• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.567-568
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• 2006

Generally, progressive type GMP process is more efficient than batch type because there are advantages that problems of each stage(heating, press, cooling etc.) are easily grasped and a time of production is shortened. But if single cavity is used in progressive type GMP process, there is disadvantage that productivity is decreased. So, in order to improve productivity of progressive type GMP process, it is essential to secure multi cavity mold technic. In this study, as a fundamental study to develop multi cavity used in glass lens molding, we conducted a compression test for PBK40.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.20.2-20.2
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• 2005

• 대한기계학회논문집B
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• 제30권6호
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• pp.514-522
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• 2006

This study has been performed to predict the transient thermal behavior of the plate in indirectly-fired continuous heat treatment furnace. The temperature profiles in the plate are determined solving the transient one-dimensional heat conduction equations. To verify the validity of the present numerical results, the present results obtained from the transient analysis are compared with those of experiments. Extensive parametric investigations are performed to examine the effects of the emissivities of the plate and refractory, plate thickness and velocity, as well as the gas temperature, on the thermal behavior of the plate.

• 한국건축시공학회지
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• 제18권5호
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• pp.463-469
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• 2018

기존의 다층으로 구성되어 시공성이 낮은 옥상녹화 공법의 개선을 위해 개발한 방수 방근 시트 일체화 옥상녹화박스 유닛공법의 일체화를 위해 사용하는 전자기 유도가열방식의 금속 고정구와 콘 형상 고정구의 부착성능을 평가하기 위해 엔지니어링 PE, TPO, PVC 시트 등 3종류의 시트에 가열온도에 따른 부착성능 및 동일한 시험체로 냉열반복 후 부착성능을 측정하였다, 그 결과는 엔지니어링 PE시트에 부착한 고정구의 부착성능이 가장 우수하게 나타났으며, 금속고정구는 가열온도가 올라갈수록, 콘 형상 고정구는 가열온도가 낮을수록 우수한 부착성능을 보여주었고, 냉열 반복 후 부착시험 결과는 상온 부착시험 결과와 동일하게 나타났다. 기존의 양면 부틸테이프 고정방식의 콘 형상 고정구는 낮은 부착하중과 냉열반복에 의한 뚜렷한 성능저하가 발생하는데 비하여 전자기 유도가열방식의 고정구는 우수한 성능을 유지하였다.

• 한국식품영양학회지
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• 제30권3호
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• pp.464-472
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• 2017

The qualities of rice cooked on heat plate, induction heat and heat plate with pressure, were investigated. The weight, volume, water soluble index (WSI), hydration by SEM (Scanning Electron Microscope), and gelatinization by DSC (Differential Scanning Calorimetry), as well as the consumer acceptability of cooked rice were analyzed. The weight, volume and WSI of rice cooked on heat plate with pressure were higher than those of rice cooked on heat plate and induction heat. The rice cooked on heat plate with pressure also showed higher degree of hydration and gelatinization, and lower degree of enthalpy of gelatinization than the rice cooked on heat plate and induction heat for 5~15 min. The consumer acceptability revealed that the odor, appearance, taste, texture and overall acceptance of rice cooked on induction heat were better than those of rice cooked on heat plate and heat plate with pressure. During storage in a cooker for 0~12 h, there was a decrease in the consumer acceptability of cooked rice. Overall results indicate that the qualities of rice cooked on induction heat and heat plate with pressure were higher than those of rice cooked on heat plate.

• Journal of Advanced Marine Engineering and Technology
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• 제34권5호
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• pp.617-624
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• 2010

선박 건조공정에서 외피의 곡면 가공에 많이 사용하는 가공법을 선상가열법이라고 한다. 선상가열법은 엔지니어의 숙련도에 따라 품질의 차이가 커지기 때문에 현재에는 엔지니어의 숙련도에 의존하지 않는 자동화기기를 사용하여 선상가열을 수행하는 경우가 많다. 본 연구에서는 자동화기기를 사용한 선상가열에 의한 가열판재의 온도분포를 조사하고자 한다. 선상가열시 적용되는 주요한 변수는 가열원의 이동속도, 강도 및 가열 방식 등이 있으며, 본 연구에서는 세 가지 변수를 중심으로 가열판재의 표면 및 내부온도가 어떻게 변화하는지를 조사하였다. 해석결과 가열원의 이동속도가 빨라질수록 판재의 피크온도는 낮게 형성되는 것을 확인하였고, 또한 열원의 크기에 따른 피크온도 및 온도분포가 선형적으로 변화하는 것을 정량적으로 계산할 수 있었다.

• 전기학회논문지P
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• 제57권4호
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• pp.408-411
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• 2008

As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. For this, it adheres closely to the substrate, in which the photosensitive film is coated and the heating plate layer, adhering closely to the floor side of a substrate the mica layer which adheres closely to the floor side of the upper heating plate layer in order to minimize an insulation and heat loss, and the lower part of the mica layer and it is comprised of the floor plate layer. The heating plate layer forms the continued groove portion over the floor side whole. The sheath heater for heating a substrate is inserted with the groove portion and the heating plate layer is comprised. It is confirmed that by using the new substrate heating structure, the temperature change of the heating plate against the time is observed. Then, there is the electric power saving effect of about 40% in comparison with the existing method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.55-56
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• 2009

A light guiding plate (LGP) with nanometer-sized patterns was fabricated by injection molding method which employed electrically healed mold and the transcription of injection-molded parts was investigated. A Ni stamper was fabricated using MEMS technology. The Ni stamper was then installed in a movable heated core which is a key part of the mold. Using this mold, injection-molded plastic LGP parts were manufactured at different mold temperatures and the effect of the temperature on the transcription of the parts was investigated.

• 한국전산유체공학회지
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• 제21권2호
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• pp.90-98
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• 2016

A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

• Current Photovoltaic Research
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• 제4권2호
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• pp.59-63
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• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.