• Title/Summary/Keyword: Point defect

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Development of ${\mu}BGA$ Solder Ball Inspection Algorithm (${\mu}BGA$ 납볼 검사 알고리즘 개발)

  • 박종욱;양진세;최태영
    • Proceedings of the IEEK Conference
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    • 2000.06d
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    • pp.139-142
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    • 2000
  • $\mu$BGA(Ball Grid Array) is growing in response to a great demand for smaller and lighter packages for the use in laptop, mobile phones and other evolving products. However it is not easy to find its defect by human visual due to in very small dimension. From this point of view, we are interested its development of a vision based automated inspection algorithm. For this, first a 2D view of $\mu$BGA is described under a special blue illumination. Second, a notation-invariant 2D inspection algorithm is developed. Finally a 3D inspection algorithm is proposed for the case of stereo vision system. As a simulation result, it is shown that 3D defect not easy to find by 2D algorithm can be detected by the proposed inspection algorithm.

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A Study on the Development of Aluminum Piston by Forging Process (알루미늄 단조 피스톤의 개발에 관한 연구)

  • Kim, Y.H.;Bae, W.B.;Kim, H.S.
    • Journal of the Korean Society for Precision Engineering
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    • v.14 no.9
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    • pp.30-36
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    • 1997
  • In this study, the development of an aluminum forged piston was tried to substitute the cast piston, in which there were internal defects such as blow hole and shrink pipe. A gasoline engine piston was chosen as an example for developing the forged piston. Before aluminum forging, model, material (plasticine) test was carried out to investigate the forgeability and internal flow pattern of the forged piston at room temperature. From the result of model material test, an aluminum piston to be forged was redesigned. The aluminum pistion was forged in hot process. The quality of a forged piston was compared with that of a cast piston in the point of mechanical properties, internal defect and microstructure. It was proved that the forged piston was superior to the cast piston.

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A Decision Tree Approach for Identifying Defective Products in the Manufacturing Process

  • Choi, Sungsu;Battulga, Lkhagvadorj;Nasridinov, Aziz;Yoo, Kwan-Hee
    • International Journal of Contents
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    • v.13 no.2
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    • pp.57-65
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    • 2017
  • Recently, due to the significance of Industry 4.0, the manufacturing industry is developing globally. Conventionally, the manufacturing industry generates a large volume of data that is often related to process, line and products. In this paper, we analyzed causes of defective products in the manufacturing process using the decision tree technique, that is a well-known technique used in data mining. We used data collected from the domestic manufacturing industry that includes Manufacturing Execution System (MES), Point of Production (POP), equipment data accumulated directly in equipment, in-process/external air-conditioning sensors and static electricity. We propose to implement a model using C4.5 decision tree algorithm. Specifically, the proposed decision tree model is modeled based on components of a specific part. We propose to identify the state of products, where the defect occurred and compare it with the generated decision tree model to determine the cause of the defect.

Atomistic modeling for 3D dynamci simulation of ion implantation into crystalline silicon

  • 손명식;강정원;변기량;황호정
    • Proceedings of the IEEK Conference
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    • 1998.06a
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    • pp.421-424
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    • 1998
  • In this paper are presented a newly proposed 3D monte carlo (MC) damage model for the dynamic simulation in order to more accurately and consistently predict the implant-induced point defect distributions of the various ions in crystalline silicon. This model was applied to phosphorus implants for the ULSI CMOS technology developement. In additon, a newly applied 3D-trajectory split method has been implemented into our model to reduce the statistical fluctuations of the implanted impurity and the defect profiles in the relatively large implanted area as compared to 1D or 2D simulations. Also, an empirical electronic energy loss model is proposed for phosphorus and silicon implants. The 3D formations of the amorphous region and the ultra-shallow junction around the implanted region could be predicted by using our model, TRICSI(Transport ions into crystal-silicon).

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Point-defect study from low-temperature photoluminescence of ZnSe layers through the post-annealing in various ambient

  • Lee, Sang-Youl;Hong, Kwang-Joon;Kim, Hae-Jeong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.378-378
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    • 2010
  • The ZnSe epilayers were grown on the GaAs substrate by hot wall epitaxy. After the ZnSe epilayers treated in the vacuum-, Zn-, and Se-atmosphere, respectively, the defects of the epilayer were investigated by means of the low, temperature photoluminescence measurement. The dominant peaks at 2.7988 eV and 2.7937 eV obtained from the PL spectrum of the as-grown ZnSe epilayer were found to be consistent with the upper and the lower polariton peak of the exciton, $I_2$ ($D^{\circ}$, X), bounded to the neutral donor associated with the Se-vacancy. This donor-impurity binding energy was calculated to be 25.3 meV. The exciton peak, $I_l^d$, at 2.7812 eV was confirmed to be bound to the neutral acceptor corresponded with the Zn-vacancy.

