한국산업융합학회 논문집 (Journal of the Korean Society of Industry Convergence)

  • 제20권4호
  • /
  • Pages.307-311
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  • 2017
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  • 1226-833X(pISSN)
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  • 2765-5415(eISSN)
한국산업융합학회 (The Korean Society of Industry Convergence)
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극초단파 레이저를 이용한 PI 필름 가공 기술개발

Ultrashort pulse laser induced PI film scribing

  • 김태동 (경북대학교 기계공학과) ;
  • 이호 (경북대학교 기계공학과)
  • Kim, Tae-Dong (Dept. of Mechanical Engineering in Kyungpook Univ.) ;
  • Lee, Ho (Dept. of Mechanical Engineering in Kyungpook Univ.)
  • 투고 : 2017.08.04
  • 심사 : 2017.09.04
  • 발행 : 2017.09.30
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초록

Ultra short pulse laser processing with the PI (polyimide) substrate is conducted to increase flexibility and radius of curvatures. A femtosecond laser is used to perform micro machining by minimizing the heat effect in PI substrate. The laser processing according to the parameters, such as fabricated line width, depth, laser power, distance between lines, is carried out to understand the characteristics of fabricated lines. A bending test is carried out to evaluate bending shapes and the radius of curvature after bending and spreading it 1000 times. The results demonstrates that the radius of curvature decreases in deepen lines and increases with the augment of the number of the fabricated lines, and distance between lines.

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참고문헌

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