• Proceedings of the Korean Vacuum Society Conference
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• 2006.02a
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• pp.187-187
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• 2006

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.95-95
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• 2003

• Journal of Welding and Joining
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• v.35 no.2
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• pp.30-34
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• 2017

The trend of the plasma cutting and laser cutting technology of metal alloys including high strength steel, aluminum alloys for the welding structures has been studied. The high-precision plasma systems offer a denser, higher energy arc that in effect produces a sharper cutting tool and high quality cutting products. The high-quality fiber laser systems with compact design and easy set-up make it ideal for cutting in the pipeline or steel structre manufacturing. This paper covers the scientometric analysis of the high efficient cutting technology which are based on the published research works in the 'plasma and laser', and 'cutting technology' obtained from Web of Science, and deals with the details of the background data of the plasma cutting and laser cutting technology.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.137-137
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• 2008

This paper presents the ability of plasma electrolytic polishing technology to polish surface of stainless steel materials. The results show that the surface of its can be polished clearly using potentiostatic regimes in various concentration of $(NH_4)_2SO_4$ solution that had been warmed to a certain initial temperature. The equipment and deposition produces for polishing process are described and the effect of processing parameters on the characterizations polishedsamples has been has been investigated.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.4
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• pp.223-227
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• 2009

The feasibility of plasma electrolytic polishing technology of stainless steel was examined. The results show that austenitic stainless steel can be polished clearly using potentiostatic regimes with various concentration of ammonium sulfate ($(NH_4)_2SO_4$) solution above certain initial temperature. The equipment and deposition produces for polishing process are described and the effect of processing parameters on the characterizations polished-samples has been investigated.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.161-161
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• 1999

In the field of material science, the interests and efforts to modify the surface of materials in agreement with the need of usage have been extensively increasing. he modification to improve the wettability of surface is very important is terms of adhesion, printing, etc. It is very difficult to modify metal surface into hydrophilic one. therefore, surfactant coating has been generally used in many cases. However, surfactant has disadvantages such as environmental problem, soluble in water. in this study, hydrophilic polymer films as alternative of surfactant were deposited on metal substrate by DC plasma polymerization. Hydrophilic polymer films deposited by DC plasma show many merits such as good wettability, stone adhesion to substrate, high resistance to most chemicals. Monomer gas and reactive gas were used as source plasma polymerization. Plasma polymerized films were fabricated with process parameters of deposition time, ratio of gas mixture, current, pressure, etc. Effects of these variables on wettability of plasma polymer films will be discussed. With XPS and FT-IR analyses of plasma polymeric films, the relation between wettability and chemical state of polymer films by DC plasma was investigated.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.3
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• pp.122-128
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• 2009

DBD(Dielectric Barrier Discharges) plasma is often used to clean the surface of semiconductor. The cleaning performance is affected mainly by plasma density and duration time. In this study, the plasma density is predicted by coupled simulation of flow, chemistry mixing and reaction, plasma, and electric field. 13.56 MHz of RF source is used to generate plasma. The effect of dielectric thickness, gap distance, and flow velocity on plasma density is investigated. It is shown that the plasma density increases as the dielectric thickness decreases and the gap distance increases.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.74-78
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• 2003

The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits (IC) and the increased use of polymers in electronic packaging. Recently, plasma-polymerized cyclohexane films were considered as a possible candidate for a interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. In this paper the protective ability of above films as a function of deposition temperature and RF power in an 3.5 wt.% NaCl solution were examined by polarization measurement. The film was characterized by FTIR spectroscopy and contact angle measurement. The protective efficiency of the film increased with increasing deposition temperature and RF power, which induced the higher degree of cross-linking and hydrophobicity of the films.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.268-268
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• 2012

Atmospheric pressure microwave induced plasmas are used to excite and ionize chemical species for elemental analysis, for plasma reforming, and for plasma surface treatment. Microwave plasma differs significantly from other plasmas and has several interesting properties. For example, the electron density is higher in microwave plasma than in radio-frequency (RF) or direct current (DC) plasma. Several types of radical species with high density are generated under high electron density, so the reactivity of microwave plasma is expected to be very high [1]. Therefore, useful applications of atmospheric pressure microwave plasmas are expected. The surface characteristics of SUS304 stainless steel are investigated before and after surface modification by microwave plasma under atmospheric pressure conditions. The plasma device was operated by power sources with microwave frequency. We used a device based on a coaxial transmission line resonator (CTLR). The atmospheric pressure plasma jet (APPJ) in the case of microwave frequency (880 MHz) used Ar as plasma gas [2]. Typical microwave Pw was 3-10 W. To determine the optimal processing conditions, the surface treatment experiments were performed using various values of Pw (3-10 W), treatment time (5-120 s), and ratios of mixture gas (hydrogen peroxide). Torch-to-sample distance was fixed at the plasma edge point. Plasma treatment of a stainless steel plate significantly affected the wettability, contact angle (CA), and free energy (mJ/$m^2$) of the SUS304 surface. CA and ${\gamma}$ were analyzed. The optimal surface modification parameters to modify were a power of 10 W, a treatment time of 45 s, and a hydrogen peroxide content of 0.6 wt% [3]. Under these processing conditions, a CA of just $9.8^{\circ}$ was obtained. As CA decreased, wettability increased; i.e. the surface changed from hydrophobic to hydrophilic. From these results, 10 W power and 45 s treatment time are the best values to minimize CA and maximize ${\gamma}$.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.2
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• pp.119-125
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• 2005