• Journal of the Korean Society for Precision Engineering
• /
• v.28 no.8
• /
• pp.929-935
• /
• 2011

As a deterministic finishing process for the optical parts having complex surface, machining performance of the magnetorheological(MR) fluid jet polishing of optical glass are studied and compared with a general water jet polishing. First, design of the jet polishing system which has the special electromagnet-nozzle unit for stabilizing the slurry jet based on MR fluid and the change of jet shape as magnetic field is applied are explained. Second, for the BK7 glass, machining spot and its cross section profile are analyzed and the unique effect of MR fluid jet polishing is shown. Third, both material removal depth and surface roughness are explored in order to investigate the polishing performance of MR fluid jet. With the same ceria abrasives and amount in the polishing slurries, MR fluid jet shows superior machining performance compared to water jet and the difference of material removal mechanism and its resulting performance are described.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.05a
• /
• pp.3-8
• /
• 2002

An intelligent polishing robot automation system is developed. Automatic Tool Change System(A.T.C.), Tool Posture Angle Control, and Robot Program for Polishing Application are developed and integrated into a robotic system that consists of a robot, pneumatic finding tool, and finding abrasives (papers and special films). A.T.C. is specifically designed to exchange whole grinding tool set for complete unmanned operation. Tool Posture Angle Control is developed to give a certain skew angle rather than right angle to tools on the surface for best finishing results. A.T.C. and Tool Posture Angle Control is controlled by a PC and the robot controller. Also, there have been some considerations on enhancing the performance of the system. Some elastic material is inserted between the grinding pad and the holder for better grinding contact. The robot path data is generated automatically from the NC data of previous machining process.

• International Journal of Precision Engineering and Manufacturing
• /
• v.5 no.2
• /
• pp.32-38
• /
• 2004

The electrorheological(ER) fluid has been used to the ultraprecision polishing of single crystal silicon as new polishing slurry whose properties such as yield stress and particle structure changed with the application of an electric field. In this work, it is aimed to find the effective parameters in the ER fluid on material removal in the polishing system whose structure is similar to that of the simple hydrodynamic bearing. The generated pressure in the gap between a moving wall and a workpiece, as well as the electric field-induced stress of the mixture of ER fluid-abrasives, is evaluated experimentally, and their influence on the polishing of single crystal silicon is analyzed. Moreover, the behavior of abrasive and ER particles is described.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.464-467
• /
• 2005

Among several polishing techniques for micro structures, polishing process using magnetorheological(MR) fluid has advantages in the finishing process of 3-D micro structures because abrasives in the fluid can reach surfaces with complex feature and play their role. Although many researchers have been trying to reveal its polishing mechanism of the MR polishing, it has not been successful because in-situ measurement of state variables is difficult and process parameters are complex. In fact, one of the key factors for applying process control methodologies, such as Run-to-Run control, is the measuring and monitoring of slurry quality because the process strongly depends on the fluid property. Therefore, it is necessary to maintain consistent slurry quality to guarantee the process repeatability. The proposed equipment achieves the longer life cycle of MR fluid and reduces the variability of products. A new method to measure the material removal rate in MRF polishing process is also proposed and discussed.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.55 no.6
• /
• pp.291-296
• /
• 2006

In this study, the sputtered BTO film was polished by CMP process with the self-developed $BaTiO_3$- and $TiO_2$-mixed abrasives slurries (MAS), respectively. The removal rate of BTO ($BaTiO_3$) thin film using the $BaTiO_3$-mixed abrasive slurry (BTO-MAS) was higher than that using the $TiO_2$-mixed abrasives slurry ($TiO_2$-MAS) in the same concentrations. The maximum removal rate of BTO thin film was 848 nm/min with an addition of $BaTiO_3$ abrasive at the concentration of 3 wt%. The sufficient within-wafer non-uniformity (WIWNU%) below 5% was obtained in each abrsive at all concentrations. The surface morphology of polished BTO thin film was investigated by atomic force microscopy (AFM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.239-242
• /
• 2004

We investigated the nanotopography impact on the post-chemical mechanical polishing (post-CMP) oxide thickness deviation(OTD) of ceria slurry with a surfactant. Not only the surfactant but also the slurry abrasive size influenced the nanotopography impact. The magnitude of the post-CMP OTD increased with adding the surfactant in the case of smaller abrasives, but it did not increase in the case of larger abrasives, while the magnitudes of the nanotopography heights are all similar. We created a one-dimensional numercal simulation of the nanotopography impact by taking account of the non-Prestonian behavior of the slurry, and good agreement with experiment results was obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05d
• /
• pp.105-108
• /
• 2003

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.557-560
• /
• 2003

Magnetorheological finishing(MRF) is a newly developed and recently commercialized for finishing optical components. The magnetorheological fluid consists of a water based suspension of carbonyl iron, nonmagnetic polishing abrasives, and small amounts of stabilizer. This magnetorheological fluid is pumped from conditioner on the rotating wheel and suctioned back to the conditioner, where it cooled to setpoint temperature and evaporative losses are replaced. This method could produce some problems in suction. So newly designed MRF tools is proposed in which MR fluid is not circulated and conditioned by the slurry. The new polishing mechanism is experimented. Measured surface roughness supports the validity of this mechanism.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.10a
• /
• pp.227-230
• /
• 2002

New polishing technique for small parts has been tried out using the principle of particle electromechanics. Common fine abrasives such as alumina, diamond, silicon carbide are dielectric materials which are polarized under an electric field, and a non-uniform electric field makes abrasive particles translate along the field line. Using this principle, We make abrasive particles aggregate in the vicinity of the micro tool which is fir the surface finishing of a small part without contact with it. The behavior of particles is optically measured, and the machined depth of glass is examined.

• Journal of the Semiconductor & Display Technology
• /
• v.3 no.1
• /
• pp.15-20
• /
• 2004

Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.