• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.12
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• pp.2624-2630
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• 2002

Organic/inorganic hybrid materials have rapidly become a fascinating research field. In this study, $polyimide/TiO_2$ composites were synthesized from nano-sized anatase $TiO_2$ and two types of polyimide, that is, BPDA-PPD and PMDA-ODA. Nano-sized $TiO_2$ particles were prepared from $TiOEt_4$ solution by the sol-gel method. The synthesized PI/$TiO_2$ composites were characterized by using XRD, TGA, FT-IR, TEM, and Atomic Force Microscope(AFM). $TiO_2$ particles were dispersed well in polyimides and the mechanical and thermal stability of polyimide was improved with $TiO_2$ nano particles.

• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.26-29
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• 2002

Polyimide-epoxysilane (coupling agent) composites were reacted with oligomeric PDMS, a condensation product of difunctional silane, by a sol-gel process and were then dried into films. And then, the surface, mechanical, and electric properties were measured. The study showed that PDMS existed in the polymide matrix by the use of FT-IR. In the mechanical properties, the maximum elongation and toughness was increased in the polyimide with silane-groups. But the maximum tensile strength was slightly decreased. And the intensive dispersion of the silane-groups on the surface of polyimide was ascertained through XPS measurement. In the electric properties. AC break down voltage was increased by increasing the amount of difunctional silane. This experiment showed that PDMS added polyimide had better mechanical and electric properties than classical materials.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.600-602
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• 1995

Using the $O_2$ RIE process, 20{\mu}m$-height polyimide microstructures are fabricated. In LIGA-like process, metal microstructure can be formed by the electroplating using these polyimide microstructures as a plating mould. Reactive ion Etching technique using oxygen gas is used for the patterning of polyimide. The etching rate of the polyimide is increased with increased pressure and RF power. The anisotropic vertical sidewall can be obtained at low pressure, but the etched surface state is not so good yet. "Micrograss", which is formed during the RIE and disturbs uniform electroplating, can be removed effectively by the wet itching of the chromium sacrificial layer. More studies about the improvement of an etched surface state and the removal of microsgrass are needed.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1472-1473
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• 2008

Polyimide thin films were cured locally using MEMS microhotplates. The polyimide locally cured at temperature over 350$^{\circ}C$ for 1 hour was fully cured. There was no significant difference between polyimide thin films cured in a conventional convection oven and those cured locally on MEMS microhotplates. The locally cured polyimide humidity sensor showed a linearity of 0.9995, a sensitivity of 0.77 pF/%RH, a hysteresis of 0.6 %RH, and a response time of 3s. These results indicate that the locally-cured polyimide films may be used as dielectric material of high speed, highsensitivity humidity sensors.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.766-771
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• 2000

This study is mainly concerned with friction and wear properties for the piston ring of non-lubricating air compressor which made of PTFE-polyimide composites. At the PTFE and polyimide alone mixture specimens, PTFE80%-polyimide20%, which shows the lowest men friction coefficient and specific wear rate at 0.94m/s sliding speed. At each of carbon, copper and oxide lopper mixed with PTFE80%-polyimide20%. In case of copper10%, at 0.94m/s sliding speed, the mean friction coefficient shows 0.087, which is the lowest value in all specimens. In case of the specific wear rate, copper30% specimen shows the lowest value of $2.537E-5(mm^3/Nm)$ in all specimens.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.147-152
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• 2007

UV laser ablation of polyimide is a combination of photochemical and photothermal mechanism. Photochemical mechanism is that molecular bonds are broken by photon energy and photothermal is evaporation and melt expulsion. When the laser processing, the etching depth needs to be calculated for prediction of processing result. In this paper, in order to predict the laser etching depth of polyimide by UV laser with the wavelength of 355nm, the theoretical model which includes both the photothermal and the photochemical effect was introduced. The model parameters were obtained by comparing with experimental results. The 3rd harmonic $Nd:YVO_4$ laser system was used in the experiment. From these experimental and theoretical results, the laser ablation of a polyimide was verified to achieve the highest quality microstructure.

• Journal of the Korean institute of surface engineering
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• v.25 no.2
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• pp.90-96
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• 1992

Thed effects of sputter gas pressure and substrate surface micro-roughness on the microstructure and surface topography have been investigated in the Cu thin films sputter deposited onto polyimide substrates. The surface roughness of polyimide was controlled by oxygen rf plasma treatment. In the Cu film deposited at the pressure of 5 mtorr, the surface is smooth and the columnar structure is not visible regardless of polyimide surface more open boundaries. The polyimide surface roughness enhances these effects, These phenomena can be explained in therm of atomic shadowing effect.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.672-676
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• 2009

Polymide is widely used alignment material of recent commercial LCD panel structure. Generally, polyimide alignment material is classified soluble polyimide type and polyamic acid type with their main bond structure of solution state. specially, compared to polyamic acid alignment layer, soluble polyimide type alignment layer have excellent reliability during long term LCD driving cause of their high imidazation ratio(%), high voltage holding ratio(%) and low ion density. The other side, this type alignment materials has significant DC image stickicng side effect for using in-plane switching mode lcd structure cause of their slow DC discharging property. we applied inorganic salt to usual soluble polyimide type alignment layer and found out this technique had good DC image sticking property without any loss of reliability property in inplane switching LCD cell structure. This approach leads excellent DC image sticking property with maintaining high reliability property this approach confirmed improves an image sticking and a reliability simultaneously from the horizontality aligned LCD mode whose relatively bad image sticking property.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.2
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• pp.62-67
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• 2013

The influence of internal stress and joint strength(shear, tensile) according to the deposition conditions was investigated by the Polyimide substrate and ZnO thin film. Deposition thickness and temperature affect the internal stress and the internal stress was minimum at the 60nm and $200^{\circ}C$ of the deposition conditions. Tensile strength is large at the deposition condition that shear strength is large and the shear strength was about 50% of the tensile strength. The shear strength and tensile strength were large at deposition condition that internal stress was small. Crack occurred near the joint interface of Polyimide substrate and progressed along the interface until the final fracture.

• Elastomers and Composites
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• v.47 no.2
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• pp.168-173
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• 2012

Polystyrene-polyimide core-shell microsphere was prepared by dispersion polymerization using poly(amic acid) as the stabilizer. Iron oxide was formed at the microsphere by thermal decomposition of iron pentacarbonyl impregnated in the microsphere. The magnetic polystyrene-polyimide microsphere was monodisperse and the size was about 500 nm. The magnetic polystyrene-polyimide microsphere had 40% of iron oxide, which was identified as $Fe_3O_4$ by X-ray diffraction.