• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.37-43
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• 2020

The effects of O₂ plasma pre-treatment and post-annealing conditions on the interfacial adhesion of Ti thin film and WPR dielectric were investigated using 90° peel test for fan-out wafer level packaging (FOWLP) redistribution layer (RDL) applications. Peel strength between Ti film and WPR dielectric decreased from 8.9±1.3 g/mm to 2.7±0.9 g/mm for variation of O₂ plasma pre-treatment time from 30s to 300s, which is closely related to C-O-C or C=O bonds breakage at the WPR dielectric surface due to excessive plasma pre-treatment conditions. During post-annealing at 150℃, the peel strength abruptly decreased from 0 h to 24 h, and then maintained constant until 100 h, which is also mainly due to the damage of WPR dielectric which is weak to high temperature. Therefore, the optimum plasma pre-treatment conditions on the surface of dielectric is essential to interfacial reliability of FOWLP RDL.

• Korean Journal of Materials Research
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• v.12 no.1
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• pp.75-81
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• 2002

The ferroelectric properties of Pb(Zr,Ti)O$_3$[PZT] films degrade when the films with Pt top electrodes are annealed in hydrogen containing environment. This is due to the reduction activity of atomic hydrogen that is generated by the catalytic activity of the Pt top electrode. At the initial stage of hydrogen annealing, oxygen vacancies are formed by the reduction activity of hydrogen mainly at the vicinity of top Pt/PZT interface, resulting in a shift of P-E (polarization-electric field) hysteresis curve toward the negative electric field direction. As the hydrogen annealing time increases, oxygen vacancies are formed inside the PZT film by the inward diffusion of hydrogen ions, as a result, the polarization degrades significantly and the degree of P-E curve shift decreases gradually. The direction and the magnitude of the remnant polarization in the PZT film affect the motion of hydrogen ions which determines the degradation of polarization characteristics and the shift in the P-E hysteresis curve of the PZT capacitor during hydrogen annealing. When the remnant polarization is formed in the PZT film by applying a pre-poling voltage prior to hydrogen annealing, the direction of the P-E curve shift induced by hydrogen annealing is opposite to the polarity of the pre-poling voltage. The hydrogen-induced degradation behavior of the PZT capacitor is also affected by the internal field that has been generated in the PZT film by the charges located at the top interface prior to hydrogen annealing.

• Special Issue of the Society of Naval Architects of Korea
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• 2005.06a
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• pp.144-150
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• 2005

The size of ship is being larger than the past in the shipping industry thanks to the increased quantity of goods transported by ship. Therefore, HHIC (Hanjin Heavy industries & Construction co., LTD) invented innovative construction method, so called 'DAM', to build a ship which is longer than the length of the HHIC's dry dock. On Erection at the sea by the application of DAM Method, Squeezing & Detachment of A/F film may occur as a result of the wave and the constriction between A/F film pre-applied on the side shell and DAM's Rubber Packing. Thus, the test for finding the minimum curing time of A/F film was performed to protect Squeezing & Detachment of A/F film on the hull. To verify the soundness of paint and to find the optimum condition during the erection period of the DAM, laboratory test was carried out under no immersion condition through the application of various coatings on the Rubber Packing. And two methods were selected from the results of laboratory test for actual MOCK-UP Test. In addition, the test for the film profile per temperature of silicone A/F coat and the film Squeezing was performed.

• 전기의세계
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• v.29 no.2
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• pp.111-117
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• 1980

Contacts formed by vacuum evaporation of As-Te-Si-Ge chalcogenide glass onto Al metal (99.9999%) are studied by measuring paralle capacitance C(V), Cp(w), resistance R(V), Rp(w), and I-V characteristics. The fact that contact metal alloying produced high-resistance region is confirmed from the measurements of parallel capacitance and resistance. From the I-V characteristics in the pre-switcing region, it is found that electronic conduction and sitching occurs in the vicinity of metal-amorphous semiconductor interface. From the experimental obsevations, it is concuded that the current flow in the thin film is space-charge limited current (SCLC) due to the tunneling of electrons through the energy barriers.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1996.04a
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• pp.122-127
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• 1996

In this paper, the effects of the film tinckness, pre-treatment and testing load on. the tribological characteristics have been studied. During the "Ring on-Disk" testing period silica-gel was used to remove the effect of humidity. As a result, increasing the film thickness revealed prolonged wear life, in the case or reasl the testing loads the dynamic friction coefficient was decreased gradually but in regarding the wear life, an intermideate contact pressure (4kgf/mm${2}$) revealed the maximum value. In regarding the surface protuberance friction an intermediate value of area fraction (60%) revealed maximum wear life. In this paper, the qualitative model in regarding the variation of the friction coefficient andworn depth was presented.presented.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.12
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• pp.979-983
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• 2012

We proposed the ZnO thin film for a SAW filter by PLD and RF sputtering method. ZnO thin films was pre-deposited on a sapphire substrate as a seed layer by PLD method and then deposited on seed layer by RF sputtering. The surface characteristics of ZnO thin film were investigated by XRD, SEM and AFM. The minimum surface roughness was 1.92 nm and FWHM of rocking curve was $0.92^{\circ}$. We demonstrated the SAW filter with bandwidth of approximately 0.97 MHz and the center frequency of 18.72 MHz using the proposed ZnO thin film.

• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.438-444
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• 1999

The characterization of the reactively sputtered ITO layer on the PET film has been studied. The PEM device has been used to determine the optimum stoichimetry through control of the amount of oxygen incorporated into the alloy target and the optimum operation conditions to produce films with the highest electrical conductivity and visible transparency. The PEP film was pre-treated under the plasma discharge condition to remove the adsorbed gases and to modify the surface morphology. The results revealed that by adjusting the flow rate of oxygen with the spectral intensity of indium target, the composition of plasma gas can be kept constant during the entire deposition period. The resistivity of ITO film obtained was fond to be about 37$\Omega\Box$, and the transmittance of visual range was about 86%.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2003.11a
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• pp.227-232
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• 2003

Anodizing film was prepared by anodic oxidation of pure aluminum(purity > 99.50) using DC power supply for constant current mode in an electrolytic solution of surface of sulfuric acid. Effects of pre-treatment process such as chemical polishing, acid cleaning, alkali etching before anodic oxidation, were studied to microstructures and surface morphologies. A roughness on surface of anodizing film had to be decreased for amorphous phase by anodic oxidation. A roughness on surface of anodizing film decrease as annealing temperature increased in chemical polishing.

• Journal of computational fluids engineering
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• v.18 no.3
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• pp.20-25
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• 2013

In various manufacturing industries, an in-mold decoration (IMD) process for plastic objects is widely utilized because a film forming and an injection molding processes run simultaneously. In the present study, the deformation of polymer film and filling of resin in the IMD process were numerically investigated to evaluate the quality of the plastic object formed by the IMD process, which consists of thermoforming and injection molding processes. To obtain the initial shape of the polymer film during the injection molding process, the deformation of the polymer film in the thermoforming process was pre-formed using the vacuum conditions to attach the film to a cavity. Since the properties and deformation of polymer film are greatly affected by the behavior of polymer resin being injected into a mold cavity, numerical simulations for the injection molding and film forming were performed with one-way coupling method. The results showed that the injected resin could lead to the tearing of the polymer film in local regions near the corners. In order to verify the proposed numerical methodology, the numerical results of the deformation patterns printed on the initial polymer film were compared with the experimental data. The proposed methodology to couple film forming analysis with injection molding analysis can be used to predict the deformation of film in IMD process.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.110-114
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• 2011

Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.