• Title/Summary/Keyword: Polyimide

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Fabrication of Organic-Inorganic Nanocomposite Blade for Dicing Semiconductor Wafer (반도체 웨이퍼 다이싱용 나노 복합재료 블레이드의 제작)

  • Jang, Kyung-Soon;Kim, Tae-Woo;Min, Kyung-Yeol;Lee, Jeong-Ick;Lee, Kee-Sung
    • Composites Research
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    • v.20 no.5
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    • pp.49-55
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    • 2007
  • Nanocomposite blade for dicing semiconductor wafer is investigated for micro/nano-device and micro/nano-fabrication. While metal blade has been used for dicing of silicon wafer, polymer composite blades are used for machining of quartz wafer in semiconductor and cellular phone industry in these days. Organic-inorganic material selection is important to provide the blade with machinability, electrical conductivity, strength, ductility and wear resistance. Maintaining constant thickness with micro-dimension during shaping is one of the important technologies fer machining micro/nano fabrication. In this study the fabrication of blade by wet processing of mixing conducting nano ceramic powder, abrasive powder phenol resin and polyimide has been investigated using an experimental approach in which the thickness differential as the primary design criterion. The effect of drying conduction and post pressure are investigated. As a result wet processing techniques reveal that reliable results are achievable with improved dimension tolerance.

Recovery of Valuable Minerals from Sea Water by Membrane Separation and Adsorption Process: A Review (막 분리와 흡착 과정을 통한 해수로부터의 주요 광물 회수: 리뷰)

  • Jeon, Sungsu;Patel, Rajkumar
    • Membrane Journal
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    • v.32 no.1
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    • pp.13-22
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    • 2022
  • Ever increasing global energy demand gives rise to uncontrollable environmental pollution. Demand on fossil fuel and consequent carbon emission leads to global warming and climate change. Nuclear energy is an alternative source to generate clean energy but mining of nuclear fuel is associated with harmful chemicals. Mining of valuable minerals from sea water by membrane separation process is a cost effective along with environmental friendly process. Separation and adsorption based mining of valuable minerals from sea water are another efficient process. Recovery of actinides from rare earth elements are very challenging and expensive process. Pressure driven membrane separation process is economically more viable along with environmental process. In this review membrane separation process are based on polyether sulfone, polyamide, polyimide, polyamidoxine and hybrid membranes. In case of adsorption process, mainly amidoxime kind of adsorbent are discussed.

Miscibility and Specific Intermolecular Interaction Strength of PBI/PI Blends Depending on Polyimide Structure(II) - Blend Systems with PIs Synthesized by DSDA - (폴리이미드 구조변화에 의한 방향족 PBI/PI 블렌드의 상용성 및 상호작용의 세기(II) - DSDA로 합성한 PI들과의 블랜드들 -)

  • Ahn, Tae-Kwang
    • Applied Chemistry for Engineering
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    • v.9 no.2
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    • pp.207-213
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    • 1998
  • On the basis of the previous study[1], miscibility were investigated and intermolecular interaction strength for the miscibility were relatively compared for the blends poly{2,2-(m-phenylene)-5,5'-bibenzimidazole}(PBI) with two aromatic polyimides (PIs) synthesized by another dianhydride. Aromatic PAAs were prepared by the reaction of condensation of two diamines, 4,4'-methylene dianiline(4,4'-MDA) and 4,4'-oxydianiline(4,4'-ODA) with 3,3',4,4'-diphenylsulfone tetracarboxylic dianhydride(DSDA) using DMAc, and then converted into PIs after curing. PBI/PAA blends were prepared by solution blending. Cast films or precipitated powders of the PBI/PAA blends were cared at a high temperature to transform into PBI/PIs blends. Miscibility and specific intermolecular interaction for miscibility in the blends were investigated, and compared with previous polyimide structures of PBI/PIs blends [1]. Two blends, PBI/DSDA+4,4'-MDA(Blend-V) and PBI/DSDA+4,4'-ODA(Blend-VI), were found miscible : the evidences were optically clear films, synergistic single composition dependent $T_g{\prime}s$, and frequency shifts of N-H stretching band as much as $39{\sim}40cm^{-1}$, and of C=O stretching band near 1730 and $1780cm^{-1}$, 5~6 and $3{\sim}4cm^{-1}$, respectively. The specific intermolecular interactions existing between PBI and PIs were relatively analyzed with the area(A) formed between the $T_g{\prime}s$ of the measured and that of the calculated by the Fox equation at all compositions, the ${\kappa}$ values in Gordon-Taylor equation obtained from the measured $T_g{\prime}s$, and differences of the frequency shifts in the functional N-H and carbonyl stretching band. From the results, the area(A) and the ${\kappa}$ values for Blend-V and VI were smaller than those for Blend-III and IV used in previous study[1]. Differences of the frequency shifts in the functional groups(N-H and C=O) also showed similar tendency. Thus, specific intermolecular interaction strength in terms of hydrogen bonding of PBI/PI blends is dependent upon chemical structures of PIs, that is, PIs it seems that $SO_2$ group in dianhydride(DSDA) has weaker hydrogen bond strength than those of C=O in BTDA. In other words, it implies that the former occupied bulk space than the latter due to the sterric effect.

