• Journal of Information Display
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• v.11 no.3
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• pp.113-118
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• 2010

The effect of hydrogen in the alumina gate insulator on the bottom gate oxide thin film transistor (TFT) with an InGaZnO film as the active layer was investigated. TFT with more H-containing alumina films (TFT A) fabricated via atomic layer deposition using a water precursor showed higher stability under positive and negative bias stresses than that with less H-containing alumina deposited using ozone (TFT B). While TFT A was affected by the pre-vacuum annealing of GI, which resulted in $V_{th}$ instability under NBS, TFT B did not show a difference after the pre-vacuum annealing of GI. All the TFTs showed negative-bias-enhanced photo instability.

• Korean Journal of Materials Research
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• v.4 no.7
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• pp.767-774
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• 1994

The TbFeCo thin films were prepared by the magnetron sputtering system to investigate the effect of the base pressure, film thickness and pre sputtering on the oxidation of the films by analyzing the change of matneto optical properties and by AES depth profile. The films prepared by the facing targets sputtering system represented almost constant magneto optical properties independent of the base pressure resulting from the short flight distance of the sputtered particles. Also, the thin TbFeCo films represented better perpendicular anisotropy as the films thickness increased with pre sputtering. However, it was still needed a deposition rate higher than a certain critical deposition rate to obtain a perfect perpendicular anisotropy even at a very high film thickness.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.6 s.261
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• pp.499-506
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• 2007

This study aims to propose evaluation methods of chemical washing performance and estimate the washing capability by flowing detergent/water solution for application to home appliances such as dishwashers. Standard pollutant is stearic acid. A numerical study is also tried using a SIMPLER code. Preliminary experiments are performed by varying the concentration and temperature of the solution. From the pre-experiments, 10 minute pre-curing time is found to be necessary to remove the stearic acid. Stoichiometric ratio and detergent consumption coefficient of reaction between the detergent and stearic are estimated following a proposed method. Washing experiments of pollutant to compare with the numerical results are performed. The relative errors between the experimental and the numerical results with pre-curing time included are less than 7%. In conclusion, important mechanisms of chemical washing are revealed and methods of predicting washing performance are well established.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Journal of the Korean Ceramic Society
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• v.44 no.12
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• pp.733-739
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• 2007

NiO-YSZ anode-supported single cell was prepared by spin-coating YSZ and LSM slurries as electrolyte and cathode, respectively. Dense YSZ electrolyte film was successfully prepared on the porous NiO-YSZ anode substrate by tuning pre-sintering temperature of NiO-YSZ and co-firing temperature. The thickness of YSZ film was controlled by the solid content of slurry and coating cycles. The experimental conditions affecting on the thickness of YSZ film was discussed. Single cells with the active electrode area ${\sim}0.8\;cm^2$ were prepared by spin-coating the cathode layers of LSM-YSZ mixture and LSM consequently as well. The effects of the pre-sintering temperature and thus the microstructure of NiO-YSZ substrate on the current-voltage characteristics of co-fired cell were investigated.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.24-25
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• 2006

In this paper, ZnO thin films were prepared on p-Si(100) by RF magnetron sputtering. Before the depostion, the substrates were pre-heated to 500, 400, 300, $200^{\circ}C$ or not. During the deposition, the substrates were cooled down naturally or kept and then the films were investigated by XRD(X-ray diffraction) and SEM (scanning micro scope). It is showed the most outstanding result that the film was prepared on the substrate were cooled from $400^{\circ}C$. When the substrate was cooled from a certain temperature during deposition, it could be improve the c-axis orientation and useful for application of SAW(surface acoustic wave) filter and FBAR(film bulk acoustic wave resonator) device.

• Nuclear Engineering and Technology
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• v.40 no.5
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• pp.387-396
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• 2008

Many experimental analyses for annular film dryouts, which is one of the Critical Heat Flux (CHF) mechanisms, have been performed because of their importance. Numerical approaches must also be developed in order to assess the results from experiments and to perform pre-tests before experiments. Various thermal-hydraulic codes, such as RELAP, COBRATF, MARS, etc., have been used in the assessment of the results of dryout experiments and in experimental pre-tests. These thermal-hydraulic codes are general tools intended for the analysis of various phenomena that could appear in nuclear power plants, and many models applying these codes are unnecessarily complex for the focused analysis of dryout phenomena alone. In this study, a numerical model was developed for annular film dryout using the drift-flux model from uniform heated tube geometry. Several candidates of models that strongly affect dryout, such as the entrainment model, deposition model, and the criterion for the dryout point model, were tested as candidates for inclusion in an optimized annular film dryout model. The optimized model was developed by adopting the best combination of these candidate models, as determined through comparison with experimental data. This optimized model showed reasonable results, which were better than those of MARS code.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.569-574
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• 2001

The crystal structure, surface morphology and preferred orientation of the copper electrodeposit were investigated by the using sulfate bath with $SiO_2$suspensions and the cathode substrate Au sputtered. As by the addition of colloidal silica in copper electrolytic bath and Au pre-coating on substrate, the crystal particles of deposits was fined-down, made uniform and the account of particles were increased. Hardness of copper electrodeposits with colloidal silica increased about 15% in comparison with that of pure copper deposit film and (111), (200) and (311) plane of X-ray diffraction patterns were almost swept away, so preferred orientation of the copper deposits changed from (111) to (110) plane by codeposit $SiO_2$ and precoating the substrate.

• Journal of Adhesion and Interface
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• v.12 no.1
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• pp.34-42
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• 2011

The roll coating process is well-known for completely replacement coating system with an existing wet paint process for automotive which has low productivity and is not environment-friendly process. It is very important to evaluate the curing behavior, corrosion resistance and processing property as well as rheological behavior in order to realize a film flexibility and hardness simultaneously. In this study, we have synthesized the polyester resin modified with hydroxyl values and molecular weight to apply the pre-painted system, and then evaluated the curing behavior, deep drawing, tensile strength and rheological properties. It was observed that N-0375-40 of 40 (mg KOH/mol) hydroxyl values showed the most suitable for flexibility, film hardness, and curing behavior.