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http://dx.doi.org/10.5695/JKISE.2016.49.4.368

MoN-Cu Thin Films Deposited by Magnetron Sputtering with Single Alloying Target  

Lee, Han-Chan (Department of Electrical Engineering, Inha University)
Moon, Kyoung-Il (Korea Institute of Industrial Technology, Heat Treatment R&BD Group)
Shin, Paik-Kyun (Department of Electrical Engineering, Inha University)
Publication Information
Journal of the Korean institute of surface engineering / v.49, no.4, 2016 , pp. 368-375 More about this Journal
Abstract
MoN-Cu thin films were prepared to achieve appropriate properties of high hardness and low friction coefficient, which could be applied to automobile engine parts for reducing energy consumption as well as solving wear problems. Composite thin films of MoN-Cu have been deposited by various processes using multiple targets such as Mo and Cu. However, those deposition with multiple targets revealed demerits such as difficulties in exact control of composition and homogeneous deposition. This study is aiming for suggesting an appropriate process to solve those problems. A single alloying target of Mo-Cu (10 at%) was prepared by powder metallurgy methods of mechanical alloying (MA) and spar plasma sintering (SPS). Thin film of MoN-Cu was then deposited by magnetron sputtering using the single alloying target of Mo-Cu (10 at%). Properties of the resulting MoN-Cu thin film were examined and compared to those of MoN-Cu thin films prepared with double targets of Mo and Cu.
Keywords
MoN-Cu thin films; Single alloying target; Magnetron sputtering; MA; SPS;
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