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Separation and Recovery of $SF_6$ Gas from $N_2/SF_6$ Gas Mixtures by using a Polymer Hollow Fiber Membranes (고분자 중공사 분리막을 이용한 $N_2/SF_6$ 혼합가스로부터 $SF_6$의 분리 및 회수)

  • Lee, Hyun-Jung;Lee, Min-Woo;Lee, Hyun-Kyung;Lee, Sang-Hyup
    • Journal of Korean Society of Environmental Engineers
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    • v.33 no.1
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    • pp.47-53
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    • 2011
  • $SF_6$ (Sulfur hexafluoride) possesses high GWP (Global Warming Potential) as sepcified by the IPCC (Intergonvernmental Panel of Climate Change). Recently, the recovery-separtion of $SF_6$ research area, including permeation properties studies using various membrane's materials and the practical operation of recovery-separtion using membrane of waste $SF_6$ gas is in the initial state. The separation efficiency of a single $SF_6$ and waste $SF_6$ mixture was evaluated using a PSF (polysulfone), PC (tetra-bromo polycarbonate) and PI (polyimide) hollow fiber membranes. According to the results of single gases permeation properties, PI membrane has the highest permselectivity of $N_2$ gas in $N_2/SF_6$ gas. Under the condition of P=0.5 MPa, the highest concentration of recovered $SF_6$ is 95.6 vol % in the separation experiment of $SF_6/N_2$ mixture gas by PC membrane. Under the operation pressure of P=0.3 MPa at a fixed retentate flow rate fixed of 150 cc/min, the maximum recovery efficiency of $SF_6$ is up to 97.8% by PSF membrane. From the results above, it is thought that the separation and recovery technique of $SF_6$ gas using membrane will be used as the representative eco-technology in the $SF_6$ gas treatment in the future.

Permeation and Permselectivity variation of $O_2$, $CF_4$ and $SF_6$ through Polymeric Hollow Fiber Membranes (고분자 분리막 재질 변화에 따른 $O_2$, $CF_4$, $SF_6$ 투과도 및 투과선택도 특성 변화에 대한 연구)

  • Lee, Hyun-Jung;Lee, Min-Woo;Lee, Hyun-Kyung;Lee, Sang-Hyup
    • Membrane Journal
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    • v.20 no.3
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    • pp.249-258
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    • 2010
  • In this study, we tried to observe the permeation on the single $O_2$, $CF_4$ and $SF_6$ gas using a PSF (polysulfone), PC (tetra-bromo polycarbonate) and PI (polyimide) hollow fiber membranes. We also observed the permselectivity on the $O_2/SF_6$ and $CF_4/SF_6$. According to the results of single gases permeation for different pressures, PSF membrane has the highest $O_2$ permeation of 37.5 GPU and PC membrane has the highest $SF_6$ permeation of 2.7 GPU and the highest $CF_4$ permeation of 2.5 GPU at 1.1 MPa. According to the results of single gases permeation for different temperatures, PSF membrane has the highest permeation of $O_2$ at $45^{\circ}C$ and PC membrane has the highest permeation of $SF_6$ and $CF_4$ at $25^{\circ}C$. From the result of $O_2/SF_6$ and $CF_4/SF_6$ permselectivity for different pressures and temperature, the highest permeation and the lowest permselectivity were observed in the PSF and PC membrane. On the contrary, the lowest permeation and the highest permselectivity was observed in the PI membrane.

