• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.311-311
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• 2011

$TiN{\times}$박막은 우수한 내마모성 및 내부식성, 높은 경도 그리고 열적 안정성 등으로 인하여, 절삭공구 및 기계적 부품의 하드코팅, 2차 연료 전지용 확산방지막의 코팅재료로서 광범위하게 사용되어지고 있다. 일반적으로 $TiN{\times}$ 박막은 화학 기상 증착법(CVD)을 이용하였으나, 최근에는 대면적에 균일한 코팅이 가능하고 기판과 박막상의 부착력이 우수하며, 프로세스를 제어하기 쉬운 물리적 기상 증착법(PVD)의 스퍼터링법에 대한 관심이 고조되고 있다. 그러나 스퍼터링법으로 증착된 $TiN{\times}$ 박막의 물성은 주상구조와 국부적 표면결함을 포함하는 박막의 미세구조에 의존하기 때문에 주상구조 사이에 존재하는 Void 와 Pinhole 그리고 crack들이 원인으로 작용하여, 내부식성 및 기계적 특성이 급속도로 저하되는 단점이 있다. 이러한 단점을 보완하기 위해서, 본 연구에서는 기판온도를(RT, $200^{\circ}C$, $400^{\circ}C$)증가시켜 실험 하였다. 이는 온도증가에 따른 박막의 치밀화가 이루어지고 결함이 감소하여 내부식성 특성향상이 기대되어진다. 또한 플라즈마 밀도를 높이기 위해서, 기존 DC 마그네트론 스퍼터링법에 전자기장을 추가로 인가하였다. 이는 플라즈마 밀도증가에 따른 고반응성의 질소 래디컬의 생성율 증가에 기인하여 박막 형성시 질화반응을 촉진시킴으로써 박막의 치밀화 및 내부식성 특성향상이 기대되어진다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.5
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• pp.442-449
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• 2006

Electrical, optical, and structural properties of indium zinc oxide (IZO) films grown by a box cathode sputtering (BCS) were investigated as a function of oxygen flow ratio. A sheet resistance of $42.6{\Omega}/{\Box}$, average transmittance above 88% in visible range, and root mean spare roughness of $2.7{\AA}$ were obtained even in the IZO layers grown at room temperature. In addition, it is shown that electrical characteristics of the top-emitting organic light emitting diodes (TOLEDs) with the BCS grown-IZO top cathode layer is better than that of TOLEDs with DC sputter grown IZO top cathode, due to absence of plasma damage effect. Furthermore the effects of oxygen flow ratio in IZO films are investigated, based on x-ray photoelectron spectroscopy (XPS), ultra violet/visible (UV/VIS) spectro-meter, scanning electron microscopy (SEM), and atomic force microscopy (AFM) analysis results.

• Journal of Magnetics
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• v.6 no.3
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• pp.90-93
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• 2001

Co/$Al_O_3$/NiFe and CO/$Al_O_3$/Co tunnel junctions were fabricated by a radio frequency magnetron sputtering at room temperature with hard mask on glass and $4^{\circ}$ tilt cut Si (111) substrates. The barrier layer was formed through two steps. After the Al layer was deposited, it was oxidized in the chamber of a reactive ion etching system (RIE) with $O_2$plasma at various conditions. The dependence of the TMR value and junction resistance on the thickness of Al layer (before oxidation) and oxidation parameters were investigated. Magnetoresistance value of 7% at room temperature was obtained by optimizing the Al layer thickness and oxidation conditions. Circular shape junctions on $4^{\circ}$tilt cut Si (111) substrate showed 4% magnetoresistance. Photovoltaic energy conversion effect was observed with the cross-strip geometry junctions on Si substrate.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.77-77
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• 2015

Metallic glass alloys having dense packing structure have short range ordered structure with long range homogeneity. Therefore, they can provide complete corrosion protection and unique electrical properties. Recently, metallic glass thin films have received much attention to extend its application fields combining with PVC coating technologies. The metallic glass thin films can change the surface properties of the conventional bulk materials which need anticorrosion properties. However, multi-component alloying targets are required to fabricate the metallic glass thin films because metallic glass alloys contain more than three elements. Recently, many researchers have been reported the properties of the metallic glass thin films synthesized with multi-cathode systems or amorphous target. But, it is difficult to fabricate the large sized sputtering targets for mass production equipment with high toughness and thermal stability. In this study, newly developed sputtering target with glass forming ability and the properties of the metallic glass thin films will be introduced with respect to the various application fields such as bipolar plate in PEM fuel cell and decorative coatings for electric device and construction fields.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.11
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• pp.4711-4717
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• 2011

Formation of TiN films by PVD method and the DC and RF sputtering deposition method can be applied, the injected gas to generate plasma ionization rate of the film forming speed is slow away, anything to increase the adhesion between films limitations have. To improve this, to investigate the deposition and ion beam evaporation simultaneously IBAD(Ion beam assisted deposition) when used, Ion beam surface coating material prior to the survey because the surface cleaning effect of a large, high film adhesion can be obtained. In addition, the high vacuum and low temperature, high purity thin film of uniform thickness in the benefits is.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.250-255
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• 2011

