• Title/Summary/Keyword: Power-GroundPlaneAnalysis

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Fast computation method for the voltage-current analysis on the rectangular power-ground plane (직사각형의 전력-접지층에 대한 전압전류 특성해석을 위한 빠른 계산방법)

  • Suh, Young-Suk
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.1
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    • pp.140-145
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    • 2005
  • The existing analytical expression for the voltage between the power and ground plane consist of metal-dielectric-metal board is expressed in the two dimensional infinite series. To reduce the computation time, the two dimensional infinite series is converted to the one dimensional infinite series using the summation formula of Fourier series. We applied these equations to the analysis of voltage between the $9‘{\times}4'$ size power-ground plane. The derived one dimensional infinite series shows the more rapid convergency and the more accurate result than the two dimensional infinite series. This equation can be applied to the power-ground plane analysis which needs a lot of the repeating computation.

A Fast Computation Method of Power Ground Plane Impedance using the Mobius Transform (Mobius변환을 이용한 전력접지층 임피던스의 빠른 계산방법)

  • Suh Youngsuk;Kim In-Sung;Song Jae-Sung;Eum Tae-Su
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.54 no.1
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    • pp.41-44
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    • 2005
  • A new method to reduce the computation time in power/ground-plane analysis is proposed. The existing method using the two dimensional infinite series summation take a lot of computation time. The proposed method is based on the approximation of impedance in the frequency domain through the Mobius transform. This method shows the good accuracy and the high speed in computing. In the case of impedance calculation for 9'x4' board, the proposed method takes 0.16 second of computing time whereas the existing method takes 2.2 second. This method can be applied to the analysis and design of power/ground-plane that need a lot of computation steps.

Analysis of SMPS Characteristics applying Ground Plane Layer (Ground Plane레이어를 적용한 SMPS 특성분석)

  • Park, Jin-Hong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.1
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    • pp.436-440
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    • 2014
  • To verity the effect of PCB plane layer to the output characteristics of the Switched Mode Power Supply (SMPS), this paper compared with a generic one-layer PCB and a double-side PCB. This paper specially focused on the voltage, the current and the high frequency noise of the output characteristic of the SMPS, using a double-side PCB which has same layout and was installed a ground plane on the opposite side. This double-side PCB was assembled by all same components which used on the SMPS using the single-side PCB. The experiment results show the SMPS using the ground plan PCB can efficiently reduce the high frequency noise to 50mV at 100MHz from 150mV in the single-side PCB. And the results also show the high harmonics frequency was reduced as well.

AFastComputationAlgorithmfortheImpedancecalculationofthePowerDistributionPlaneUsingtheTransmissionMatrix (전송선로행열을이용한전력배분기판에대한빠른임피던스계산방법)

  • Suh Young-Suk
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.54 no.6
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    • pp.251-254
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    • 2005
  • Animpedancecalculationmethodfortheirregularshapedpowerdistributionnetworksispresented.Theirregularshapedmetal-dielectric-metalboardissplitintothreepieceofsegmentstocalculatetheimpedancebetweenthetwoseparatedpointsontheboard.Transmission-matrixdescriptioncorrespondingtotheunitcolumnofboardandtheconnectionofunitcolumnboardareintroduced.Thenthetransmission-matrixfortheeachsegmentiscalculatedandreducedtothe2-portsimpedancematrix.Theproposedalgorithmisveryfastcomparingtheexistingmethods.Appliedtothe6inchby5inchsizeirregularshapedboard,theproposedmethodshows15timesfasterthantheelectromagneticorcircuitanalysismethod.

Analysis of Split Power/Ground Plane Structures for Radiated EMI Reduction (EMI 저감을 위해 분할된 전원/접지 평판 구조에서의 방사성 방출 분석)

  • Lee, Jang-Hoon;Lee, Pil-Soo;Lee, Tae-Heon;Kim, Chang-Gyun;Song, In-Chae;Wee, Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.6
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    • pp.43-50
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    • 2010
  • In this paper, we analyzed radiated emission generated by the split power/ground plane structures in order to reduce EMI in system modules. The magnetic fields and electric fields were simulated and measured on the test boards under various conditions. In order to reduce radiated emission, we have to determine spacing and location of the split ground gap so that input signal frequency does not coincide with the resonance frequency of the split power/ground plane structure and the phase of reflection coefficient is close to $0^{\circ}$ at input signal frequency. Moreover, we found that inserting a stitching capacitor could reduce the radiated emission. Low magnitude of reflection coefficient and the phase close to $0^{\circ}$ are required to reduce radiated emission. It is necessary to properly decide value and location of a stitching capacitor to fulfil those requirements.