Soft-lithography for Manufacturing Microfabricated-Circuit Structure on Plastic Substrate (플라스틱기판 미세회로구조 제조를 위한 소프트 석판 기술의 적용)

  • Park, Min-Jung;Ju, Heong-Kyu;Park, Jin-Won
    • Korean Chemical Engineering Research
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    • v.50 no.5
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    • pp.929-932
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    • 2012
  • Novel platform technology has been developed to replace the photolithography used currently for manufacturing semiconductors and display devices. As a substrate, plastics, especially polycarbonates, have been considered for future application such as flexible display. Other plastics, i.e. polyimide, polyetheretherketon, and polyethersulfone developed for the substrate at this moment, are available for photolithography due to their high glass transition temperature, instead of high price. After thin polystyrene film was coated on the polycarbonate substrate, microstructure of the film was formed with polydimethylsiloxane template over the glass transition temperature of the polystyrene. The surface of the structure was treated with potassium permanganate and octadecyltrimethoxysilane so that the surface became hydrophobic. After this surface treatment, the nanoparticles dispersed in aqueous solution were aligned in the structure followed by evaporation of the DI water. Without the treatment, the nanoparticles were placed on the undesired region of the structure. Therefore, the interfacial interaction was also utilized for the nanoparticle alignment. The surface was analyzed using X-ray photoelectron spectrometer. The evaporation of the solvent occurred after several drops of the solution where the hydrophilic nanoparticles were dispersed. During the evaporation, the alignment was precisely guided by the physical structure and the interfacial interaction. The alignment was applied to the electric device.

Electrical Behavior of the Circuit Screen-printed on Polyimide Substrate with Infrared Radiation Sintering Energy Source (열소결로 제작된 유연기판 인쇄회로의 전기적 거동)

  • Kim, Sang-Woo;Gam, Dong-Gun;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.3
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    • pp.71-76
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    • 2017
  • The electrical behavior and flexibility of the screen printed Ag circuits were investigated with infrared radiation sintering times and sintering temperatures. Electrical resistivity and radio frequency characteristics were evaluated by using the 4 point probe measurement and the network analyzer by using cascade's probe system, respectively. Electrical resistivity and radio frequency characteristics means that the direct current resistance and signal transmission properties of the printed Ag circuit. Flexibility of the screen printed Ag circuit was evaluated by measuring of electrical behavior during IPC sliding test. Failure mode of the Ag printed circuits was observed by using field emission scanning electron microscope and optical microscope. Electrical resistivity of the Ag circuits screen printed on Pl substrate was rapidly decreased with increasing sintering temperature and durations. The lowest electrical resistivity of Ag printed circuit was up to $3.8{\mu}{\Omega}{\cdot}cm$ at $250^{\circ}C$ for 45 min. The crack length arisen within the printed Ag circuit after $10{\times}10^4$ sliding numbers was 10 times longer than that of after $2.5{\times}10^4$ sliding numbers. Measured insertion loss and calculated insertion loss were in good agreements each other. Insertion loss of the printed Ag circuit was increased with increasing the number of sliding cycle.

