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Effect of Added Supercritical CO2 on the Characteristics of Copper Electroless Plating on PET Film Substrate  

Lee, Hee-Dai (Department of Chemical Engineering, Sungkyunkwan University)
Kim, Moon-Sun (Department of Chemical Engineering, Sungkyunkwan University)
Kim, Chul kyung (Department of Design & Materials, Mokwon University)
Publication Information
Korean Chemical Engineering Research / v.45, no.4, 2007 , pp. 384-390 More about this Journal
Abstract
In this study, electroless plating of copper was performed on PET film by using the blend of supercritical $CO_2$ and plating solution. The optimum volumetric ratio of supercritical fluid and plating solution was found to be 1:9 and dispersion property was poor at $CO_2$ vol% langer than 10%. Electroless plating of copper was best at $25^{\circ}C$ and 15 MPa. Role of added supercritical $CO_2$ is not to increase solubility but to disperse and maintain Cu-particles as the 1st particles.
Keywords
Electroless Plating; Copper Plating; Supercritical Fluid; PET Film;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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