• 한국재료학회지
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• 제18권9호
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권4호
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• pp.165-169
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• 2004

This paper reports a miniaturized conductor-backed CPW (CBCPW) bandpass filter based on a thin film polyimide layer coated on CMOS-grade silicon. With a 20 ${\mu}{\textrm}{m}$-thick polyimide interface layer and back metallization on the CMOS-grade silicon, the interaction of electromagnetic fields with the lossy silicon substrate has been isolated, and as a result a low-loss and low-dispersive CBCPW line has been obtained. Measured attenuation constant at 20 GHz is below 1.2 ㏈/cm, which is compatible with the CPW on GaAs. In addition, by using the proposed CBCPW geometry, miniaturized BPF for Ku band application is designed and its measured frequency response shows excellent agreement with the predicted value with validating the performances of the proposed CBCPW geometry for RFIC interconnects and filter applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.105-106
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• 2006

현재 투명 전도성 산화물로 널리 사용되고 있는 ITO등의 물질들이 갖는 문제점을 해결하기 위하여 ZnO 에 Ga이나 Al등의 불순물을 첨가하여 투명 전도성 재료로써 이에 대한 연구가 진행중에 있다. 본 연구에서는 RF 마그네트론 스퍼터법으로 Al이 첨가된 ZnO:Al Ceramic 타겟으로 Coring 1737 유리기판과 파손의 우려가 적고 유연성을 갖는 $25{\mu}m$ 두께의 polyimide(PI) 기판위에 박막을 증착하여 특성을 비교 조사하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.633-636
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• 2008

A series novel films of polyimide (PI) and co-polyimide (Co-PI) containing fluorine with colorless, flexible properties was prepared by a two-step process from various commercial aromatic monomers such as 4,4'-(Hexafluoro iso propylidene) diphthalic anhydride (6FDA), 2,2'-Bis(Trifluoromethyl) benzidine (TFDB), 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (AH6FP) and Bis(4-(3-aminophenoxy)phenyl)sulfone (BAS). Furthermore, these obtained transparent and flexible Co-PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) around of $500^{\circ}C$ and the glass transition temperature ($T_g$) in the range of $275-350^{\circ}C$.

• 한국광학회지
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• 제20권5호
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• pp.281-287
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• 2009

편광법을 사용하여 패턴이 있는 LCD 유리기층위에 놓여 있는 러빙된 PI(polyimide)의 광학이방성을 분석하였다. 투과형 편광계를 사용하여 0.4 nm 이하의 극히 작은 위상지연의 크기와 광축의 방향을 정밀하게 측정하였다. 온도에 따르는 광학이방성의 미세변화를 위상지연의 크기 및 광축 방향의 변화곡선으로 나타내고 간단한 광학모델을 사용하여 설명하였다.

• 폴리머
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• 제29권2호
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• pp.204-210
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• 2005

플라스틱 디스플레이 기판용으로 사용하기 위하여 무색, 투명하면서 유연성, roll-to-roll 공정, 내열성과 저 열팽창계수 특성을 갖출 수 있는 폴리이미드에 대한 연구를 하였다. 3,3',4,4'-oxydiphthalic anhydride(ODPA), 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), sulfonyldianiline(3-SDA), aminophenoxybenzene(TPE-p, TPE-q, TPE-r)과 bis[4-(3-aminophenoxy)phenyl]sulfone(m-BAPS) 등을 사용하여 무색 투명한 폴리이미드를 합성하고 광학적 특성을 UV spectrophotometer, colormeter와 hazemeter를 이용하여 측정하였다. 열팽창계수(CTE)를 낮추기 위하여 층상실리케이트로 나노복합화하였다. 무색투명한 폴리이미드 필름은 440 nm에서 $89\%$ 이상의 광투과도와 yellow index(YI) 값이 7 이하의 우수한 광학 특성을 보였다. 나노복합화한 폴리이미드 필름은 층상실리케이트가 효과적으로 박리되어 층상실리케이트의 함유량이 증가함에 따라 열팽창계수가 감소하는 효과를 보였다.

• 대한금속재료학회지
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• 제47권11호
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• pp.740-747
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• 2009

The purpose of this study is to identify the effect of electrolyte compositions on electrodeposited copper foil. First of all, the polyimide substrate was pretreated with plasma. Finally, copper foil was deposited on a Cu/Ni/Polyimide substrate using the electroplating technique. As the quantity of Cu increased, preferred orientations changed into (111). Increasing sulfuric acid, on the other hand, brought down the preferred orientation of (111). The lowest sheet resistance, surface roughness, and fine adhesion were detected when the ratio of $Cu^{2+}$ and $H_2SO_4$ is 50:50(g/l).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.199-202
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on two kinds of polyimide (PI) surfaces using thin plastic substrates. The generated NLC pretilt angles on the pre-imidized type PI are about $3.8^{\circ}$ by the rubbing alignment method with thin plastic substrates, However, the pretilt angle measured at about $2.8^{\circ}$ lower on the polyamic acid type PI than by pre-imidized type PI surface with thin polymer film. The tilt angle increases as increasing curring temperature for making polyimide layer using polyamic acid type PI. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

• 한국산업융합학회 논문집
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• 제20권4호
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• pp.307-311
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• 2017

Ultra short pulse laser processing with the PI (polyimide) substrate is conducted to increase flexibility and radius of curvatures. A femtosecond laser is used to perform micro machining by minimizing the heat effect in PI substrate. The laser processing according to the parameters, such as fabricated line width, depth, laser power, distance between lines, is carried out to understand the characteristics of fabricated lines. A bending test is carried out to evaluate bending shapes and the radius of curvature after bending and spreading it 1000 times. The results demonstrates that the radius of curvature decreases in deepen lines and increases with the augment of the number of the fabricated lines, and distance between lines.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1553-1555
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• 2008

Super-hydrophobic treated Polyimide film was used as a flexible substrate for developing a new method of metallization. Hydrophilic patterns were fabricated by IN irradiation through shadow mask. Patterned super-hydrophobic substrate was dipped into a bath containing silver nano ink Silver ink was only coated on hydrophilic patterned area. Metal lines of $600{\mu}m$ pitch were fabricated successfully. However, their thickness was too thin to serve as interconnection. To overcome this problem, iterative dipping was conducted. After repeating five times, the thickness of silver metal lines were increased to over than $2{\mu}$. After heat treatment of silver lines, their resistivities were reduced to order of $30{\mu}{\Omega}$-cm the similar level of values reported in other literatures. So, a new method of metallization has high potential for application of RFID antenna and flexible electronics substrates.