• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.487-487
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• 2009

One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.27-33
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• 2004

Electro-theological fluid is recently used for the micro polishing of 3-dimensional micro-aspherical lens. It's also used for polishing small area defects on the wide flat wafer. Since ER fluid shows a behavior of viscosity changing under certain electric fields. micro polishing efficiency may be enhanced for certain cases. In this paper, a perfluorinated carbonyl fluoride oil based ER fluids was used to improve surface polishing rate and submicron-scale accuracy. As the polishing electrodes, micro size cylindrical tools had been used for maximizing the electric field. An experimental device, which was applied for micro polishing a number of wafers of 4inches in size and other workpiece. was made on a precision polishing system. It consisted of a steel electrode. a wafer fixture. l0㎃ current and DC 5㎸ power supply unit, and a controller unit. From the Experiments. the ER fluid is applicable for micro polishing of small parts.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.32-38
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• 2006

The magnetic fluid polishing technique can polish the tool of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. Therefore, we producted the magnetic fluid polishing device in order that mirror like finishing processes the tool surface. In order to a polishing condition selection, polishing characteristic was estimated by polishing conditions which are magnetic flux density, polishing speed, grain size, magnetic fluid. The tool was polished to the selected polishing condition. The result to evaluate the polished tool's performance with the cutting force and tool wear, the polished tool's performance was improved compared with the tool not to polish.

• Journal of the Mineralogical Society of Korea
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• v.22 no.4
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• pp.353-358
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• 2009

The ability of natural abrasives which were recovered from CRT glass polishing process was evaluated. Comparing the center line average roughness values of a glass polished with new pumice (Ra = $0.039{\mu}m$) and with new garnet (Ra = $0.031{\mu}m$), the glass surface polished with the recycled pumice and the garnet had less pits on the surface with smaller Ra values (Ra = $0.025{\mu}m$ for recycled pumice and Ra = 0.029 for recycled garnet). Recycled rouge contains amorphous glass fragments so that it should be used as a cement replacement rather than recycle into an abrasive. Nnatural abrasives, pumice and garnet powder, which are used in CRT glass polishing process can be recycled into abrasives so that it can help to minimize costs and environmental impact from the production of abrasives and the disposal of waste sludge.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.316-321
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• 2011

Recently, it has been studied machining of micro parts with increasing demands for ultra precision parts. However, many engineering problems have already begun in polishing of optical parts or lens. As a method to overcome such problems, a new technology for the polishing of the target surface is being studied by controlling abrasives using MR fluids which are sensitive to magnetic fields. Since the current MR polishing system uses a big electromagnet, and is difficult to polish micro parts or spherical lens. Therefore, in this study, a round endmill type MR polishing system was developed to polish a three-dimensional structure which has spherical or inclined plane. And then, series of experiments were performed to verify the polishing performance of the developed round endmill type MR polishing system.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.65-65
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• 2003

Chemical mechanical polishing (CMP) is one of the most important processes in recent ULSI (Ultra Large Scale Integrated Circuit) manufacturing technology. Recently, ceria slurries with surfactant have recently been used in STI-CMP,[1] became they have high oxide-to-nitride removal selectivity and widen the processing margin The role of the abrasives, however, on the effect of planarization on STI-CMP is not yet clear. In this study, we investigated how the crystal characteristic affects the planarization efficiency of wafer surface with controlling crystallite size and poly crystalline abrasive size independently.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.11
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• pp.551-555
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• 2004

In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.138-143
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• 2012

A polishing method using magnetorheological (MR) fluid has been developed as a new precision technique to obtain a fine surface. The process uses a MR fluid that consists of magnetic carbonyl iron (CI) particles, nonmagnetic polishing abrasives, water and stabilizers. But the CI particles in MR fluids cause a severe corrosion problem. When coated with Xanthan gum, the CI particles showed long-term stability in corrosive aqueous environment. The surface roughness obtained from the MR polishing process was evaluated. A series of experiments were performed on fused silica glass using prepared slurries and various process conditions, including different polishing times. Outstanding surface roughness of Ra=2.27nm was obtained on the fused silica glass. The present polishing method could be used to produce ultra-precision micro parts.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1836-1839
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• 2003

This paper describes the surface polishing characteristics of a flat and free surface ferromagnetic substance(SM45C) that magnetic abrasive polishing processed. The effects of the various working factors on the surface roughness are clarified by experiments respectively, such as magnetic flux density. rotation speed of magnetic head. working gap, feed rate of workpiece. diameter of magnetic abrasives. and shape of workpiece. On the basis of these experiments, the polishing mechanism is discussed and the characteristics of the polishing process are described. In addition, it is found experimentally that die ＆ mold surfaces are also polished precisely by this process