• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.567-568
• /
• 2006

Generally, progressive type GMP process is more efficient than batch type because there are advantages that problems of each stage(heating, press, cooling etc.) are easily grasped and a time of production is shortened. But if single cavity is used in progressive type GMP process, there is disadvantage that productivity is decreased. So, in order to improve productivity of progressive type GMP process, it is essential to secure multi cavity mold technic. In this study, as a fundamental study to develop multi cavity used in glass lens molding, we conducted a compression test for PBK40.

• Proceedings of the KSME Conference
• /
• 2005.11a
• /
• pp.20.2-20.2
• /
• 2005

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.30 no.6 s.249
• /
• pp.514-522
• /
• 2006

This study has been performed to predict the transient thermal behavior of the plate in indirectly-fired continuous heat treatment furnace. The temperature profiles in the plate are determined solving the transient one-dimensional heat conduction equations. To verify the validity of the present numerical results, the present results obtained from the transient analysis are compared with those of experiments. Extensive parametric investigations are performed to examine the effects of the emissivities of the plate and refractory, plate thickness and velocity, as well as the gas temperature, on the thermal behavior of the plate.

• Journal of the Korea Institute of Building Construction
• /
• v.18 no.5
• /
• pp.463-469
• /
• 2018

A currently used roof green system with multi layers has a low constructability. Therefore a new integrated waterproof & root barrier sheet and roof green box unit system was developed using steel plate fixture and cone type fixture by electromagnetic induction heating method. This study was proceeded to evaluate adhesion performance of two types of fixtures on Engineering PE, TPO, PVC sheet in a normal condition, repeated heating and cooling condition. As a result, adhesion load on Engineering PE sheet showed the highest value. The adhesion loads of steel plate fixture showed higher value as heating temperature was getting higher. However adhesion loads of cone type fixture showed opposite tendency. Regarding to the test conditions, test results of normal condition, repeated heating and cooling condition showed same value. The cone type fixture using butyl tape showed 7 times lower adhesion load than that of cone type fixture using electromagnetic heating and 28% lower adhesion load in a repeated heating and cooling condition than a usual condition.

• The Korean Journal of Food And Nutrition
• /
• v.30 no.3
• /
• pp.464-472
• /
• 2017

The qualities of rice cooked on heat plate, induction heat and heat plate with pressure, were investigated. The weight, volume, water soluble index (WSI), hydration by SEM (Scanning Electron Microscope), and gelatinization by DSC (Differential Scanning Calorimetry), as well as the consumer acceptability of cooked rice were analyzed. The weight, volume and WSI of rice cooked on heat plate with pressure were higher than those of rice cooked on heat plate and induction heat. The rice cooked on heat plate with pressure also showed higher degree of hydration and gelatinization, and lower degree of enthalpy of gelatinization than the rice cooked on heat plate and induction heat for 5~15 min. The consumer acceptability revealed that the odor, appearance, taste, texture and overall acceptance of rice cooked on induction heat were better than those of rice cooked on heat plate and heat plate with pressure. During storage in a cooker for 0~12 h, there was a decrease in the consumer acceptability of cooked rice. Overall results indicate that the qualities of rice cooked on induction heat and heat plate with pressure were higher than those of rice cooked on heat plate.

• Journal of Advanced Marine Engineering and Technology
• /
• v.34 no.5
• /
• pp.617-624
• /
• 2010

Line heating is a manufacture method, which was widely used to machining a curved surface in the ship construction. The qualities using by line heating are very difference compare to the proficiency level of the engineer. So it's mainly depend on the automation equipment instead of the proficiency level engineer. In this study, it would be investigate the temperature distribution of the heating plate, which was used by the automation equipment according to line heating. The main factors are the moving velocity of the heating source, strength and the heating method separately, in temperature distribution while line heating. In this paper, it was investigated the temperature change with the vary of each three variables. The numerical result showed that peak temperature decrease if the moving velocity of the heating source increased. It can also calculate the change quantitatively that the peak temperature and temperature distribution changed linearly with the vary of the heating source.

• The Transactions of the Korean Institute of Electrical Engineers P
• /
• v.57 no.4
• /
• pp.408-411
• /
• 2008

As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. For this, it adheres closely to the substrate, in which the photosensitive film is coated and the heating plate layer, adhering closely to the floor side of a substrate the mica layer which adheres closely to the floor side of the upper heating plate layer in order to minimize an insulation and heat loss, and the lower part of the mica layer and it is comprised of the floor plate layer. The heating plate layer forms the continued groove portion over the floor side whole. The sheath heater for heating a substrate is inserted with the groove portion and the heating plate layer is comprised. It is confirmed that by using the new substrate heating structure, the temperature change of the heating plate against the time is observed. Then, there is the electric power saving effect of about 40% in comparison with the existing method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.04a
• /
• pp.55-56
• /
• 2009

A light guiding plate (LGP) with nanometer-sized patterns was fabricated by injection molding method which employed electrically healed mold and the transcription of injection-molded parts was investigated. A Ni stamper was fabricated using MEMS technology. The Ni stamper was then installed in a movable heated core which is a key part of the mold. Using this mold, injection-molded plastic LGP parts were manufactured at different mold temperatures and the effect of the temperature on the transcription of the parts was investigated.

• Journal of computational fluids engineering
• /
• v.21 no.2
• /
• pp.90-98
• /
• 2016

A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

• Current Photovoltaic Research
• /
• v.4 no.2
• /
• pp.59-63
• /
• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.