• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.8
• /
• pp.641-646
• /
• 2011

Ga-doped ZnO-$SnO_2$ (ZSGO) films were deposited by rf magnetron sputtering and their structural and electrical properties were investigated. In order to fabricate the target for sputtering, the mixture of ZnO, $SnO_2$ (1:1 weight ratio) and $Ga_2O_3$ (3.0 wt%) powder was calcined at $800^{\circ}C$ for 1 h. The substrate temperature was varied from room temperature to $300^{\circ}C$. The crystallographic properties and the surface morphologies of the films were studied by X-ray diffraction (XRD) and Scanning Electron Microscopy (SEM). The optical transmittances of the films were measured and the optical energy band gaps were obtained from the absorption coefficients. The resistivity variation with substrate temperature was measured. Auger electron spectroscopy was employed to find the atomic ratio of Zn, Sn, Ga and O in the film deposited at room temperature. ZSGO films exhibited the optical transmittance in the visible region of more than 80% and resistivity higher than $10\;{\Omega}cm$.

• Journal of the Korean institute of surface engineering
• /
• v.49 no.4
• /
• pp.368-375
• /
• 2016

MoN-Cu thin films were prepared to achieve appropriate properties of high hardness and low friction coefficient, which could be applied to automobile engine parts for reducing energy consumption as well as solving wear problems. Composite thin films of MoN-Cu have been deposited by various processes using multiple targets such as Mo and Cu. However, those deposition with multiple targets revealed demerits such as difficulties in exact control of composition and homogeneous deposition. This study is aiming for suggesting an appropriate process to solve those problems. A single alloying target of Mo-Cu (10 at%) was prepared by powder metallurgy methods of mechanical alloying (MA) and spar plasma sintering (SPS). Thin film of MoN-Cu was then deposited by magnetron sputtering using the single alloying target of Mo-Cu (10 at%). Properties of the resulting MoN-Cu thin film were examined and compared to those of MoN-Cu thin films prepared with double targets of Mo and Cu.

• Journal of the Korean institute of surface engineering
• /
• v.42 no.5
• /
• pp.232-239
• /
• 2009

This study presented the effect of membrane thickness on hydrogen permeability. Microvoids on the surface of the membrane should not exist for the exact values of hydrogen permeability. Pd-Cu-Ni hydrogen alloy membranes were fabricated by Ni powder sintering, substrate plasma pretreatment, sputtering and Cu reflow process. And this leaded to void-free surface and dense film of Pd-Cu-Ni hydrogen alloy membrane. Hydrogen permeation test showed that hydrogen permeability increased from 2.7 to $15.2ml/cm^2{\cdot}min{\cdot}atm^{0.5}$ as membrane thickness decreased from 12 to $4{\mu}m$. This represented the similar trend as a hydrogen permeability of pure palladium membrane based on solution-diffusion mechanism.

• Journal of the Korean Ceramic Society
• /
• v.31 no.6
• /
• pp.643-650
• /
• 1994

Highly [100]-oriented MgO thin films were deposited on Si(100) single crystal substrates by reactive RF magnetron sputtering. The effects of substrate temperature, gas pressure, RF input powder, and gas composition on the characteristics of MgO thin films were studied. The higher substrate temperature and the lower operating pressure were, the better crystallinity of the deposited MgO thin films were. The influences of the RF input power and oxygen to argon ratio were very complex. The physical characteristics of the films changed dramatically with deposition conditions. Highly smooth and epitaxial MgO films were obtained at the deposition conditions as follows; subatrate temperature, $600^{\circ}C$; operating pressure, 10 mtorr; RF input power density, 2 W/$\textrm{cm}^2$; the percentage of oxygen, 10%.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2017.05a
• /
• pp.95.1-95.1
• /
• 2017

