Journal of the Korean Society of Safety (한국안전학회지)

The Korean Society of Safety (한국안전학회)
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The Thermal Stability Analysis of Fumes and Mists During the Drying Process of a PCB

PCB 건조공정의 흄과 미스트에 대한 열안정성 분석

  • Chu, Chang Yeop (Department of Safety Engineering, Korea National University of Transportation) ;
  • Lee, Jung Suk (Occupational Safety & Health Research Institute, KOSHA) ;
  • Baek, Jong Bae (Department of Safety Engineering, Korea National University of Transportation)
  • 추창엽 (한국교통대학교 안전공학과) ;
  • 이정석 (한국산업안전보건공단 산업안전보건연구원) ;
  • 백종배 (한국교통대학교 안전공학과)
  • Received : 2019.03.05
  • Accepted : 2019.08.08
  • Published : 2019.08.31
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Abstract

During the manufacturing process of a printed circuit board(PCB), fumes and mists are generated as the ink dries on the PCB surface. The generated fumes and mists are deposited in the dryer wall and the exhaust duct. Deposited fumes and mists may present a fire hazard if the dryer temperature control system fails. In this study, the thermal stability of the fumes and mists deposited in the dryer and ducts has been analyzed by experimental methods such as thermo gravimetric analysis (TGA), differential scanning calorimetry (DSC), auto ignition temperature (AIT), and multiple mode calorimetry(MMC). According to the experimental analyses, experimental samples are likely to generate gas at the temperature ($180{\sim}240^{\circ}C$) that deviates from the normal operating temperature ($150{\sim}156^{\circ}C$). It has been shown that the thermal stability is degraded when the temperature is deviated from the normal operating temperature. In the end, engineering and management safety measures of accidental prevention have been suggested.

Keywords

References

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