Analysis of EMI Problems in Split Power Distribution Network

  • Shim, Hwang-Yoon;Kim, Ji-Seong;Yook, Jong-Gwan;Park, Han-Kyu
    • Journal of electromagnetic engineering and science
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    • v.2 no.2
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    • pp.75-80
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    • 2002
  • Signal integrity problems and their possible solutions are addressed in this paper for split power plane of high-speed digital systems. Stitching and decoupling capacitors are proved to be very effective for reducing signal noise, ground bounce as well as electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC main board.

Reducing Electromagnetic Radiation in Split Power Distribution Network of High-Speed Digital System

  • Shim, Hwang-Yoon;Kim, Jiseong;Yook, Jong-Gwan;Park, Han-Kyu
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2002.11a
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    • pp.340-343
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    • 2002
  • Electromagnetic(EM) radiation problems and their possible solutions are addressed in this paper for the split power plane of high-speed digital systems. Stitching and decoupling capacitors are proved to be very effective fur reducing signal noise, ground bounce as well as electromagnetic radiation from the split power plane. Simulations based on 3D-Finite Difference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC main board

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Wide-Bandwidth Wilkinson Power Divider for Three-Way Output Ports Integrated with Defected Ground Structure

  • Sreyrong Chhit;Jae Bok Lee;Dal Ahn;Youna Jang
    • Journal of information and communication convergence engineering
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    • v.22 no.1
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    • pp.14-22
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    • 2024
  • This study presents the design of a Wilkinson power divider for three-way output ports (WPD3OP), which incorporates a defected ground structure (DGS). An asymmetric power divider is integrated into the output ports of the conventional Wilkinson power divider (WPD), establishing a three-way output port configuration. The DGS introduces periodic or irregular patterns into the ground plane to suppress unwanted electromagnetic wave propagation, and its incorporation can enhance the performance of the power divider, in terms of the power-division ratio, isolation, and bandwidth, by reducing spurious resonances. The proposed design algorithm for an asymmetric power divider for three-way output ports is analyzed via circuit simulations using High-Frequency Simulation Software (HFSS). The results verify the validity of the proposed method. The analysis of the WPD3OP integrated with DGS certifies the achievement of a center frequency of 2 GHz. This confirmation is supported by schematic ideal design simulation results and measurements encompassing insertion losses, return losses, and isolation.

Analysis of the Ground Bounce in Power Planes of PCB Using the Haar-Wavelet MRTD (Haar 웨이블릿 기반 MRTD를 이용한 PCB 전원 공급면에서의 Ground Bounce 해석)

  • 천정남;이종환;김형동
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.10 no.7
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    • pp.1065-1073
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    • 1999
  • This paper analyzed the ground bounce caused by the power plane resonance in the multilayered printed circuit board(PCB) using the Haar-wavelet-based Multiresolution Time-Domain (MRTD). In conventional Finite-Difference Time-Domain(FDTD), the highly fine vertical cell is needed to represent the distance between $V_{cc}$ plane and ground plane since the two planes are very close. Therefore the time step $\Deltat$ must be very small to satisfy the stability condition. As a result, a large number of iterations are needed to obtain the response in wanted time. For this problem, this paper showed that the computation time can be reduced by application of the MRTD method. The results obtained by the MRTD agree very well with those by FDTD method and analytic solutions. In conclusion, this paper proved the efficiency and accuracy of MRTD method for analyzing the EMI/EMC problems in PCB.

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Design and Implementation of Class-AB High Power Amplifier for IMT-2000 System using Optimized Defected Ground Structure (최적화된 DGS 회로를 이용한 IMT-2000용 Class-AB 대전력증폭기의 설계 및 구현)

  • 강병권;차용성;김선형;박준석
    • Journal of the Institute of Convergence Signal Processing
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    • v.4 no.1
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    • pp.41-48
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    • 2003
  • In this paper, a new equivalent circuit for a defected ground structure(DGS) is proposed and adapted to design of a power amplifier for performance improvement. The DGS equivalent circuit presented in this paper consists of parallel LC resonator and parallel capacitance to describe the fringing fields due to the etched defects on the metallic ground plane, and also is used to optimize the matching circuit of a power amplifier. A previous research has also used a DGS for harmonic rejection and efficiency improvement of a power amplifier(1), however, there was no exact equivalent circuit analysis. In this paper, we suggest a novel design method and show the performance improvement of a class AB power amplifier by using the equivalent circuit of a DGS applied to output matching circuit. The design method presented in this paper can provide very accurate design results to satisfy the optimum load condition and the desirable harmonic rejection, simultaneously. As a design example, we have designed a 20W power amplifier with and without circuit simulation of DGS, and compared the measurement results.

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