In this study, it has been tried to make the single Mo-Cu alloying targets with the Cu showing the best surface hardness that was determined by investigation on the coatings with the double target process. The single alloying targets were prepared by powder metallurgy methods such as mechanical alloying and spark plasma sintering. The nanocomposite coatings were prepared by reactive magnetron sputtering process with the single alloying targets in $Ar+N_2$ atmosphere. The microstructure changes of the Mo-Cu-N coatings with diverse Cu contents were investigated by using XRD, SEM and EDS. The mechanical properties of the coatings were evaluated by using nano-indentor, scratch test, and ball on disc methods. Especially, the coated samples were tested by using various lubricating oil to compare the property of anti wear-resistance. In this study, the nano-composite MoN-Cu coatings prepared using an alloying target was eventually compared with the coatings from the multiple targets.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.19 no.9
• /
• pp.883-887
• /
• 2006

In order to attain high-rate deposition of Mn-Zn ferrite thin film for soft magnetic underlayer in perpendicular magnetic recording media, a reactive sputtering using powder-metal targets under the mixture gas of Ar and $O_{2}$ was performed. It was succeeded that Mn-Zn ferrite films with (111) crystal orientation were deposited on Pt(111) underlayer without any annealing process. The film revealed 3.4 kG of 4 ${\pi}Ms$, 70 Oe of coercivity. The deposition rate of the new method was 16 times as high as that of the conventional method using ferrite target.

• Korean Journal of Materials Research
• /
• v.18 no.4
• /
• pp.181-186
• /
• 2008

In this study, tantalum (Ta) compacts were fabricated in a spark plasma sintering (SPS) process and their microstructure and mechanical properties were investigated. Ta compacts with a density of 99% were successfully fabricated by controlling the sintering conditions of the current and the temperature. The density and hardness were increased as the sintering temperature increased. The $Ta_2C$ compound was observed at the surface of the compacts due to the contact between the Ta powder and graphite mold during the sintering process. The main fracture mode showed a mixed type with intergranular and transgranular modes having some roughness.

• Journal of the Korean institute of surface engineering
• /
• v.37 no.5
• /
• pp.243-248
• /
• 2004

A palladium-nikel(Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support formed with nickel powder. Plasma surface treatment process is introduced as pre-treatment process instead of HCI activation. Pd coating layer was prepared by dc magnetron sputtering deposition after $H_2$ plasma surface treatment. Palladium-nickel alloy composite layer had a fairly uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature of 773 K and pressure of 2.2psi. The hydrogen permeance was 6 ml/minㆍ$\textrm{cm}^2$ㆍatm and the selectivity was 120 for hydrogen/nitrogen($H_2$/$N_2$) mixing gases at 773 K.

• Journal of the Korean Vacuum Society
• /
• v.19 no.1
• /
• pp.58-65
• /
• 2010

AlN thin films were deposited on sapphire substrates and ZnO templates by rf-magnetron sputtering. Powder-sintered AlN target was adopted for source material. Thickness of AlN layer was linearly dependent on plasma power from 50 to 110 W, and it decreased slightly when working pressure increased from 3 to 10 mTorr due to short mean free path of source material sputtered from AlN target by Ar working gas. When $N_2$ gas was mixed with Ar, the thickness of AlN layer decreased significantly because of low sputter yield of nitrogen. AlN layer was also deposited on ZnO template. However, it showed weak thermal stability that the interface between AlN and ZnO was deteriorated by rapid thermal annealing treatment above $700^{\circ}C$. In addition, ZnO layer was largely attacked by MOCVD ambient gas of hydrogen and ammonia around $700^{\circ}C$ through inferior AlN layer deposited by sputtering. And AlN layers were fully peeled off above $900^{\circ}C$.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.27-32
• /
• 2006

The present status and prospects for further development of thin-film electroluminescent (TFEL) devices using oxide phosphors are described. High-luminance oxide TFEL devices have been recently developed using a new combinatorial deposition technique featuring rf magnetron sputtering with a subdivided powder target. In addition, new flexible oxide TFEL devices have been fabricated on an oxide ceramic sheet and operated stably in air above $200^{\circ}C$.