• 한국표면공학회지
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• 제43권6호
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• pp.255-259
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• 2010

In this work, Ni-Co composites incorporated with nano-sized SiC particles in the range of 45-55 nm are prepared by electroplating. The effects of plating duration on the chemical composition, surface morphology, crystalline structures and hardness have been studied. The maximum hardness of Ni-Co-SiC composite coating is approximately 633 Hv at plating duration of 1 h. The hardness is gradually decreased with increasing plating duration, which can be attributed to the growth of crystalline size and the agglomerates of SiC nano-particles. It is therefore explained that the grain refinement of Ni-Co matrix and stable dispersion of SiC particles play an important role for strengthening, which indicate Hall-Petch relation and Orowan model were dominant for hardening of Ni-Co-SiC composite coatings.

• Transactions on Electrical and Electronic Materials
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• 제6권5호
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• pp.225-228
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• 2005

In this work, we studied the optimized copper thickness in Cu ECP (Electrochemical Plating). In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge (bump, hump or over-plating amount), Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness. In the aspect of bump and dishing, the bulge increased according as target plating thickness decreased. Dishing of edge was larger than center of wafer. Also in case of electrical property, metal line resistance distribution became broad gradually according as Cu ECP thickness decreased. In conclusion, at least $20\%$ reduced Cu ECP thickness from current baseline; $0.8\;{\mu}m$ and $1.0\;{\mu}m$ are suitable to be adopted as newly optimized Cu ECP thickness for local and intermediate layer.

• 한국표면공학회지
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• 제48권4호
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• pp.149-157
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• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

• Korean Chemical Engineering Research
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• 제45권4호
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• pp.384-390
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• 2007

본 연구는 $CO_2$ 초임계 유체를 도금액과 혼합하여 PET 필름 위에 무전해 구리도금을 실시하였으며 초임계 유체의 혼용조건에 따른 그 도금 효과를 비교하였다. 이산화탄소 초임계 유체와 도금액의 부피비는 1:9가 최적이였으며 초임계 유체가 10 vol% 이상이 되면 혼합액의 분산성이 불량해져 층분리가 발생하였다. 구리 무전해도금은 $25^{\circ}C$, 15 MPa 에서 수행된 구리막의 표면물성이 가장 균일하였다. 무전해 구리도금에서 도금액과 혼합시킨 초임계 유체의 역할은 단순히 용해도를 높여 주는 것이 아니라 도금막을 구성하는 구리입자를 1차 입자상태로 분산, 유지시킴을 확인하였다.

• 마이크로전자및패키징학회지
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• 제8권3호
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• pp.55-62
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• 2001

최근 전자 제품에서 사용이 폭발적으로 증가하고 있는 BGA, CSP 등의 면실장형 부품의 폭 넓은 채용에 따라서 베어 보드에서 solderability에 영향을 미치는 평탄한 표면 처리에 대한 요구는 갈수록 증가되고 있다. 무전해 Ni/Au도금 처리는 이러한 요구에 대한 해결책을 가지고 있어서 많은 전자제품에서 평탄한 표면 처리를 요구하는 응용 분야에 폭 넓게 사용되고 있다. 그러나, 무전해 Ni/Au 도금은 평탄한 표면 처리를 가지는 반면에 도금 공정에서 Ni의 산화와 적정한 P성분과 같은 몇 가지 해결요소를 가지고 있는 실정이다. 본 연구에서는 무전해 Ni/Au 도금 처리를 한 보드에서 BGA의 solderability에 미치는 영향을 사전 조사한 후, NiP 산화 특성과 보드의 휨과 간은 주요 인자를 선정하였다. 이를 위하여 먼저, 다양한 도금 조건을 가지는 테스트 보드를 제작한 후, 도금 공정에서 P성불을 감소시켜 NiP 산화 특성을 개선하였다. 또한 다양한 내층 구조와 휨 분석을 통해 내층 구조를 개선하여 보드의 휨을 최소화하였다. Solderability의 평가를 위해서 최적의 조건으로 제작된 보드에 BGA를 실장하여 보드의 휨과 도금 특성을 분석하였다. BGA의 접합부 조직은 주사 전자현미경(SEM: Scanning Electronic Microscope)과 광학 현미경(Optical Microscope)으로 관찰하였으며, 성분 분석은 EDS(Energy Dispersive Spectroscopy)를 활용하였다. 또한 기계적인 특성은 ball shear tester를 사용해서 파괴 강도와 모드를 분석하였다.

• 한국표면공학회지
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• 제41권6호
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• pp.312-324
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• 2008

In this study, the functional property as a super abrasive material was secured for CBN powder by the electroless Ni-P plating on the surface of the particle. The plating solution has been prepared to control the surface morphology by regulating surfactants and process conditions. The effects of processing parameters on the surface morphology of CBN powder was discussed. The results are summarized as follows; A stable plating tendency was achieved from 1 hour after quantitatively dropping reducing agent. It was observed that more than 50% of the weight gain was obtained by Ni-P coating on the surface of CBN super abrasive powder. The morphology of the Ni-P coating layer is consisted of botryoidal and spiky type and it could be controlled by regulating processing parameters. Superior characteristic in terms of surface morphology was found in the nonionic surfactant XL-80N. It was found that XL-80N considerably decreased surface tension of CBN powder and Ni-P alloy surface then enhance wettability as well as plating rate. Metal coated CBN powder as a raw material of resin bond wheel has been developed through this investigation.

• Journal of Mechanical Science and Technology
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• 제17권12호
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• pp.1904-1911
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• 2003

In order to determine the wear properties of AIP (Arc Ion Plating) deposition, wear process was evaluated by using a Falex test machine. Also, in order to determine the effects of coating material on the wear process, TiC, TiN, and TiCN coatings of thickness about 5 $\mu\textrm{m}$∼6 $\mu\textrm{m}$ coated by Arc ion plating deposition method were tested. The wear property was determined under a dry sliding condition as a function of the applied load, sliding distance, sliding velocity and temperature. The results show that when wear of the coating-layer occurred, specific wear amount increased with the wear rate. At initial state, the wear rate rapidly increased, but it gradually reduced as the velocity increased. Also, when raising the temperature, the wear rate increased in the order of TiCN, TiN and TiC due to the frictional heat.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.909-911
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• 세라미스트
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• 제21권2호
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

• 전기화학회지
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• 제3권4호
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• pp.196-199
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• 2000

무전해 도금은 내식성, 내구성, 전도성 특별히 비전도성 물질의 도금이 요구되는 모든 재료에 폭 넓게 사용되는 우수한 표면 처리 방법이다. 무전해 니켈 도금은 비자성, 무정형 구조,내구성, 내식성 그리고 열정 안정성 등의 많은 장점을 갖는다. 본 연구에서는 무전해 니켈 도금의 열처리에 따른 무전해 니켈-인 도금의 경도와 내식성의 변화를 연구하였다. 가장 높은 경도 값은 $500^{\circ}C$열처리에서 얻어졌다. $300^{\circ}C$에서 열처리한 도금의 내식성이 60시간 동안 1몰의 황산 수용액에서 테스트 한 결과 가장 우수하였다.