Design of the 60 GHz Single Balanced Mixer Integrated with 180° Hybrid Coupler Using MEMS Technology (HEMS 기술을 이용한 180° 하이브리드 결합기가 집적된 단일 평형 혼합기의 설계 및 제작에 관한 연구)

  • Kim Sung-Chan;Lim Byeong-Ok;Baek Tae-Jong;Ko Baek-Seok;An Dan;Kim Soon-Koo;Shin Dong-Hoon;Rhee Jin-Koo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.7 s.98
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    • pp.753-759
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    • 2005
  • In this paper, we have developed a new type of single balanced mixer with the RF MEMS $180^{\circ}$ hybrid coupler using surface micromachining technology. The $180^{\circ}$ hybrid coupler in this mixer is composed of the dielectric-supported air gapped microstriplines(DAMLs) which have signal line with $10{\mu}m$ height to reduce substrate dielectric loss and dielectric posts with size of $20{\mu}m{\times}20{\mu}m$ to elevate the signal line on air with stability At LO power of 7.2 dBm, the conversion loss was 15.5 dB f3r RF frequency or 57 GHz and RF power of -15 dBm. Also, we obtained the good RF to LO isolation of -40 dB at LO frequency of 58 GHz and LO power of 7.2 dBm. The main advantage of this type of mixer is that we are able to reduce the size of the chips due to integrating the MEMS passive components.

Investigation of Gas Transport Properties of Polymeric Membranes having Different Chain Lengths Via Molecular Dynamics (MD) (분자동역학을 이용한 고분자 주쇄의 길이 변화에 따른 기체 투과 성능 연구)

  • Kang, Hoseong;Park, Chi Hoon
    • Membrane Journal
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    • v.28 no.1
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    • pp.67-74
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    • 2018
  • In the molecular dynamics study of polymeric membranes, it is very important to select the proper length of the polymer main chain because it requires a large number of constituent atoms and a long time to simulate the permeation behavior. In this study, we tried to investigate how the correlation between polymer main chain length and permeation behavior appears in actual molecular dynamics simulation results. Molecular dynamics were performed using the widely known commercial polymer Kapton(R) polyimide structure and the gas permeation behavior was simulated. The movement of the polymer main chain was not related to its length and the short main chain length did not act more actively. In addition, unlike the prediction that the end group of the polymer main chain is relatively easy to move, there are many cases where the atoms located at the middle of the polymer main chains have a higher movement than the atoms located at the end groups. Finally, permeabilities of the gas molecules was not affected by the length of the main chain and the end groups of the polymer, which indicates that the end effect should be carefully mentioned and followed by the verification process.

Ion beam irradiation for surface modification of alignment layers in liquid crystal displays (액정 디스플레이 배향막을 위한 이온빔 표면조사에 관한 연구)

  • Oh, Byeong-Yun;Kim, Byoung-Yong;Lee, Kang-Min;Kim, Young-Hwan;Han, Jeong-Min;Lee, Sang-Keuk;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.04a
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    • pp.41-41
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    • 2008
  • In general, polyimides (PIs) are used in alignment layers in liquid crystal displays (LCDs). The rubbing alignment technique has been widely used to align the LC molecules on the PI layer. Although this method is suitable for mass production of LCDs because of its simple process and high productivity, it has certain limitations. A rubbed PI surface includes debris left by the cloth, and the generation of electrostatic charges during the rubbing induces local defects, streaks, and a grating-like wavy surface due to nonuniform microgrooves that degrade the display resolution of computer displays and digital television. Additional washing and drying to remove the debris, and overwriting for multi-domain formation to improve the electro-optical characteristics such as the wide viewing angle, reduce the cost-effectiveness of the process. Therefore, an alternative to non-rubbing techniques without changing the LC alignment layer (i.e, PI) is proposed. The surface of LC alignment layers as a function of the ion beam (IE) energy was modified. Various pretilt angles were created on the IB-irradiated PI surfaces. After IB irradiation, the Ar ions did not change the morphology of the PI surface, indicating that the pretilt angle was not due to microgrooves. To verify the compositional behavior for the LC alignment, the chemical bonding states of the ill-irradiated PI surfaces were analyzed in detail by XPS. The chemical structure analysis showed that ability of LCs to align was due to the preferential orientation of the carbon network, which was caused by the breaking of C=O double bonds in the imide ring, parallel to the incident 18 direction. The potential of non-rubbing technology for fabricating display devices was further conformed by achieving the superior electro-optical characteristics, compared to rubbed PI.

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