• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.714-717
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• 2007

In this study, a novel actuator was developed by employing the newly-synthesized ionic networking membrane (INM) of poly (styrene-alt-maleic anhydride) (PSMAn)-incorporated poly (vinylidene fluoride) (PVDF). Based on the same original membrane, various samples of INM actuator were prepared through different reduction times with the electroless-plating technique. The as-prepared INM actuators were tested in terms of surface resistance, platinum morphology, resonance frequency, tip displacement, current and blocked force, and their performance was compared to that of the widely-used traditional Nafion actuator. Scanning electron microscope (SEM) and transmission electron microscopy (TEM) revealed that much smaller and more uniform platinum particles were formed on the surfaces of the INM actuators as well as within their polymer matrix. Although excellent harmonic response was observed for the newly-developed INM actuators, this was found to be sensitive to the applied reduction times during the fabrication. The mechanical displacement of the INM actuator fabricated after optimum reduction times was much larger than that of its Nafion counterpart of comparable thickness under the stimulus of constant and alternating current voltage.

• Environmental Mutagens and Carcinogens
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• v.18 no.1
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• pp.15-21
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• 1998

Transgenic animal and cell line models which are recently developed and used in toxicology fields combined with molecular biological technique, are powerful tools to study the mechanism of mutation in vivo and in vitro, respectively. Transgenic models, which have exogenous DNA incorporated into their genome, carry recoverable shuttle vector containing reporter genes to assess endogenous effects or alteration in specific genes related to disease processes. The lac I and lac Z gnee most widely used as a mutational target in transgenic systems. The assay is performed by treatment with putative mutagenic agents, isolation of genomic DNA from cells or tissues, exposure the isolated DNA to in vitro packaging extract, plating and sequencing. The results from these processes provide not only mutant frequency as quantitative evaluation but also mutational spectrum as qualitative evaluation of various agents. Therefore we introduce and review the principle, detailed procedure and application of transgenic mutagenesis assay system in toxicology fields especially in mutagenesis and carcinogenesis.

• Journal of the Korea Institute of Military Science and Technology
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• v.18 no.5
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• pp.485-491
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• 2015

In this study, the experimental and analytical investigation on structural integrity evaluation of spline shaft of self propelled artillery' generator were carried out. For this work, macro and microstructure fractography of spline shaft were observed. According to the results of the structure analysis and simulation, the shaft was redesigned and optimized. To improve the stiffness and shear stress, the material was changed from the SNCM220 to SNCM439 and surface roughness and protective coating treatment are changed to increase the stress relaxation, respectively. From the result of the torsion test of shaft and accelerated life test of generator, the shaft of a SNCM439 with heat-treatment(Q/T) and electroless nickel plating was superior quality reliability and durability than the others. Therefore, modeling and simulation corresponded well with the experimental result and structural safety was confirmed by generator performing.

• Journal of Microbiology and Biotechnology
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• v.17 no.1
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• pp.168-175
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• 2007

We report here on the cultivation of numerous novel bacterial species from a eutrophic freshwater pond. A total of 60 strains, 15 strains per each culture medium, were obtained from the surface of a eutrophic freshwater pond by employing a conventional dilution-plating method with four different kinds of culture media, including R2A, 1/10R2A, PCA, and 1/10PCA. Among the 60 strains isolated, 27 strains showed less than 97% 16S rRNA gene sequence similarities to validly published species, and thus they are considered to comprise 19 novel species. Of the 27 strains assigned to the novel species, the majority of the strains (20 strains) were affiliated with the Alphaproteobacteria and Betaproteobacteria. The remaining 7 strains were affiliated with the Gammaproteobacteria, Firmicutes, Actinobacteria, and Deinococci. Because we have isolated 19 novel species from a usual freshwater pond using a conventional culturing technique, our results suggest that an unexplored ecosystem, even if it looks like a common ecosystem found elsewhere, harbors diverse unidentified microbes, which will be definitely further characterized.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.2
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• pp.257-262
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• 2008

In this paper, the key parameters of $CO_2$ laser(focus depth, air blow rate, total laser beam time, number of pulse) are experimented for thru-hole and scribing line on AIN(aluminum nitride) substrate with high thermal conductivity. And, microstrip line & spiral planar inductor are fabricated on AIN substrate using 5 um Cu-plating with self-masking technique. The microstrip line of AIN has 0.1 dB/mm attenuation at 10 GHz and 6 nH spiral planar inductor has 56 maximum quality factor at 1 GHz. Thus, the AIN substrate is promising for GHz applications of high power area.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.5 s.176
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• pp.1254-1260
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• 2000

There have been many developments in super precision working technique and working method up to, now. But, it is very difficult to evaluate working surface accurately without the technicians experience and judgment. Surface roughness tester using stylus was used to measure surface condition generally But this method is not so desirable because of damage on test piece caused by contact between the workpiece and the stylus sensor. As a result, non-contact method was known as a good way to carry, out this process without damage. However, this is a difficult one among the various measuring methods. So we are tying to suggest a new method using texture analysis through image processing to get a surface information in worked test piece. Co-occurrence matrix using difference of gray levels between a pixel and its neighboring one was used to study behavior of surface roughness and to J acquire data for analysis. Standard specimen was adapted to verify this research. We suggest texture information method in order to evaluate surface state for the best measurement system.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Progress in Superconductivity
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• v.7 no.2
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• pp.179-183
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• 2006

As a material for SFCL(Superconducting Fault Current Limiter), BSCCO tube with metal stabilizer is a promising candidate, assuring the stability and large power capacity, For the application, the proper soldering technique, which overcome the difficulties of the joining between BSCCO and metal stabilizer, is required. In this study, after soldering In-Bi solder and In-Sn solder with BSCCO superconductor, welding properties between BSCCO and solders were investigated. Because ceramic materials is difficult to weld, Ag electro-plating on BSCCO 2212 is used for intermetallic layer. To find out the best welding condition for superconductor, soldering is tested in the maximum temperature from $155^{\circ}C\;to\;165^{\circ}C$ in the reflow oven. By investigating the composition and thickness of IMC (lntermetallic Compound) created in the reaction of Ag with solder, we analyzed the welding properties of High-Tc superconductor from a micro point of view.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.304-304
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• 2014

Quaternary Ti-Al-Si-N films were deposited on WC-Co substrates by a hybrid deposition system of arc ion plating (AIP) method for Ti-Al source and DC magnetron sputtering technique for Si incorporation. The synthesized Ti-Al-Si-N films were revealed to be composites of solid-solution (Ti,Al)N crystallites and amorphous $Si_3N_4$ by instrumental analyses. The Si addition in Ti-Al-N films affected the refinement and uniform distribution of crystallites by percolation phenomenon of amorphous silicon nitride, similarly to Si effect in TiN film. As the Si content increased up to about 9 at.%, the hardness of Ti-Al-N film steeply increased from 30 GPa to about 50 GPa. The highest microhardness value (~50 GPa) was obtained from the Ti-Al-Si-N film having the Si content of 9 at.%, the microstructure of which was characterized by a nanocomposite of $nc-(Ti,Al)N/a-Si_3N_4$.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.11
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• pp.1600-1604
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• 2017

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.