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A Study of DHF application at W CMP Cleaning Process (W CMP 세정 공정에서 DHF에 적용에 관한 연구)

  • Kim, Sang-Yong;Seo, Yong-Jin;Lee, Woo-Sun;Kim, Chang-Il;Chang, Eui-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.147-150
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    • 2002
  • In this study, we evaluated the dilute HF Cleaning to reduce residual defects made by W CMP process. But, One point we should focus is It should not effect to metal thin film reliability. The purpose of this test is to verify barrier metal damage during HF cleaning and based on this result we get rid of slurry residue defect which is main defect of W CMP process for the better yield.

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A Novel OLED Inspection Process Method with Simultaneous Measurement for Standard and Deposition Pattern (기준패턴과 증착패턴의 동시 측정을 통한 OLED 공정 검사 방법)

  • Kwak, Byeongho;Cheoi, Kyungjoo
    • Journal of Korea Society of Digital Industry and Information Management
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    • v.15 no.4
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    • pp.63-70
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    • 2019
  • The subject of the simultaneous measuring system of base pattern and deposition pattern is a new research topic on a defect inspection of OLED. In this paper, we propose a new OLED inspection method that simultaneously measures standard and deposition pattern images. This method reduces unnecessary processes and tac time during OLED inspection. For an additional reduction of the tac time during pattern measurement, the ROI was configured to measure only in the designated ROI area instead of measuring the entire area of an image. During the ROI set-up, the value of effective deposition pattern area is included so that if the deposition pattern is out of the ROI zone, it would be treated as a defect before measuring the size and center point of the pattern. As a result, the tac time and inspection process could be shortened. The proposed method also could be applied to the OLED manufacturing process. Production of OLED could be increased by reducing tac time and inspection process.

Thermal Properties of Diamond Films Deposited by Chemical Vapor Depositon

  • Chae, Hee-Baik;Baik, Young-Joon
    • The Korean Journal of Ceramics
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    • v.3 no.1
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    • pp.29-33
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    • 1997
  • Four diamond films were deposited by the microwave plasma assisted chemical vapor deposition method varying CH4 concentration from 2.5 to 10% in the feeding gases. Thermal conductivity was measured on these free standing films by the steady state method from 80 K to 400K. They showed higher thermal conductivity as the film deposited with lower methane concentration. One exception, 7.79% methane concentration deposited film, was observed to be the highest thermal conductivity. Phonon scattering processes were considered to analyze the thermal conductivity with the full Callaway model. The grain size and the concentration of the extended and the point defects were used as the fitting parameters. Microstructure of diamond films was investigated with the scanning electron microscopy and Raman spectroscopy.

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Behaviors of surface micro-crack of 304 stainless steel at elevated temperature (304스테인리스강의 고온표면미소 균열의 거동에 관한 기초적 연구)

  • 서창민;이정주;김영호
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.12 no.6
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    • pp.1320-1326
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    • 1988
  • This paper deals with the behavior of surface crack growth and the characteristics of surface micro-crack distribution under creep and creep-fatigue with 1 min. and 10 min. of load holding times at 593.deg.C, in air. The test specimen is a plate type with a small artificial defect of type 304 the small defect has been carried out by the surface replica method and optical microphotography. The experimental results have been interpreted from the view-point of fracture mechanics. It can be concluded that the longer the hold time the longer the total life time. Most of surface micro-cracks initiate at grain boundaries before the specimen reaches 20% of its total life time, a few of them lead to fracture by coalescence with the main crack.

Implementation of a Modified SQI for the Preprocessing of Magnetic Flux Leakage Signal

  • Oh, Bok-Jin;Choi, Doo-Hyun
    • Journal of Magnetics
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    • v.18 no.3
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    • pp.357-360
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    • 2013
  • A modified SQI method using magnetic leakage flux (MFL) signal for underground gas pipelines' defect detection and characterization is presented in this paper. Raw signals gathered using MFL signals include many unexpected noises and high frequency signals, uneven background signals, signals caused by real defects, etc. The MFL signals of defect free pipelines primarily consist of two kinds of signals, uneven low frequency signals and uncertain high frequency noises. Leakage flux signals caused by defects are added to the case of pipelines having defects. Even though the SQI (Self Quotient Image) is a useful tool to gradually remove the varying backgrounds as well as to characterize the defects, it uses the division and floating point operations. A modified SQI having low computational complexity without time-consuming division operations is presented in this paper. By using defects carved in real pipelines in the pipeline simulation facility (PSF) and real MFL data, the performance of the proposed method is compared with that of the original SQI.