise resources planning (ERP) implementation project at a printed circuit board (PCB) manufacturer. In depth research was achieved by participating and observing in an implementation project at an actual PCB manufacturer. It is hoped that this study will contribute a valuable reference resource for future PCB manufacturers that wish to select or implement ERP systems. The first step in implementing ERP software is to set a clear target. At the same time, the tasks of each department and the system of cooperation between departments must be clearly defined. In this way, the cycle time of each flow and the accuracy of data will both be improved. In order to ensure smooth implementation of an ERP project, the followings are key factors: (1) an ERP system that suits the PCB industry; (2) effective project management; (3) effective project cost/budget control; (4) project problem management system; (5) comprehensive implementation method and information technology (IT), etc. By keeping to these principals, Company A achieved rapid transactions, and lower total cycle times and inventory levels, and other such benefits that had been predicted.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.6
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• pp.114-121
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• 2009

Mobile phone is a representative personal communication tool among wireless communication devices. Recently, with the miniaturization and light-weight trend of mobile phone, the vibration motor has been replaced by coin type. The required performances of coin type vibration motor needed by user are long life, higher vibration, and thin thickness. Also the most important factor determines the performance of vibration motor is long-term reliability, which is mainly related to PCB plating technique for commutator. In this study, three types of fault were categorized to analyze the cause for malfunction of vibration motor. And, hardness and surface morphology on plating surface are also investigated to optimize the plating method and plating conditions. As a result, new plating method and conditions were proposed to increase the durability of PCB commutator.

• Journal of the Korea Society for Simulation
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• v.15 no.4
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• pp.59-67
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• 2006

An efficient PCB assembly method with Gantry type machine is developed and proposed in this paper to improve system productivity. Nozzle changes at Gantry type machine is the major reason causing lower system performance instead of header and slot movements on the other type machines. The problem is attacked by maximizing multiple adsorptions to reduce the number of necessary nozzle changes with Gantry type machine. It is designed to reduce the assembly time per PCB with multiple adsorptions based upon the positions of feeders and nozzles. A simulation model is constructed to show the effectiveness of the suggested heuristic and necessarily a comparison study is followed with different methods on selection of next assembly feeder and nozzle with various cases.

• Journal of the Korean Society of Safety
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• v.34 no.4
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• pp.32-40
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• 2019

During the manufacturing process of a printed circuit board(PCB), fumes and mists are generated as the ink dries on the PCB surface. The generated fumes and mists are deposited in the dryer wall and the exhaust duct. Deposited fumes and mists may present a fire hazard if the dryer temperature control system fails. In this study, the thermal stability of the fumes and mists deposited in the dryer and ducts has been analyzed by experimental methods such as thermo gravimetric analysis (TGA), differential scanning calorimetry (DSC), auto ignition temperature (AIT), and multiple mode calorimetry(MMC). According to the experimental analyses, experimental samples are likely to generate gas at the temperature ($180{\sim}240^{\circ}C$) that deviates from the normal operating temperature ($150{\sim}156^{\circ}C$). It has been shown that the thermal stability is degraded when the temperature is deviated from the normal operating temperature. In the end, engineering and management safety measures of accidental prevention have been suggested.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.4
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• pp.471-477
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• 2014

In this paper, a modeling and co-simulation methodology is proposed to predict the radiated electromagnetic interference (EMI) from on-chip switching I/O buffers. The output waveforms of I/O buffers are simulated including the on-chip I/O buffer circuit and the RC extracted on-chip interconnect netlist, package, and printed circuit board (PCB). In order to accurately estimate the EMI, a full-wave 3D simulation is performed including the measurement environment. The simulation results are compared with near-field electromagnetic scan results and far-field measurements from an anechoic chamber, and the sources of emission peaks were analyzed. For accurate far-field EMI simulation, PCB power trace models considering IC switching current paths and external power cable models must be considered for accurate EMI prediction. With the proposed EMI simulation model and flow, the electromagnetic compatibility can be tested even before the IC is fabricated.