• Applied Chemistry for Engineering
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• v.4 no.4
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• pp.639-652
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• 1993

• Journal of Powder Materials
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• v.15 no.1
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• pp.58-62
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• 2008

Reaction bonded silicon carbide (RBSiC) is an important engineering ceramic because of its high strength and stability at elevated temperatures, and it is currently fabricated using reasonably cheap manufacturing processes, some of which have been used since the 1960s. However, forming complicated shapes from these materials is difficult because of their poor workability. The purpose of this work is to join the reaction-bonded SiC parts using a preceramic polymer as joint material. The manufacturing of ceramic material in the system Si-O-C from preceramic silicon containing polymers such as polysiloxanes has attained particular interest. The mixtures of preceramic polymer and filler materials, such as SiC, Si and MoSi, were used as a paste for the joining of reaction sintered SiC parts. The joining process during the annealing in Ar atmosphere at $1450^{\circ}C$ were described. The maximum strength of the joints was 63 MPa for the specimen joined with 10 vol.% of $MoSi_2$ and 30 vol.% of SiC as filler materials. Fracture occurred in the joining layer. This indicates that the joining strength is limited by the strength of the joint materials.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.34.2-34.2
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• 2009

The ceramic coatings on metallic materials have attracted by many researchers due to the chemical inertness of ceramic materials. In such aspect, SiOC is a promising material tobe used as protective coating layer on metallic materials due to its outstanding thermal stability and chemical inertness. In this research, SiOC coating was carried out onto SuS-316 substrate using Cl free preceramic polymers such aspolyphenylcarbosilane. 20% of polymethylphenylsilane in cyclohexane solution was coated onto metal surface by dip coating method. Thermal oxidation was carried out at $200^{\circ}C$ for crosslink of the preceramic polymer and the sample was pyrolysized at $800^{\circ}C$ under argon to convert the preceramic polymer to amorphous SiOCx state. The microstructure of the SiOCx film after pyrolysis was investigated using FE-SEM. Corrosion resistance of SiOC coated SuS-316 substrate has been investigated using 5% HCl solution at 25, 40, 60 and $80^{\circ}C$ for 7days. The data revealed that the corrosion resistance increased with SiOC coating on SuS-316 substrate.

• Journal of the Korean Ceramic Society
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• v.44 no.11
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• pp.622-626
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• 2007

Graphite is widely used in electronic industry due to its excellent electrical and thermal properties. However, graphite starts to oxidize around $400^{\circ}C$ that seriously degrades its properties. SiC coating can be applied to graphite foam to improve its high temperature oxidation resistance. In this research, SiC coating on graphite foam was made via preceramic polymer using a polyphenylcarbosilane. 20% of polyphenylcarbosilane in hexane solution was coated onto graphite by dip coating method. Thermal oxidation was carried out at $200^{\circ}C$ for crosslink of the preceramic polymer and the sample were pyrolysized at $800^{\circ}C{\sim}1200^{\circ}C$ under nitrogen to convert the preceramic polymer to SiC film. The microstructure of the SiC coating after pyrolysis was investigated using FESEM and oxidation resistance up to $800^{\circ}C$ was evaluated.

• Journal of the Korean Ceramic Society
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• v.44 no.5 s.300
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• pp.184-189
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• 2007

In this study, a novel-processing route for producing microcellular cordierite ceramics has been developed. The proposed strategy for making the microcellular cordierite ceramics involves three steps: (i) fabricating ceramic-filled preceramic foams by heating a mixture of polysiloxane, expandable microspheres, talc, and alumina in a mold, (ii) cross-linking the foamed body, and (iii) transforming the body into microcellular cordierite ceramics by sintering. Cu jig was used for near net shaping in the foaming step. The experimental variables such as the shape of foaming jig and the content of expendable microsphere were investigated. By controlling the content of expendable microsphere, it was possible to make the porous cordierite ceramics with cell density of ${\sim}1.0{\times}10^9\;cells/cm^3$.

• Proceedings of the Korean Fiber Society Conference
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• 1993.06b
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• pp.227-231
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• 1993

• Ceramist
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• v.12 no.2
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• pp.46-53
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• 2009

• Proceedings of the Korean Ceranic Society Conference
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• 2000.04a
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• pp.57.2-57.2
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• 2000

• Korean Journal of Materials Research
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• v.24 no.9
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• pp.474-480
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• 2014

Process conditions for the impregnation of polycarbosilane preceramic polymer into SiC-based composites were investigated. Two kinds of preceramic polymer (PCP) was impregnated into SiC-fiber fabrics with different solvents of n-hexane and divinylbenzene (DVB). Both microstructural observations and mechanical tests were conducted to evaluate the impregnation. The matrix phases were particulated in the case of hexane solvents. Apparent relative density of the matrix was about 78.8%. The density of matrix was increased to about 96.1-98.8% when the DVB was used; however, brittle fracture was observed during a bending test. The modulus of toughness was less than $0.74J/m^3$. The fabric impregnated with a mixed PCP-dissolved solution showed intermediate characteristics with relative high density of filling (apparent density of ~96.1%) as well as proper bending behavior. The modulus of toughness was increased to about $5.31J/m^3$. The composites developed by changing the precursor and solvent suggested the possibility of fabricating SiCf/SiC composites without a fiber to matrix interphase coating.

• Journal of the Korean Ceramic Society
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• v.48 no.6
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• pp.499-503
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• 2011

Recently, variety of organic and inorganic hybrid materials have recently investigated as alternative routes to SiOC, $SiO_2$ thin film formation at low temperatures for applications in electronic ceramics. Specially, silicon based polymers, such as polycarbosilane, polysilane and polysilazane derivatives have been studied for use in electronic ceramics and have been applied as dielectric or insulating materials. In this study, Polycarbosilane(PCS), which Si-$CH_2$-Si bonds build up the backbone of the polymer, has been investigated as low-k materials using a solution process. After heat treatment at 350$^{\circ}C$ under $N_2$ atmosphere, chemical composition and dielectric constant of the thin film were $SiO_{0.27}C_{1.94}$ and 1.2, respectively. Mechanical property measured using nanoindentor shows 1.37 GPa.