The basic properties and electrical characteristics of sputtering films deposited with a commercial cast target and Spark Plasma Sintering (SPS) were compared and analyzed. From the results, the Cu film prepared heating $60^{\circ}C/min$ (SPS process) showed a similar specific resistance compared to the commercial cast Cu film. Also, auording to the results of XRD, SIMS, and TEM. There was not much difference in the crystal structure and impurities between the two films. Consequently, the SPS Cu target was found to have quite similar properties with the commercial one and it is expected to be applied in futare research to the metal wiring material for semiconductor/display devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.283.2-283.2
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• 2016

최근 ZnO는 무독성, 저가격, 수소 플라즈마에 대한 내구성 및 열적 안정성 등의 활발히 연구되고 있으며, III족 원소(Al, Ga, In) 불순물을 도핑하여 전기적 성질의 열적 불안정성을 해결하고 전기적 성질을 향상 시키고 또한 밴드갭 에너지가 3.3 eV 이상으로 증가하여 가시광선 영역에서 광투과율이 높은 투명도 전성 재료를 제공할 수 있다. 본 연구에서는 RF Magnetron Sputtering을 이용하여 내열성과 광학적 측면에서 우수한 성능을 가지는 PES 기판에 표면 에너지를 높이고 치밀한 구조의 박막을 증착하기 위해서 $O_2$ 플라즈마 처리를 하여 ZnO계 투명 전도막을 제작함으로써 투명전극에서 요구하는 $10^{-3}{\Omega}{\cdot}cm$ 이하의 낮은 비저항과 80% 이상의 광투과율을 가지는 방안에 대하여 연구하였다. PES 기판 위에 고밀도 $O_2$ 플라즈마를 이용하여 전 처리를 실시한 후 4인치의 Al-doped ZnO(ZnO 98 wt% : $Al_2O_3$ 2 wt%), AZO의 타겟을 이용하여 상온에서 RF Magnetron Sputtering 법으로 AZO 박막을 증착하였다. PES 기판상의 AZO 박막 두께가(100~400nm) 증가함에 따라 캐리어 농도와 홀 이동도가 점차 증가하는 경향을 보였다. 이는 박막 두께가 증가할수록 면저항과 비저항은 감소하며 결정립 크기가 커지고 결정입계에서 산란이 줄어들기 때문에 전기적 특성이 개선된 것으로 판단된다. 고밀도 $O_2$ 플라즈마 표면처리 시간이 증가함에 따라 플라스틱 기판의 결합에너지와 부착력이 증가하여 AZO 박막의 결정립 크기를 증가시키며, 접촉각은 감소하였다. 또한 급속열처리 온도가 증가함에 따라 전기적 특성과 광학적 특성이 향상됨을 확인할 수 있었다. 제작된 AZO 박막은 급속열처리 시간 10분에서 온도 $200^{\circ}C$일 때, 캐리어 농도 $2.32{\times}10^{21}cm^{-3}$, 홀 이동도 $4.3cm^{-2}/V$로 가장 높은 것을 확인할 수 있었고, 가장 낮은 비저항 $1.07{\times}10^{-3}{\Omega}{\cdot}cm$과 가시광 영역(300 nm ~ 1100 nm)에서의 AZO 박막의 광 투과율은 약 86%를 얻을 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

• Journal of the Korean Society for Heat Treatment
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• v.27 no.1
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• pp.10-14
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• 2014

Niobium nitride coatings have many potential thin film applications due to their chemical inertness, good mechanical properties, temperature stability and superconducting properties. In this study, $NbN_x$ coatings were prepared by inductively coupled plasma (ICP) assisted DC magnetron sputtering method on the surface of AISI 304 austenitic stainless steels. Effects of target power were studied on mechanical and chemical properties of the coatings. The coating structure was analyzed by X-ray diffraction (XRD) and field emission scanning electron microscopy (FESEM). The coating hardness was measured by micro-knoop hardness tester. The coating thickness was measured using a 3D profiler and wear characteristics were estimated using a ball-on-disk wear tester. The thickness of the $NbN_x$ coatings increased linearly from 300 nm to 2000 nm as the Nb target power increased, and it showed over $HK_{0.005}$ 4000 hardness above Nb target power of 300 W. Hexagonal ${\delta}^{\prime}$-NbN phase and cubic ${\delta}$-NbN phase were observed in the coating films and the hardness of the NbNx coatings was higher when these two peaks were mixed. The corrosion resistance increased with the increase of the Nb target power.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.39-47
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• 2003

Cr thin films were deposited on photosensitive polyimide substrates by RF bias sputtering and DC sputtering and the interfaces between Cr thin film and polyimide were observed using TEM. When the polyimide surface was in-situ RF plasma cleaned at the RF power density of 0.13-2.12 $W/cm^2$, increasing of RF power density changed the morphology of polyimide surfaces from round dig to sharp shape, and surface roughness increased by anisotropic etching. The intermixed layer-like interfaces between Cr and polyimide were observed in the RF bias sputtered specimens. This interface seems to be formed due to the RF cleaning effect; the polyimide surface was RF plasma cleaned while RF power was increased to the setting point before Cr deposition.