• 마이크로전자및패키징학회지
• /
• 제21권3호
• /
• pp.7-17
• /
• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제2권3호
• /
• pp.197-204
• /
• 2002

DRAM, SRAM, and FLASH memory are three major memory devices currently used in most electronic applications. But, they have very distinct attributes, therefore, each memory could be used only for limited applications. MRAM (Magneto-resistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. To be a commercially competitive memory device, scalability is an important factor as well. This paper is testing the actual electrical parameters and the scaling factors to limit MRAM technology in the semiconductor based memory device by an actual integration of MRAM core cell. Electrical tuning of MOS/MTJ, and control of resistance are important factors for data sensing, and control of magnetic switching for data writing.

• 한국광학회:학술대회논문집
• /
• 한국광학회 2005년도 하계학술발표회
• /
• pp.204-205
• /
• 2005

Studies on display has been requested some major changes due to the high growth of the handheld terminal market. Therefore, the self emitting OLED(Organic Light Emitting Diode) has been interested as a next generation flat plane display because of its preeminent characteristics such as quick response characteristics, higher performance viewing angle, low power consumption, and panel floating. However, a trend of the display market is moving to three dimensional image processing instead of two dimensional flat display and various researches on display using hologram makes up for the difficulty in three dimensional display using typical flat display. In this study the Lenticular Screen Printing method is presented so that it can be applicable to organic semiconductor display devices and makes possible three dimensional display using flat display for complement the drawback of inorganic semiconductor.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
• /
• pp.135-138
• /
• 2006

OLEDs are attractive because of possible application in display with low operating voltage, low power consumption, self-emission and capability of multicolor emission by the selection of emissive material. We investigated the effects of deposition rate on the electrical characteristics, physical characteristics and optical characteristics of OLEDs in the ITO(indium-tin-oxide)/N,N'-diphenyl-N,N'-bis(3-methyphenyl)-1,1'-biphenyl-4,4'-diamine(TPD)/tris(8-hydroxyquinoline)aluminum($Alq_3$)/Al device. We measured current density, luminous flux and luminance characteristics of devices with varying deposition rates of TPD and $Alq_3$. It has been found that optimal deposition rate of TPD and $Alq_3$ were respectively $1.5{\AA}/s$ from the device structure. An AFM measurement results, surface roughness of the deposited film was the lowest when deposition rate was $1.5{\AA}/s$.

• 반도체디스플레이기술학회지
• /
• 제19권3호
• /
• pp.106-111
• /
• 2020

In this paper, we propose the non-contact gesture recognition system and algorithm using proximity-based sensors. The system uses four IR receiving photodiode embedded on a single chip and an IR LED for small area. The goal of this paper is to use the proposed algorithm to solve the problem associated with bringing the four IR receivers close to each other and to implement a gesture sensor capable of recognizing eight directional gestures from a distance of 10cm and above. The proposed system was implemented on a FPGA board using Verilog HDL with Android host board. As a result of the implementation, a 2-D swipe gesture of fingers and palms of 3cm and 15cm width was recognized, and a recognition rate of more than 97% was achieved under various conditions. The proposed system is a low-power and non-contact HMI system that recognizes a simple but accurate motion. It can be used as an auxiliary interface to use simple functions such as calls, music, and games for portable devices using batteries.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.497-499
• /
• 2005

A portable terminal assistant market grows rapidly every year and it requires many change in research on display devices. Among many newly developing methods, OLED(Organic Light Emitting Diode) is considered an advanced flat display device because its excellent characteristics, including high speed response, full color performance, low power consumption and flux of panel. However changes in the market of display shows that the market will require 3-dimensional images, but it is hard for existing 2-dimensional displays to make 3-dimensional images. Therefore we will try to find various methods such as holograms. In this paper, we will show existing flat displays can make 3-dimensional images by applying Lenticular Screen printing techniques on the organic semiconductor display device.

• 반도체디스플레이기술학회지
• /
• 제9권2호
• /
• pp.67-72
• /
• 2010

Recently increasing application of flash memory in mobile and ubiquitous related devices is due to its non-volatility, fast response time, shock resistance and low power consumption. Following this trend, SSD(Solid State Disk) using multiple flash chips, instead of hard-drive based storage system, started to widely used for its advantageous features. However, flash memory based storage subsystem should resolve the performance bottleneck for writing in perspective of speed and lifetime according to its disadvantageous physical property. In order to provide tangible performance, solutions are studied in aspect of reclaiming of invalid regions by decreasing the number of erasures and distributing the erasures uniformly over the whole memory space as much as possible. In this paper, we study flash memory recycling algorithms with multiple management units and demonstrate that the proposed algorithm provides feasible performance. The proposed method utilizes the partitions of the memory space by utilizing threshold values and reconfigures the management units if necessary. The performance of the proposed policies is evaluated through a number of simulation based experiments.

• 반도체디스플레이기술학회지
• /
• 제20권4호
• /
• pp.151-156
• /
• 2021

Low-end IoT devices do not have enough computation and memory resources for DNN learning and inference. Integer quantization of real-type neural network models can reduce model size, hardware computational burden, and power consumption. This paper describes the design and implementation of a web-based quantization platform for CNN deep learning accelerator chips. In the web service platform, we implemented visualization of the model through a convenient UI, analysis of each step of inference, and detailed editing of the model. Additionally, a data augmentation function and a management function of files that store models and inference intermediate results are provided. The implemented functions were verified using three YOLO models.

• 반도체디스플레이기술학회지
• /
• 제17권2호
• /
• pp.36-40
• /
• 2018

Point LED applied in Korea is applied to communication RCLED, but it is designed to be suitable for communication, so it does not meet requirements in fiber coupling rate and optical output. - Currently, domestic optical pipe manufacturers use general LEDs for light emitting devices, but Japanese products use high power point LEDs to develop superior point LED (RED 620 ~ 660nm).

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
• /
• pp.647-650
• /
• 2006

Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.