Development of ${\mu}BGA$ Solder Ball Inspection Algorithm

${\mu}BGA$ 납볼 검사 알고리즘 개발

  • Published : 2000.06.01

Abstract

$\mu$BGA(Ball Grid Array) is growing in response to a great demand for smaller and lighter packages for the use in laptop, mobile phones and other evolving products. However it is not easy to find its defect by human visual due to in very small dimension. From this point of view, we are interested its development of a vision based automated inspection algorithm. For this, first a 2D view of $\mu$BGA is described under a special blue illumination. Second, a notation-invariant 2D inspection algorithm is developed. Finally a 3D inspection algorithm is proposed for the case of stereo vision system. As a simulation result, it is shown that 3D defect not easy to find by 2D algorithm can be detected by the proposed inspection algorithm.

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