• Journal of the Korean Society for Heat Treatment
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• v.14 no.4
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• pp.228-234
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• 2001

The present study was an attempt for systematic data conversion between FDM and FEM in order to evaluate the thermal stress distribution during quenching process. It has been generally recognized that FDM is efficient in flow and temperature analysis and FEM in that of stress. But it induced difficulty and tedious work in analysis that one uses both FDM and FEM to take their advantages because of the discrepancy of nodes between analysis tools. So we proposed field data conversion procedure from FDM to FEM in 3-dimensional space, then applied this procedure to analysis of quenching process. The simulation procedure calculates the distributions of temperature and microstructure using FDM and microstructure evolution equations of diffusion and diffusionless transformation. FEM was used for predicting the distributions of thermal stress. The present numerical code includes coupled temperaturephase transformation kinetics and temperature-microstructure dependent material properties. Calculated results were compared with previous experimental data to verify the method, which showed good agreements.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.143-148
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• 2008

In order to produce high-quality optical components, aspheric lenses have been widely applied in recent years. An aspheric lens consists of aspheric surfaces instead of spherical ones, which causes difficulty in the design process as well as the manufacturing procedure. Although injection molding is widely used to fabricate optical lenses owing to its high productivity, there remains lots of difficulty to determine appropriate mold design factors and injection molding parameters. In the injection molding fields, computer simulation has been effectively applied to analyze processes based on the shell analysis so far. Considering the geometry of optical lenses, a full-3d simulation based on solid elements has been reported as a reliable approach. The present work covers three-dimensional injection molding simulation and relevant deformation analysis of an injection molded plastic lens based on 3d solid elements. Numerical analyses have been applied to the injection molding processes of three aspheric lenses for an image sensing module of a mobile phone. The reliability of the proposed approach has been verified in comparison with the experimental results.

• Applied Microscopy
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• v.46 no.1
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• pp.45-50
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• 2016

Iron containing a high amount of chromium is known to be inferior to ductility due to ${\sigma}$ phase formation so that it is generally difficult to apply the plastic deformation process although the alloy possesses a superior characteristics of an excellent corrosion resistance. In this study, Fe-50mass%Cr alloy was melted using high purity powder and the deformation behavior has been investigated by cold rolling and tensile test. The tensile test yielded that the alloy revealed a serration at an early stage of tensile deformation and then the serrated flow vanished to change to a normal work hardening flow at the later stage. The former was governed by twin formation process, the latter by dislocation multiplication one, bringing about a high ductility of 20% or over. The reduction ratio in cold rolling was attained as high as 90%, thus the high corrosion-resistant alloy is able to possess a high ductility.

• Journal of Surface Science and Engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.609-613
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• 2005

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. In this paper we will outline our progress towards developing such a low power consumption active-matrix flexible OLED ($FOLED^{TM}$) display. Our work in this area is focused on three critical enabling technologies. The first is the development of a high efficiency long-lived phosphorescent OLED ($PHOLED{TM}$) device technology, which has now proven itself to be capable of meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active matrix backplanes, and for this our team are employing poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing. We also present progress in operational lifetime of encapsulated T-PHOLED pixels on planarized metal foil and discuss PHOLED encapsulation strategy.

• Advances in Computational Design
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• v.1 no.2
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• pp.139-154
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• 2016

The usage of sandwich structure is extensively increasing in lightweight protective structures due to its low density and other useful properties. Sandwich panels made of metal sheets with unfilled cellular cores are found to exhibit lower deflections by comparing to an equivalent monolithic plate of same metal and similar mass per unit density. However, the process of localized impact on solid structures involving plastic deformation, high strain rates, temperature effect, material erosion, etc. does not hold effectively as that of monolithic plate. In present work, the applications of the sandwich plate with corrugated core have been extended to develop optimized lightweight armour using foam as medium of its core by explicit finite element analysis (FEA). The mechanisms of hardened steel projectile penetration of aluminum corrugated sandwich panels filled with foams have been numerically investigated by finite element analysis (FEA). A comparative study is done for the triangular corrugated sandwich plate filled with polymeric foam and metallic foam with different densities in order to achieve the optimum penetration resistance to ballistic impact. Corrugated sandwich plates filled with metallic foams are found to be superior when compared to the polymeric one. The optimized results are then compared with that of equivalent solid and unfilled cores structure to observe the effectiveness of foam-filled corrugated sandwich plate which provides an effective resistance to ballistic response. The novel structure can be the alternative to solid aluminum plate in the applications of light weight protection system.

• Corrosion Science and Technology
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• v.11 no.4
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• pp.151-156
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• 2012

The cavity formed by the ultrasonic generation in the fluid with the application of water cavitation peening collides into the metal surface. At this time, the surface modification effect such as the work hardening presents by the compressive residual stress formed due to the localized plastic deformation. In this investigation, the water cavitation peening technology in the distilled water with the lapse of time was applied to 5052-O aluminum alloy for aluminum ship of a high value. So, the optimum water cavitation peening time on the effect for surface hardening and anti-corrosion property was investigated. Consequently, the water cavitatin peening time on excellent hardness and corrosion resistance characteristic presented 3.5 min. and 5.0 min, respectively. The surface hardness in the optimum water cavitation peening time was improved approximately 45% compared to the non-WCPed condition. In addition, corrosion current density was decreased.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.370-376
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• 2005

Magnesium alloys are becoming important material for light weight car body, due to their low specific density but high specific strength. However they have a poor weldability, caused high oxidization tendency and low vapor temperature. In this study, the welding performance of magnesium alloys was investigated for automobile application. The materials were rolled magnesium alloy sheet contains Al and Zn such as AZ3l , AZ6l and AZ9l. Three types of welding process were studied, that were GTAW, Laser beam welding and FSW. To evaluate the weldability, we examined the appearance of welding bead. Also we checked bead shape and internal defects such as crack and porosity on cross section of welding bead. The mechanical property was measured for welded specimen by tensile test. For determination of the strength change by welding process, the hardness profile across the welding center was measured. For the results, the tensile properties of welded specimen were decreased obviously on all welding process. For the fusion welding process such as GTAW and laser beam welding, the surface of the welding bead was covered with oxidized magnesium dust but it was removed by simple cleaning work as wipe-out with tissue. Also under cut, that caused vaporization of base metal was occurred. for the friction stir welding, there was no oxidation, under-cut or internal defects. However it had poor weld performance, the reason was cleavage fracture occurred at plastic deformation zone. For welding of magnesium alloy, the laser beam welding process was recommended.

• Journal of Powder Materials
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• v.19 no.3
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• pp.204-209
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• 2012

In this work, powder metallurgy and severe plastic deformation by high-pressure torsion (HPT) approaches were combined to achieve both full density and grain refinement at the same time. Pure Cu powders were mixed with 5 and 10 vol% diamonds and consolidated into disc-shaped samples at room temperature by HPT at 1.25 GPa and 1 turn, resulting in ultrafine grained metallic matrices embedded with diamonds. Neither heating nor additional sintering was required with the HPT process so that in situ consolidation was successfully achieved at ambient temperature. Significantly refined grain structures of Cu metallic matrices with increasing diamond volume fractions were observed by electron backscatter diffraction (EBSD), which enhanced the microhardness of the Cu-diamond composites.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.