A Study on the Deposition Conditions on Joint Strength of Polyimide Substrate and ZnO Thin Film

Polyimide 기판과 ZnO 박막의 접합강도에 미치는 증착조건에 관한 연구

  • Hur, Jang-Wook (Intelligent Mechanical Engineering, Kumoh Institute of Technology)
  • Published : 2013.04.30

Abstract

The influence of internal stress and joint strength(shear, tensile) according to the deposition conditions was investigated by the Polyimide substrate and ZnO thin film. Deposition thickness and temperature affect the internal stress and the internal stress was minimum at the 60nm and $200^{\circ}C$ of the deposition conditions. Tensile strength is large at the deposition condition that shear strength is large and the shear strength was about 50% of the tensile strength. The shear strength and tensile strength were large at deposition condition that internal stress was small. Crack occurred near the joint interface of Polyimide substrate and progressed along the interface until the final fracture.

Keywords

References

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